S9S08QD4J2MSCR vs MC9S08QD4CSC 对比

详细并排对比 S9S08QD4J2MSCR 出自 NXP Semiconductors 和 MC9S08QD4CSC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
S9S08QD4J2MSCR S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR ✓ 量产中
NXP Semiconductors
MC9S08QD4CSC MC9S08QD4CSC - 8-bit S08 MCU 4KB Flash 16MHz | NXP

MC9S08QD4CSC - 8-bit S08 MCU 4KB Flash 16MHz | NXP

MC9S08QD4CSC ✗ 停产

规格对比

参数 S9S08QD4J2MSCR MC9S08QD4CSC
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 停产
库存状态 有库存 有库存
单价(USD) $1.55 $0.00
Core HCS08 —
Instruction Set Architecture CISC (68 HC08 with added BGND) —
Core Width 8-bit —
Maximum CPU Frequency 16 MHz —
Program Memory Type Flash —
Program Memory Size 4 KB (4K x 8) —
电源电压 2.7 V to 5.5 V 3.3 V / 5 V
工作温度 -40 C to +125 C [DATA_NEEDED: operating temperature range]
封装 8-SOIC (0.154 inch, 3.90 mm width) 8-SOIC
安装类型 Surface Mount Surface Mount
Packaging Tape & Reel (TR) Tube
I/O Pins 4 —
ADC 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI —
Timers TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) —
Debug Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints —
RoHS 状态 Compliant —
Core Processor — S08 (HCS08), 8-bit CISC
Core Size — 8-bit
最大时钟频率 — 16 MHz
Flash Memory — 4 KB (4K x 8)
RAM — 256 B
ADC Resolution — 10-bit
ADC Channels — 4
General-Purpose I/O — 6
Instruction Set — HC08 with added BGND instruction
Debug Interface — Background debugging system (single-wire BDM)
Life Cycle Stage — End of Life (per NXP product page)

数据手册与资源

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