MSC8157SVT1000A vs MSC8144ETVT800A 비교
다음의 상세 나란히 비교: MSC8157SVT1000A 제조: NXP Semiconductors 및 MSC8144ETVT800A 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoleteNXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A Obsolete사양 비교
| 파라미터 | MSC8157SVT1000A | MSC8144ETVT800A |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | DSP | DSP |
| 수명 주기 상태 | Obsolete | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $198.40 | $195.50 |
| Product Type | Multi-core Digital Signal Processor (DSP SoC) | — |
| Architecture | StarCore SC3850, six cores | — |
| 데이터 버스 폭 | 64-bit | — |
| Maximum Clock Speed | 1 GHz | — |
| Performance | 1000 MIPS per core, up to 6000 MIPS aggregate | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| L2 Cache (unified) | Shared KB-scale unified L2 | — |
| 공급 전압 | 1 V (core) + I/O rails | — |
| Package Type | FCBGA-783 (Flip-Chip BGA) | — |
| Package Size | 29 mm x 29 mm | — |
| 핀 수 | 783 | — |
| 동작 온도 | -40C to +105C | -40C to +105C |
| Lead Free | Yes | — |
| 실장 유형 | Surface Mount | Surface Mount |
| RoHS 상태 | Compliant | [DATA_NEEDED: RoHS status not in web data] |
| MSL 레벨 | [DATA_NEEDED: MSL rating] | — |
| Memory Interface | External DDR2/DDR3 SDRAM controller | — |
| Serial Interfaces | SerDes, Ethernet MAC, I2C, UART | — |
| Core Architecture | — | SC3400 StarCore (4-core) |
| Number of Cores | — | 4 |
| Core Clock Rate | — | 800 MHz |
| On-Chip RAM | — | 10.5 MB |
| Non-Volatile Memory | — | External (NOR/NAND boot ROM) |
| Core Voltage | — | 1.00 V |
| I/O Voltage | — | 3.30 V |
| Operating Temperature Grade | — | Extended Industrial |
| 패키지 | — | 783-FCBGA (29x29 mm) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 783 |
| Package Code | — | BGA / FCBGA |
| Package Shape | — | Square |
| Interfaces | — | Ethernet (UTOPIA), I2C, SPI, TDM, UART |
| Technology | — | High-performance multi-core DSP, SIMD |