S9S08QD4J2MSCR vs MC9S08QD4CSC Comparison
Detailed side-by-side comparison of S9S08QD4J2MSCR by NXP Semiconductors and MC9S08QD4CSC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | S9S08QD4J2MSCR | MC9S08QD4CSC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1.55 | $0.00 |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| Supply Voltage | 2.7 V to 5.5 V | 3.3 V / 5 V |
| Operating Temperature | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| Package | 8-SOIC (0.154 inch, 3.90 mm width) | 8-SOIC |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | Tube |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | — |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | — |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| RoHS Status | Compliant | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Maximum Clock Frequency | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Life Cycle Stage | — | End of Life (per NXP product page) |