S9S08QD4J2MSCR vs MC9S08QD4CSC 비교
다음의 상세 나란히 비교: S9S08QD4J2MSCR 제조: NXP Semiconductors 및 MC9S08QD4CSC 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | S9S08QD4J2MSCR | MC9S08QD4CSC |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 수명 종료 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1.55 | $0.00 |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| 공급 전압 | 2.7 V to 5.5 V | 3.3 V / 5 V |
| 동작 온도 | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| 패키지 | 8-SOIC (0.154 inch, 3.90 mm width) | 8-SOIC |
| 실장 유형 | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | Tube |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | — |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | — |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| RoHS 상태 | Compliant | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| 최대 클록 주파수 | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Life Cycle Stage | — | End of Life (per NXP product page) |