RTAX4000D-1CQ352B vs RTAX4000SL-1CQ352B Comparison
Detailed side-by-side comparison of RTAX4000D-1CQ352B by Microchip Technology and RTAX4000SL-1CQ352B by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
RTAX4000D-1CQ352B - 4M-Gate Rad-Tolerant FPGA 1.5V | Microchip
RTAX4000D-1CQ352B ✓ ActiveMicrochip Technology
RTAX4000SL-1CQ352B - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip
RTAX4000SL-1CQ352B ✓ ActiveSpecification Comparison
| Parameter | RTAX4000D-1CQ352B | RTAX4000SL-1CQ352B |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,600.00 | $0.00 |
| Family | RTAX-DSP Radiation-Tolerant FPGA | RTAX-SL Radiation-Tolerant FPGA |
| Equivalent System Gates | 4000000 gates | 4,000,000 gates |
| Logic Cells | 55440 cells | 60,480 |
| Configurable Logic Blocks (CLBs) | 36960 CLBs | — |
| Core Supply Voltage (Nominal) | 1.5 V | — |
| Core Supply Voltage Range | 1.425 V to 1.575 V | — |
| Combinatorial CLB Delay (Max) | 0.99 ns | — |
| Process Technology | 0.15 um CMOS | 0.15 um |
| Programmability Type | Antifuse (OTP), live at power-up | — |
| Speed Grade | -1 | -1 |
| Package | 352-pin Ceramic CQFP (CQ352) | 352-Pin CQFP (ceramic quad flat pack) |
| Mounting Type | Surface Mount | Surface Mount |
| Technology | CMOS, Digital | — |
| Radiation Tolerance | Radiation-tolerant (space flight) | Radiation-tolerant, for space flight systems |
| Embedded SRAM | Yes (with built-in FIFO control logic) | — |
| Operating Temperature Bin | B | — |
| RoHS Status | unknown | [DATA_NEEDED: RoHS status] |
| CLBs (Clocked Logic Blocks) | — | 40,320 |
| Core Supply Voltage | — | 1.5 V |
| Programming Technology | — | Anti-fuse, one-time programmable |
| Power-Up Behavior | — | Live at power-up (no external configuration device) |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control logic |
| Clock Features | — | Segmentable clocks, chip-wide resources |
| Base Architecture | — | Axcelerator (commercial) derived |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| I/O Voltage | — | [DATA_NEEDED: I/O bank voltage range] |