S9S08QD4J1CSCR vs MC9S08QD4CSC Comparison

Detailed side-by-side comparison of S9S08QD4J1CSCR by NXP Semiconductors and MC9S08QD4CSC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
S9S08QD4J1CSCR S9S08QD4J1CSCR - 8-Bit S08 MCU 4KB Flash 16MHz SOIC-8 | NXP

S9S08QD4J1CSCR - 8-Bit S08 MCU 4KB Flash 16MHz SOIC-8 | NXP

S9S08QD4J1CSCR ✓ Active
NXP Semiconductors
MC9S08QD4CSC MC9S08QD4CSC - 8-bit S08 MCU 4KB Flash 16MHz | NXP

MC9S08QD4CSC - 8-bit S08 MCU 4KB Flash 16MHz | NXP

MC9S08QD4CSC ✗ End of Life

Specification Comparison

Parameter S9S08QD4J1CSCR MC9S08QD4CSC
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active End of Life
Stock Status In Stock In Stock
Unit Price (USD) $4.42 $0.00
Core Processor S08 (HCS08) S08 (HCS08), 8-bit CISC
Core Size 8-bit 8-bit
CPU Speed 16 MHz —
Program Memory Size 4 KB (4K x 8) Flash —
RAM Size 256 bytes (256 x 8) —
Supply Voltage (Vcc/Vdd) 2.7 V to 5.5 V —
Operating Temperature -40 °C to +85 °C (Automotive Grade) [DATA_NEEDED: operating temperature range]
Number of I/O Pins 4 (plus input-only and output-only pins) —
Package 8-SOIC (SOIC-8) 8-SOIC
Peripherals LVD, POR, PWM, WDT —
Connectivity - —
Program Memory Type Flash —
EEPROM Size Not specified in verified data [DATA_NEEDED: EEPROM size] —
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant —
Debug Interface Single-wire Background Debug Mode (BKGD) Background debugging system (single-wire BDM)
Maximum Clock Frequency — 16 MHz
Flash Memory — 4 KB (4K x 8)
RAM — 256 B
Supply Voltage — 3.3 V / 5 V
ADC Resolution — 10-bit
ADC Channels — 4
General-Purpose I/O — 6
Instruction Set — HC08 with added BGND instruction
Packaging — Tube
Life Cycle Stage — End of Life (per NXP product page)

Datasheets & Resources

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