MT40A512M16TB-062E:J vs K4A8G165WB-BCTD Comparison

Detailed side-by-side comparison of MT40A512M16TB-062E:J by Micron Technology and K4A8G165WB-BCTD by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
MT40A512M16TB-062E:J MT40A512M16TB-062E:J - 8Gb DDR4 SDRAM 1.6GHz | Micron

MT40A512M16TB-062E:J - 8Gb DDR4 SDRAM 1.6GHz | Micron

MT40A512M16TB-062E:J ✓ Active
Samsung Electronics
K4A8G165WB-BCTD K4A8G165WB-BCTD - 8Gb DDR4 SDRAM x16 | Samsung

K4A8G165WB-BCTD - 8Gb DDR4 SDRAM x16 | Samsung

K4A8G165WB-BCTD ✓ Active

Specification Comparison

Parameter MT40A512M16TB-062E:J K4A8G165WB-BCTD
Brand Micron Technology Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $8.10 $37.00
Memory Type SDRAM - DDR4 DDR4 SDRAM
Memory Size 8Gbit (512M x 16) —
Clock Frequency 1.6 GHz —
Access Time 19 ns —
Supply Voltage (VDD/VDDQ) 1.2V ±60mV —
VPP Supply Voltage 2.5V (-125mV, +250mV) —
I/O Type 1.2V pseudo open-drain —
Refresh Time 64ms at -40°C to 85°C; 32ms at >85°C to 95°C; 16ms at >95°C —
Internal Banks (x16) 8 (2 groups of 4 banks each) —
Prefetch Architecture 8n-bit —
Package 96-FBGA (7.5x13.5 mm) 96-ball FBGA
Operating Temperature Range 0°C to 95°C —
RoHS Status Compliant —
Lead-Free Yes —
Mounting Type Surface Mount —
Organization — 512M x 16
Total Density — 8 Gb
Data Rate — 2666 Mbps/pin (PC4-2666)
Supply Voltage — 1.2 V
Operating Temperature — 0°C to +95°C (TC)
CAS Latency — [DATA_NEEDED: CL value]
tRCD — [DATA_NEEDED: tRCD value]
tRP — [DATA_NEEDED: tRP value]
Refresh — Auto-refresh, self-refresh
On-Die Termination — Yes (ODT)
ZQ Calibration — Yes
Data Mask — Yes
RoHS — Compliant

Datasheets & Resources

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