S9S08SG4E2MTJ vs S9S08SG16E1VTJ Comparison
Detailed side-by-side comparison of S9S08SG4E2MTJ by NXP Semiconductors and S9S08SG16E1VTJ by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
S9S08SG4E2MTJ - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP
S9S08SG4E2MTJ ✗ End of LifeSpecification Comparison
| Parameter | S9S08SG4E2MTJ | S9S08SG16E1VTJ |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.85 | $0.00 |
| Core | S08 (HCS08) 8-bit CPU | — |
| Core Clock Speed | 40 MHz | — |
| Flash Memory | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| Supply Voltage | 2.7 V to 5.5 V | 3.3 V / 5 V |
| Operating Temperature | -40 degC to +125 degC | -40C to +105C |
| Automotive Qualification | Automotive Qualified (AEC-Q100 family grade) | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Package | 20-TSSOP (MTJ) | — |
| Mounting Type | Surface Mount | Surface Mount |
| I/O Ports | [DATA_NEEDED: I/O port count] | — |
| Peripheral Set | [DATA_NEEDED: detailed peripheral list (timers, SCI, ADC)] | — |
| RoHS Status | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Lifecycle Status | End of Life (per NXP product page) | — |
| Target Applications | LIN slave, general market, high-temperature, space-constrained | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Maximum CPU Speed | — | 40 MHz |
| Program Memory Size | — | 16 KB (16K x 8) Flash |
| RAM Size | — | 512 B (NXP product page; one distributor listing states 1K x 8) |
| Number of I/O | — | 16 |
| Oscillator Type | — | Internal |
| Qualification | — | Automotive Qualified (family qualified to meet or exceed AEC Grade 0, up to 150C TA for high-temp grades) |
| Package / Case | — | 20-TSSOP (0.173", 4.40 mm width) |
| Packaging | — | Tube |
| Connectivity | — | LIN (family targeted at LIN slave applications) |
| Integrated Analog | — | Yes (integrated analog per NXP product page) |
| Data Converter | — | [DATA_NEEDED: ADC resolution detail] |