RTAX4000D-1CQ352B vs RTAX4000SL-1CQ352B Comparação

Comparação detalhada lado a lado de RTAX4000D-1CQ352B por Microchip Technology e RTAX4000SL-1CQ352B por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
RTAX4000D-1CQ352B RTAX4000D-1CQ352B - 4M-Gate Rad-Tolerant FPGA 1.5V | Microchip

RTAX4000D-1CQ352B - 4M-Gate Rad-Tolerant FPGA 1.5V | Microchip

RTAX4000D-1CQ352B ✓ Ativo
Microchip Technology
RTAX4000SL-1CQ352B RTAX4000SL-1CQ352B - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip

RTAX4000SL-1CQ352B - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip

RTAX4000SL-1CQ352B ✓ Ativo

Comparação de especificações

Parâmetro RTAX4000D-1CQ352B RTAX4000SL-1CQ352B
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $2.600,00 $0,00
Family RTAX-DSP Radiation-Tolerant FPGA RTAX-SL Radiation-Tolerant FPGA
Equivalent System Gates 4000000 gates 4,000,000 gates
Logic Cells 55440 cells 60,480
Configurable Logic Blocks (CLBs) 36960 CLBs —
Core Supply Voltage (Nominal) 1.5 V —
Core Supply Voltage Range 1.425 V to 1.575 V —
Combinatorial CLB Delay (Max) 0.99 ns —
Process Technology 0.15 um CMOS 0.15 um
Programmability Type Antifuse (OTP), live at power-up —
Speed Grade -1 -1
Encapsulamento 352-pin Ceramic CQFP (CQ352) 352-Pin CQFP (ceramic quad flat pack)
Tipo de montagem Surface Mount Surface Mount
Technology CMOS, Digital —
Radiation Tolerance Radiation-tolerant (space flight) Radiation-tolerant, for space flight systems
Embedded SRAM Yes (with built-in FIFO control logic) —
Operating Temperature Bin B —
Status RoHS unknown [DATA_NEEDED: RoHS status]
CLBs (Clocked Logic Blocks) — 40,320
Core Supply Voltage — 1.5 V
Programming Technology — Anti-fuse, one-time programmable
Power-Up Behavior — Live at power-up (no external configuration device)
Embedded Memory — Embedded SRAM with built-in FIFO control logic
Clock Features — Segmentable clocks, chip-wide resources
Base Architecture — Axcelerator (commercial) derived
Faixa de temperatura de operação — [DATA_NEEDED: operating temperature range]
I/O Voltage — [DATA_NEEDED: I/O bank voltage range]

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