MT40A512M16JY-075E vs H5AN8G6NDJR-XNC Comparison

Detailed side-by-side comparison of MT40A512M16JY-075E by Micron Technology and H5AN8G6NDJR-XNC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
MT40A512M16JY-075E MT40A512M16JY-075E - 8Gb DDR4 SDRAM 512Mx16 | Micron

MT40A512M16JY-075E - 8Gb DDR4 SDRAM 512Mx16 | Micron

MT40A512M16JY-075E ✓ Active
SK hynix
H5AN8G6NDJR-XNC H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC ✓ Active

Specification Comparison

Parameter MT40A512M16JY-075E H5AN8G6NDJR-XNC
Brand Micron Technology SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Unit Price (USD) — $55.68
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 8 Gbit 8 Gb
Organization 512M x 16 —
Clock Frequency 1.33 GHz —
Data Rate 2666 MT/s 3200 Mbps
Supply Voltage (VDD/VDDQ) 1.14V to 1.26V —
VPP Voltage 2.5V (-125mV, +250mV) —
Interface Parallel —
Package 96-FBGA (8x14) FBGA-96 (13x7.5 mm)
Mounting Type Surface Mount —
Operating Temperature Range 0°C to +95°C (TC) —
Refresh Time 8192 cycles; 64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C —
RoHS Status Compliant —
Features Auto precharge, data mask, dynamic on-chip termination, write leveling, auto self-refresh, CRC —
I/O Type 1.2V pseudo open-drain —
Memory Organization — 512M x16
Supply Voltage (VDD) — 1.2 V (max 1.26 V)
Number of Terminals — 96
Maximum Operating Temperature — 85 °C
Input/Output Type — COMMON
RoHS — Compliant
Lead-Free — Yes
Halogen Free — Yes
Auto Self-Refresh — Yes
Auto Precharge — Yes
Data Mask — Yes
Dynamic On-Chip Termination — Yes
ZQ Calibration — Yes
CRC Function — Yes
Write Leveling — Yes
Asynchronous Reset — Yes

Datasheets & Resources

Browse All Products Create BOM Request Quote