RTAX4000SL-CQ352EV vs RTAX4000D-1CQ352V Karşılaştırma
Ayrıntılı yan yana karşılaştırma RTAX4000SL-CQ352EV tarafından Microchip Technology ve RTAX4000D-1CQ352V tarafından Microchip TechnologyAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Microchip Technology
RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip
RTAX4000SL-CQ352EV ✓ AktifMicrochip Technology
RTAX4000D-1CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip
RTAX4000D-1CQ352V ✓ AktifÖzellik Karşılaştırması
| Parametre | RTAX4000SL-CQ352EV | RTAX4000D-1CQ352V |
|---|---|---|
| Marka | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Family | RTAX-SL (Radiation-Tolerant FPGA) | RTAX-S/SL and RTAX-DSP (radiation-tolerant FPGA) |
| System Gates | 4,000,000 | — |
| Logic Cells (ASIC Gates) | 40,320 | — |
| Process Technology | 0.15 um CMOS antifuse | — |
| Core Supply Voltage | 1.5 V | — |
| Paket | 352-pin CQFP (Ceramic Quad Flat Pack) | CQ352 (ceramic column quad flat, 352 pins) |
| Screening Level | EV (enhanced spaceflight screening) | — |
| Programming Technology | Antifuse (one-time programmable, live at power-up) | — |
| Radiation Tolerance | Radiation-tolerant (TID/SEL/SEU per family datasheet) | Radiation-tolerant, designed for space-flight systems |
| Configuration | Single-chip, no external boot memory | Single-chip, live-at-power-up |
| I/O Supply Voltage | [DATA_NEEDED: I/O bank voltage] | — |
| Maximum System Frequency | [DATA_NEEDED: maximum system frequency] | — |
| İşletim Sıcaklığı | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Package Material | Hermetic ceramic (JESD-30 S-CQFP-F352) | — |
| Montaj Türü | Surface Mount | Surface Mount |
| RoHS Durumu | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Typical Application | Space-flight systems, satellites, payload processing | — |
| Logic Cells | — | 55,440 |
| CLB Organization | — | 36,960 CLBs |
| Equivalent System Gates | — | 4,000,000 |
| Technology | — | CMOS, anti-fuse, one-time programmable |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control logic |
| Clock Resources | — | Segmentable clocks, chip-wide highway routing |
| Arithmetic Resources | — | Dedicated carry logic (DSP-enriched D variant) |
| Screening Grade | — | V (flight screening per ordering code) |
| Besleme Gerilimi | — | [DATA_NEEDED: core supply voltage] |
| Max I/O Count (CQ352) | — | [DATA_NEEDED: user I/O count] |