RTAX4000D-1CQ352B vs RTAX4000SL-1CQ352B Comparaison
Comparaison détaillée côte à côte de RTAX4000D-1CQ352B par Microchip Technology et RTAX4000SL-1CQ352B par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
RTAX4000D-1CQ352B - 4M-Gate Rad-Tolerant FPGA 1.5V | Microchip
RTAX4000D-1CQ352B ✓ ActifMicrochip Technology
RTAX4000SL-1CQ352B - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip
RTAX4000SL-1CQ352B ✓ ActifComparaison des spécifications
| Paramètre | RTAX4000D-1CQ352B | RTAX4000SL-1CQ352B |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2 600,00 | $0,00 |
| Family | RTAX-DSP Radiation-Tolerant FPGA | RTAX-SL Radiation-Tolerant FPGA |
| Equivalent System Gates | 4000000 gates | 4,000,000 gates |
| Logic Cells | 55440 cells | 60,480 |
| Configurable Logic Blocks (CLBs) | 36960 CLBs | — |
| Core Supply Voltage (Nominal) | 1.5 V | — |
| Core Supply Voltage Range | 1.425 V to 1.575 V | — |
| Combinatorial CLB Delay (Max) | 0.99 ns | — |
| Process Technology | 0.15 um CMOS | 0.15 um |
| Programmability Type | Antifuse (OTP), live at power-up | — |
| Speed Grade | -1 | -1 |
| Boîtier | 352-pin Ceramic CQFP (CQ352) | 352-Pin CQFP (ceramic quad flat pack) |
| Type de montage | Surface Mount | Surface Mount |
| Technology | CMOS, Digital | — |
| Radiation Tolerance | Radiation-tolerant (space flight) | Radiation-tolerant, for space flight systems |
| Embedded SRAM | Yes (with built-in FIFO control logic) | — |
| Operating Temperature Bin | B | — |
| Statut RoHS | unknown | [DATA_NEEDED: RoHS status] |
| CLBs (Clocked Logic Blocks) | — | 40,320 |
| Core Supply Voltage | — | 1.5 V |
| Programming Technology | — | Anti-fuse, one-time programmable |
| Power-Up Behavior | — | Live at power-up (no external configuration device) |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control logic |
| Clock Features | — | Segmentable clocks, chip-wide resources |
| Base Architecture | — | Axcelerator (commercial) derived |
| Plage de température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| I/O Voltage | — | [DATA_NEEDED: I/O bank voltage range] |