S9S08SG4E2MTJ vs S9S08SG16E1VTJ Vergleich
Detaillierter Direktvergleich von S9S08SG4E2MTJ von NXP Semiconductors und S9S08SG16E1VTJ von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S08SG4E2MTJ - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP
S9S08SG4E2MTJ ✗ AbgekündigtSpezifikationsvergleich
| Parameter | S9S08SG4E2MTJ | S9S08SG16E1VTJ |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,85 | $0,00 |
| Core | S08 (HCS08) 8-bit CPU | — |
| Core Clock Speed | 40 MHz | — |
| Flash Memory | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| Versorgungsspannung | 2.7 V to 5.5 V | 3.3 V / 5 V |
| Betriebstemperatur | -40 degC to +125 degC | -40C to +105C |
| Automotive Qualification | Automotive Qualified (AEC-Q100 family grade) | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Gehäuse | 20-TSSOP (MTJ) | — |
| Montageart | Surface Mount | Surface Mount |
| I/O Ports | [DATA_NEEDED: I/O port count] | — |
| Peripheral Set | [DATA_NEEDED: detailed peripheral list (timers, SCI, ADC)] | — |
| RoHS-Status | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Lebenszyklusstatus | End of Life (per NXP product page) | — |
| Target Applications | LIN slave, general market, high-temperature, space-constrained | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Maximum CPU Speed | — | 40 MHz |
| Program Memory Size | — | 16 KB (16K x 8) Flash |
| RAM Size | — | 512 B (NXP product page; one distributor listing states 1K x 8) |
| Number of I/O | — | 16 |
| Oscillator Type | — | Internal |
| Qualification | — | Automotive Qualified (family qualified to meet or exceed AEC Grade 0, up to 150C TA for high-temp grades) |
| Gehäuse / Bauform | — | 20-TSSOP (0.173", 4.40 mm width) |
| Packaging | — | Tube |
| Connectivity | — | LIN (family targeted at LIN slave applications) |
| Integrated Analog | — | Yes (integrated analog per NXP product page) |
| Data Converter | — | [DATA_NEEDED: ADC resolution detail] |