S9S08QD4J1VSC vs S9S08QD4J2MSCR Comparison
Detailed side-by-side comparison of S9S08QD4J1VSC by NXP Semiconductors and S9S08QD4J2MSCR by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | S9S08QD4J1VSC | S9S08QD4J2MSCR |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1.31 | $1.55 |
| Core Architecture | HCS08 (S08 family) | — |
| CPU Bit Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | 16 MHz |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| Operating Temperature | -40C to +105C | -40 C to +125 C |
| Package | 8-pin SOIC (SOIC-8) | 8-SOIC (0.154 inch, 3.90 mm width) |
| Mounting Type | Surface Mount | Surface Mount |
| ADC | 8-channel 10-bit | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | TPM (16-bit) + MTIM (8-bit) | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug Interface | Background debug (single wire) + on-chip breakpoints | — |
| AEC-Q100 | Qualified (automotive) | — |
| Instruction Set | HC08 + BGND | — |
| MSL Level | MSL3 (per SOIC-8 standard) | — |
| RoHS Status | Compliant | Compliant |
| Core | — | HCS08 |
| Instruction Set Architecture | — | CISC (68 HC08 with added BGND) |
| Core Width | — | 8-bit |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 4 KB (4K x 8) |
| Supply Voltage | — | 2.7 V to 5.5 V |
| Packaging | — | Tape & Reel (TR) |
| I/O Pins | — | 4 |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |