MSC8157SVT1000A vs MSC8144ETVT800A Comparison
Detailed side-by-side comparison of MSC8157SVT1000A by NXP Semiconductors and MSC8144ETVT800A by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoleteNXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A ObsoleteSpecification Comparison
| Parameter | MSC8157SVT1000A | MSC8144ETVT800A |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | DSP | DSP |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $198.40 | $195.50 |
| Product Type | Multi-core Digital Signal Processor (DSP SoC) | — |
| Architecture | StarCore SC3850, six cores | — |
| Data Bus Width | 64-bit | — |
| Maximum Clock Speed | 1 GHz | — |
| Performance | 1000 MIPS per core, up to 6000 MIPS aggregate | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| L2 Cache (unified) | Shared KB-scale unified L2 | — |
| Supply Voltage | 1 V (core) + I/O rails | — |
| Package Type | FCBGA-783 (Flip-Chip BGA) | — |
| Package Size | 29 mm x 29 mm | — |
| Pin Count | 783 | — |
| Operating Temperature | -40C to +105C | -40C to +105C |
| Lead Free | Yes | — |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status not in web data] |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| Memory Interface | External DDR2/DDR3 SDRAM controller | — |
| Serial Interfaces | SerDes, Ethernet MAC, I2C, UART | — |
| Core Architecture | — | SC3400 StarCore (4-core) |
| Number of Cores | — | 4 |
| Core Clock Rate | — | 800 MHz |
| On-Chip RAM | — | 10.5 MB |
| Non-Volatile Memory | — | External (NOR/NAND boot ROM) |
| Core Voltage | — | 1.00 V |
| I/O Voltage | — | 3.30 V |
| Operating Temperature Grade | — | Extended Industrial |
| Package | — | 783-FCBGA (29x29 mm) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 783 |
| Package Code | — | BGA / FCBGA |
| Package Shape | — | Square |
| Interfaces | — | Ethernet (UTOPIA), I2C, SPI, TDM, UART |
| Technology | — | High-performance multi-core DSP, SIMD |