S9S08QD4J1CSCR vs MC9S08QD4CSC Vergleich
Detaillierter Direktvergleich von S9S08QD4J1CSCR von NXP Semiconductors und MC9S08QD4CSC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S08QD4J1CSCR - 8-Bit S08 MCU 4KB Flash 16MHz SOIC-8 | NXP
S9S08QD4J1CSCR ✓ AktivSpezifikationsvergleich
| Parameter | S9S08QD4J1CSCR | MC9S08QD4CSC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,42 | $0,00 |
| Core Processor | S08 (HCS08) | S08 (HCS08), 8-bit CISC |
| Core Size | 8-bit | 8-bit |
| CPU Speed | 16 MHz | — |
| Program Memory Size | 4 KB (4K x 8) Flash | — |
| RAM Size | 256 bytes (256 x 8) | — |
| Supply Voltage (Vcc/Vdd) | 2.7 V to 5.5 V | — |
| Betriebstemperatur | -40 °C to +85 °C (Automotive Grade) | [DATA_NEEDED: operating temperature range] |
| Number of I/O Pins | 4 (plus input-only and output-only pins) | — |
| Gehäuse | 8-SOIC (SOIC-8) | 8-SOIC |
| Peripherals | LVD, POR, PWM, WDT | — |
| Connectivity | - | — |
| Program Memory Type | Flash | — |
| EEPROM Size | Not specified in verified data [DATA_NEEDED: EEPROM size] | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | — |
| Debug Interface | Single-wire Background Debug Mode (BKGD) | Background debugging system (single-wire BDM) |
| Maximale Taktfrequenz | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Versorgungsspannung | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |