S9S08QD4J1VSC vs S9S08QD4J2MSCR 비교
다음의 상세 나란히 비교: S9S08QD4J1VSC 제조: NXP Semiconductors 및 S9S08QD4J2MSCR 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | S9S08QD4J1VSC | S9S08QD4J2MSCR |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | NRND | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1.31 | $1.55 |
| Core Architecture | HCS08 (S08 family) | — |
| CPU Bit Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | 16 MHz |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| 동작 온도 | -40C to +105C | -40 C to +125 C |
| 패키지 | 8-pin SOIC (SOIC-8) | 8-SOIC (0.154 inch, 3.90 mm width) |
| 실장 유형 | Surface Mount | Surface Mount |
| ADC | 8-channel 10-bit | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | TPM (16-bit) + MTIM (8-bit) | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug Interface | Background debug (single wire) + on-chip breakpoints | — |
| AEC-Q100 | Qualified (automotive) | — |
| Instruction Set | HC08 + BGND | — |
| MSL 레벨 | MSL3 (per SOIC-8 standard) | — |
| RoHS 상태 | Compliant | Compliant |
| Core | — | HCS08 |
| Instruction Set Architecture | — | CISC (68 HC08 with added BGND) |
| Core Width | — | 8-bit |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 4 KB (4K x 8) |
| 공급 전압 | — | 2.7 V to 5.5 V |
| Packaging | — | Tape & Reel (TR) |
| I/O Pins | — | 4 |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |