RTAX4000SL-CQ352EV vs RTAX4000D-1CQ352V Comparison

Detailed side-by-side comparison of RTAX4000SL-CQ352EV by Microchip Technology and RTAX4000D-1CQ352V by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
RTAX4000SL-CQ352EV RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip

RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip

RTAX4000SL-CQ352EV ✓ Active
Microchip Technology
RTAX4000D-1CQ352V RTAX4000D-1CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip

RTAX4000D-1CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip

RTAX4000D-1CQ352V ✓ Active

Specification Comparison

Parameter RTAX4000SL-CQ352EV RTAX4000D-1CQ352V
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $10,250.00 $0.00
Family RTAX-SL (Radiation-Tolerant FPGA) RTAX-S/SL and RTAX-DSP (radiation-tolerant FPGA)
System Gates 4,000,000 —
Logic Cells (ASIC Gates) 40,320 —
Process Technology 0.15 um CMOS antifuse —
Core Supply Voltage 1.5 V —
Package 352-pin CQFP (Ceramic Quad Flat Pack) CQ352 (ceramic column quad flat, 352 pins)
Screening Level EV (enhanced spaceflight screening) —
Programming Technology Antifuse (one-time programmable, live at power-up) —
Radiation Tolerance Radiation-tolerant (TID/SEL/SEU per family datasheet) Radiation-tolerant, designed for space-flight systems
Configuration Single-chip, no external boot memory Single-chip, live-at-power-up
I/O Supply Voltage [DATA_NEEDED: I/O bank voltage] —
Maximum System Frequency [DATA_NEEDED: maximum system frequency] —
Operating Temperature [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Package Material Hermetic ceramic (JESD-30 S-CQFP-F352) —
Mounting Type Surface Mount Surface Mount
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Typical Application Space-flight systems, satellites, payload processing —
Logic Cells — 55,440
CLB Organization — 36,960 CLBs
Equivalent System Gates — 4,000,000
Technology — CMOS, anti-fuse, one-time programmable
Embedded Memory — Embedded SRAM with built-in FIFO control logic
Clock Resources — Segmentable clocks, chip-wide highway routing
Arithmetic Resources — Dedicated carry logic (DSP-enriched D variant)
Screening Grade — V (flight screening per ordering code)
Supply Voltage — [DATA_NEEDED: core supply voltage]
Max I/O Count (CQ352) — [DATA_NEEDED: user I/O count]

Datasheets & Resources

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