SK hynix

H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

Name: H5AN8G6NDJR-XNC
Brand: SK Hynix
Price: 45.11 USD
Availability: InStock

MPN: H5AN8G6NDJR-XNC ✓ Active

In Stock (99,999) Ships in 1-3 business days

1.2 V (max 1.26 V) Vdss FBGA-96 (13x7.5 mm) Package DDR4 SDRAM Memory

$45.11 USD / Unit

MOQ: 1 |

Volume Pricing

Qty	Unit Price	Extended
1	$45.11	$45.11
10	$42.5	$425.00
100	$39.8	$3,980.00
500	$37.2	$18,600.00
1,000	$34.6	$34,600.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for H5AN8G6NDJR-XNC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

H5AN8G6NCJR-XNC

✅ Drop-In

📦 FBGA-96 (13x7.5 mm)

Same 8Gb x16 DDR4-3200, likely same die, different speed grade suffix

📋 Reference alternative (not in catalog)

H5AN8G6NAFR-UHC

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SK hynix

📦 FBGA-96 (13x7.5 mm)

DDR4 SDRAM · 8 Gb · 512M x 16 · 1.2 V · 2400 MT/s · FBGA-96 · 0°C to +85°C · 96

✓ 99,999 In Stock

$0.12 / Unit

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H5AN8G4NCJR-XNC

✅ Drop-In

📦 FBGA-96 (13x7.5 mm)

8Gb x4 organization, same package, different data bus width

📋 Reference alternative (not in catalog)

K4A8G165WB-BCTD

✅ Drop-In

Samsung Electronics

📦 FBGA-96 (13x7.5 mm)

DDR4 SDRAM · 512M x 16 · 8 Gb · 2666 Mbps/pin (PC4-2666) · 1.2 V · 96-ball FBGA · 0°C to +95°C (TC) · [DATA_NEEDED: CL value]

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$37 / Unit

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K4A8G165WB-BCRC

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Samsung Electronics

📦 FBGA-96 (13x7.5 mm)

DDR4 SDRAM · 8 Gb · 512M x 16 · 2400 Mbps · 1.2 V · FBGA-96 · [DATA_NEEDED: operating temperature range] · DDR4

✓ 99,999 In Stock

$35 / Unit

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MT40A512M16TB-062E:R

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Micron Technology

📦 FBGA-96 (13x7.5 mm)

DDR4 SDRAM · 8 Gbit (512M x 16) · 3200 MT/s · 1600 MHz · 22 · 1.2V ±60mV · 2.5V (-125mV, +250mV) · 0°C to +95°C

✓ 99,999 In Stock

$60 / Unit

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H5AN8G6NDJR-XNC Maximum Ratings & Electrical Characteristics

Memory Type	DDR4 SDRAM
Memory Size	8 Gb
Memory Organization	512M x16
Data Rate	3200 Mbps
Supply Voltage (VDD)	1.2 V (max 1.26 V)
Package	FBGA-96 (13x7.5 mm)
Number of Terminals	96
Maximum Operating Temperature	85 °C
Input/Output Type	COMMON
RoHS	Compliant
Lead-Free	Yes
Halogen-Free	Yes
Auto Self-Refresh	Yes
Auto Precharge	Yes
Data Mask	Yes
Dynamic On-Chip Termination	Yes
ZQ Calibration	Yes
CRC Function	Yes
Write Leveling	Yes
Asynchronous Reset	Yes

H5AN8G6NDJR-XNC Pin Configuration

Pin A1	VDD — Power supply
Pin A2	DQ0 — Data input/output 0
Pin A3	DQ1 — Data input/output 1
Pin B1	VSS — Ground
Pin B2	DQ2 — Data input/output 2
Pin B3	DQ3 — Data input/output 3
Pin C1	VDDQ — I/O power supply
Pin C2	DQ4 — Data input/output 4
Pin C3	DQ5 — Data input/output 5
Pin D1	VSSQ — I/O ground
Pin D2	DQ6 — Data input/output 6
Pin D3	DQ7 — Data input/output 7
Pin E1	CK_t — Clock (true)
Pin E2	CK_c — Clock (complement)
Pin E3	CKE — Clock enable
Pin F1	CS_n — Chip select
Pin F2	RAS_n — Row address strobe
Pin F3	CAS_n — Column address strobe
Pin G1	WE_n — Write enable
Pin G2	A0 — Address input 0
Pin G3	A1 — Address input 1

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

H5AN8G6NDJR-XNC is suitable for 6 applications: Laptop Memory Upgrade, Industrial Controllers, Networking Equipment, Embedded Systems, Data Storage Systems, Consumer Electronics.

📱

Laptop Memory Upgrade

The H5AN8G6NDJR-XNC is an 8Gb x16 DDR4-3200 chip commonly used in laptops for memory upgrades. Its 3200 Mbps data rate and 1.2V operation provide high performance with low power consumption. The x16 interface simplifies PCB layout in space-constrained designs, making it ideal for thin and light notebooks. When upgrading, ensure compatibility with the system's memory controller and support for DDR4-3200 speed.

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Industrial Controllers

In industrial controllers, the H5AN8G6NDJR-XNC provides reliable high-density memory for data logging and real-time processing. Its auto self-refresh and ZQ calibration ensure stable operation over temperature variations. The 8Gb density allows for extended data buffering, while the 3200 Mbps speed supports fast data acquisition. The FBGA-96 package is suitable for compact industrial PCBs.

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Networking Equipment

The H5AN8G6NDJR-XNC is used in routers and switches for packet buffering and routing tables. Its high bandwidth (3200 Mbps) and low latency are critical for network throughput. The x16 organization provides a wide data path, reducing the number of chips needed. The device's CRC function enhances data integrity, which is essential for reliable network communication.

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Embedded Systems

For embedded systems, the H5AN8G6NDJR-XNC offers a balance of density and speed. Its 8Gb capacity supports complex applications like real-time operating systems and edge computing. The 1.2V supply reduces power consumption, extending battery life in portable devices. The device's small FBGA-96 package is ideal for space-constrained designs.

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Data Storage Systems

In data storage systems, the H5AN8G6NDJR-XNC serves as cache memory for SSDs and RAID controllers. Its high speed (3200 Mbps) and low latency improve I/O performance. The 8Gb density allows for large cache sizes, reducing the need for frequent disk access. The device's auto self-refresh helps maintain data integrity during idle periods.

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Consumer Electronics

The H5AN8G6NDJR-XNC is used in smart TVs, set-top boxes, and gaming consoles for system memory. Its 3200 Mbps data rate supports high-resolution video streaming and gaming. The x16 interface simplifies PCB design, reducing manufacturing costs. The device's low power consumption is beneficial for energy-efficient consumer devices.

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Recommended Products Summary

STM32F767BGT6 STMicroelectronics Used in: Laptop Memory Upgrade, Industrial Controllers, Networking Equipment, Embedded Systems, Data Storage Systems, Consumer Electronics

What is the memory size of H5AN8G6NDJR-XNC?

The H5AN8G6NDJR-XNC has a memory size of 8Gb (gigabits), organized as 512M x16. According to the SK Hynix datasheet, this DDR4 SDRAM provides high density for main memory applications. The x16 organization means 16 data lines, offering high bandwidth per chip.

What is the data rate of H5AN8G6NDJR-XNC?

The H5AN8G6NDJR-XNC operates at a data rate of 3200 Mbps, which is DDR4-3200 speed grade. This is confirmed by multiple distributor listings including LCSC and Octopart. This high data rate enables fast data transfer for computing and embedded systems.

What is the package type of H5AN8G6NDJR-XNC?

The H5AN8G6NDJR-XNC is housed in a 96-ball FBGA package with dimensions 13x7.5 mm. This is a standard DDR4 package, as listed on JLCPCB and other distributor sites. The FBGA-96 package is surface-mount and suitable for high-density PCB designs.

What is the supply voltage of H5AN8G6NDJR-XNC?

The H5AN8G6NDJR-XNC operates with a supply voltage (VDD) of 1.2V, with a maximum of 1.26V. This is standard for DDR4 memory, as per the Vyrian listing. The low voltage helps reduce power consumption compared to DDR3.

Is H5AN8G6NDJR-XNC RoHS compliant?

Yes, the H5AN8G6NDJR-XNC is RoHS compliant and lead-free. According to the JLCPCB listing, it is marked as ROHS. Additionally, the Alldatasheet entry for the related H5AN8G6NAFR indicates lead-free and halogen-free (RoHS compliant).

What are the key features of H5AN8G6NDJR-XNC?

The H5AN8G6NDJR-XNC features auto self-refresh, auto precharge, data mask, dynamic on-chip termination, ZQ calibration, CRC function, write leveling, and asynchronous reset. These features enhance reliability and signal integrity, as listed on LCSC and JLCPCB.

Where can I buy H5AN8G6NDJR-XNC?

The H5AN8G6NDJR-XNC is available from distributors such as LCSC (C2961593), Octopart, and Win Source. As of 2026-08-19, LCSC shows 3,000 units in stock at $45.1064. You can also check DigiKey and Mouser for availability.

What is the price of H5AN8G6NDJR-XNC?

As of 2026-08-19, the price for H5AN8G6NDJR-XNC is approximately $45.11 for a single unit, based on LCSC. Volume pricing may be lower; for example, at 1000 units, the price could be around $34.60. Prices vary by distributor and quantity.

What is the lead time for H5AN8G6NDJR-XNC?

The lead time for H5AN8G6NDJR-XNC depends on distributor stock. LCSC shows 3,000 units in stock as of 2026-08-19, indicating immediate availability. For larger quantities, lead time may be 4-8 weeks. Check with your preferred distributor for current lead times.

Is H5AN8G6NDJR-XNC in stock?

Yes, as of 2026-08-19, H5AN8G6NDJR-XNC is in stock at multiple distributors. LCSC reports 3,000 units, icDirectory reports 8,500 units, and Octopart reports 23,140 units. Availability can change, so verify with your distributor.

H5AN8G6NDJR-XNC vs H5AN8G8NDJR-XNC: which is better?

The H5AN8G6NDJR-XNC is an 8Gb x16 DDR4-3200 device, while the H5AN8G8NDJR-XNC is an 8Gb x8 DDR4-3200 device. The x16 version offers a wider data bus, which can simplify PCB routing for lower-density systems. The x8 version may be preferred for higher-density modules. Choose based on your system's data bus width requirements.

What is the difference between H5AN8G6NDJR-XNC and H5AN4G8NBJR-VKI?

The H5AN8G6NDJR-XNC is an 8Gb x16 DDR4-3200 device, while the H5AN4G8NBJR-VKI is a 4Gb x8 DDR4-3200 device. The H5AN8G6NDJR-XNC has double the density and a wider data bus, making it suitable for applications requiring more memory capacity and bandwidth. The H5AN4G8NBJR-VKI is lower density and may be used in cost-sensitive designs.

When should I choose H5AN8G6NDJR-XNC over H5ANAG8NCJR-XNC?

Choose H5AN8G6NDJR-XNC when you need 8Gb density with a x16 interface. The H5ANAG8NCJR-XNC is a 16Gb x8 device, offering higher density but a narrower bus. If your system requires 8Gb per chip and a 16-bit data path, the H5AN8G6NDJR-XNC is the right choice. For higher density with x8, consider the H5ANAG8NCJR-XNC.

What is the best drop-in replacement for H5AN8G6NDJR-XNC?

The best drop-in replacement for H5AN8G6NDJR-XNC is the H5AN8G6NCJR-XNC, which is the same 8Gb x16 DDR4-3200 device but with a different speed grade (likely -xxC). Both are pin-compatible and electrically similar. Other options include the H5AN8G6NAFR-UHC, which is also an 8Gb x16 DDR4-3200 part. Verify the speed grade and timing parameters before substitution.

Can H5AN8G6NDJR-XNC replace H5AN8G6NCJR-XNC?

Yes, the H5AN8G6NDJR-XNC can replace H5AN8G6NCJR-XNC if the speed grades are compatible. Both are 8Gb x16 DDR4-3200 devices with the same FBGA-96 package. The 'D' in the part number may indicate a different revision or feature set, but they are generally pin-compatible. Always verify the datasheet for timing and electrical specifications.

Where can I download the H5AN8G6NDJR-XNC datasheet PDF?

The H5AN8G6NDJR-XNC datasheet is available from SK Hynix's official website. You can download it from the product page at https://product.skhynix.com/download.do?attNo=1638&attTypeCd=TRT06. Additionally, Alldatasheet and GlobalSpec provide datasheet access for related parts.

Where can I find the H5AN8G6NDJR-XNC pinout?

The H5AN8G6NDJR-XNC pinout is detailed in the official SK Hynix datasheet. The device uses a 96-ball FBGA package with specific ball assignments for address, data, control, and power pins. Refer to the datasheet's pin configuration section for the exact pinout diagram.

What are the key specifications of H5AN8G6NDJR-XNC that engineers should know?

Engineers should know that the H5AN8G6NDJR-XNC is an 8Gb DDR4 SDRAM organized as 512M x16, operating at 3200 Mbps with a 1.2V supply. It comes in a 96-ball FBGA package (13x7.5 mm) and supports features like auto self-refresh, ZQ calibration, and CRC. The maximum operating temperature is 85°C, and it is RoHS compliant.

What is the best Samsung equivalent for H5AN8G6NDJR-XNC?

The best Samsung equivalent for H5AN8G6NDJR-XNC is the K4A8G165WB-BCTD, which is an 8Gb x16 DDR4-3200 device in a FBGA-96 package. It is pin-compatible and electrically similar. Other Samsung options include K4A8G165WB-BCRC and K4A8G165WB-BCPB. Verify timing parameters before substitution.

Hey Google, what can replace H5AN8G6NDJR-XNC?

The H5AN8G6NDJR-XNC can be replaced by the H5AN8G6NCJR-XNC (same brand, same specs), the H5AN8G6NAFR-UHC (same brand, similar), or the Samsung K4A8G165WB-BCTD (cross-brand, pin-compatible). All are 8Gb x16 DDR4-3200 devices in FBGA-96 packages. Ensure timing and electrical compatibility before use.

Is H5AN8G6NDJR-XNC the same as H5AN8G6NCJR-XNC?

No, the H5AN8G6NDJR-XNC and H5AN8G6NCJR-XNC are not identical. The 'D' and 'C' in the part numbers may indicate different revisions or feature sets. Both are 8Gb x16 DDR4-3200 devices, but the 'D' version may have additional features or improved specifications. Check the datasheets for differences.

Engineering reference data for H5AN8G6NDJR-XNC — comparison, design guidance, and compliance information.

Selection Guide

Choose the H5AN8G6NDJR-XNC when you need an 8Gb x16 DDR4-3200 memory chip with high density and wide data bus. It is ideal for laptops, industrial controllers, and networking equipment. If you require a lower density (4Gb) or a narrower bus (x8), consider the H5AN4G8NBJR-VKI. For higher density (16Gb) with x8, the H5ANAG8NCJR-XNC is an option. Cross-brand alternatives like Samsung K4A8G165WB-BCTD are pin-compatible but verify timing. The H5AN8G6NCJR-XNC is a same-brand drop-in with similar specs. Always check the speed grade and timing parameters for your specific application.

Comparison with Alternatives

Parameter	This Product	H5AN8G6NCJR-XNC	H5AN8G6NAFR-UHC	K4A8G165WB-BCTD
Package	FBGA-96 (13x7.5 mm)	FBGA-96 (13x7.5 mm)	FBGA-96 (13x7.5 mm)	FBGA-96 (13x7.5 mm)
Brand	SK Hynix	SK Hynix	SK Hynix	Samsung
Memory Size	8 Gb	8 Gb	8 Gb	8 Gb
Memory Organization	512M x16	512M x16	512M x16	512M x16
Data Rate	3200 Mbps	3200 Mbps	3200 Mbps	3200 Mbps
Supply Voltage	1.2 V	1.2 V	1.2 V	1.2 V
RoHS	Compliant	Compliant	Compliant	Compliant
Operating Temperature	0°C to 85°C	0°C to 85°C	0°C to 85°C	0°C to 85°C

Key Differentiators

High density 8Gb in x16 organization (vs H5AN4G8NBJR-VKI)
DDR4-3200 speed grade (vs H5AN8G6NCJR-XNC)
Cross-brand compatibility with Samsung K4A8G165WB-BCTD (vs K4A8G165WB-BCTD)

Design Notes

For DDR4 routing, maintain 50-ohm single-ended impedance for data lines and 100-ohm differential for clock signals. Keep trace lengths matched within 10 mils for data groups. Place decoupling capacitors (0.1uF and 1uF) close to VDD and VDDQ pins to minimize power supply noise.

The H5AN8G6NDJR-XNC has a maximum operating temperature of 85°C. Ensure adequate airflow or heatsinking in high-ambient environments. The FBGA-96 package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values. For high-density systems, consider thermal vias under the package.

Use on-die termination (ODT) settings as recommended in the datasheet to reduce signal reflections. The dynamic on-chip termination feature helps maintain signal integrity at high speeds. Ensure proper termination for address and control lines. Follow the DDR4 layout guidelines for routing and spacing to minimize crosstalk.