P1010NXN5KHA vs P1010NXE5KHA Comparison

Detailed side-by-side comparison of P1010NXN5KHA by NXP Semiconductors and P1010NXE5KHA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
P1010NXN5KHA P1010NXN5KHA - QorIQ P1010 1GHz SoC, 425-TEBGA | NXP

P1010NXN5KHA - QorIQ P1010 1GHz SoC, 425-TEBGA | NXP

P1010NXN5KHA ✓ Active
NXP Semiconductors
P1010NXE5KHA P1010NXE5KHA - QorIQ P1010 1GHz e500v2 MPU 425-TEPBGA | NXP

P1010NXE5KHA - QorIQ P1010 1GHz e500v2 MPU 425-TEPBGA | NXP

P1010NXE5KHA ⚠ Last Time Buy

Specification Comparison

Parameter P1010NXN5KHA P1010NXE5KHA
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $25.95 $52.10
Core Architecture Power Architecture e500v2, 32-bit, dual-issue —
Core Frequency 1000 MHz (1.0 GHz) —
Instruction Set Power Architecture, Book-E enhanced —
Process Technology 45 nm CMOS —
L1 Cache (I/D) 32 KB / 32 KB per core —
Memory Controller DDR3 with ECC support, 16-bit interface DDR3/DDR3L with ECC
Ethernet 3x Gigabit Ethernet (eTSEC: 10/100/1000 + 2x RGMII) 1x GbE MAC
PCIe 3x PCIe Gen 2.0 controllers 2x PCIe Gen2
USB 2x USB 2.0 (host + device/host with ULPI) USB 2.0 with ULPI
SATA 2x SATA 2.0 interfaces 2x SATA 2.0
Security Engine SEC (crypto accelerator), Trusted Boot, Trust Architecture SEC 4.0 (AES, DES, Kasumi, SHA, PK)
Package 425-ball TEPBGA (Thermal Enhanced Plastic BGA) 425-TEPBGA I (19x19 mm)
Supply Voltage 1.0 V core, 1.35 V / 1.5 V DDR3 I/O 1.0 V core (typical)
Operating Temperature -40C to +105C (Industrial / Extended) -40C to +105C (extended)
Mounting Type Surface Mount (BGA) —
RoHS Status Compliant Compliant
Manufacturer — NXP Semiconductors
Series — QorIQ P1
Core — PowerPC e500v2
Core Count — 1
Data Bus Width — 32-bit
Max Core Frequency — 1.0 GHz
L1 Cache (I/D per core) — 32 KB / 32 KB
L2 Cache — 256 KB (with ECC)
Process Node — 45 nm
NAND Flash Controller — Yes (with ECC)
Trusted Boot — Yes (secure boot chain)
MSL Level — MSL3 (per JEDEC J-STD-020)

Datasheets & Resources

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