S9S08SG4E2MTJ vs S9S08SG16E1VTJ Comparação
Comparação detalhada lado a lado de S9S08SG4E2MTJ por NXP Semiconductors e S9S08SG16E1VTJ por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
S9S08SG4E2MTJ - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP
S9S08SG4E2MTJ ✗ Fim de vidaComparação de especificações
| Parâmetro | S9S08SG4E2MTJ | S9S08SG16E1VTJ |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Fim de vida | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,85 | $0,00 |
| Core | S08 (HCS08) 8-bit CPU | — |
| Core Clock Speed | 40 MHz | — |
| Flash Memory | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| Tensão de alimentação | 2.7 V to 5.5 V | 3.3 V / 5 V |
| Temperatura de operação | -40 degC to +125 degC | -40C to +105C |
| Automotive Qualification | Automotive Qualified (AEC-Q100 family grade) | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Encapsulamento | 20-TSSOP (MTJ) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| I/O Ports | [DATA_NEEDED: I/O port count] | — |
| Peripheral Set | [DATA_NEEDED: detailed peripheral list (timers, SCI, ADC)] | — |
| Status RoHS | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Status do ciclo de vida | End of Life (per NXP product page) | — |
| Target Applications | LIN slave, general market, high-temperature, space-constrained | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Maximum CPU Speed | — | 40 MHz |
| Program Memory Size | — | 16 KB (16K x 8) Flash |
| RAM Size | — | 512 B (NXP product page; one distributor listing states 1K x 8) |
| Number of I/O | — | 16 |
| Oscillator Type | — | Internal |
| Qualification | — | Automotive Qualified (family qualified to meet or exceed AEC Grade 0, up to 150C TA for high-temp grades) |
| Encapsulamento / Caixa | — | 20-TSSOP (0.173", 4.40 mm width) |
| Packaging | — | Tube |
| Connectivity | — | LIN (family targeted at LIN slave applications) |
| Integrated Analog | — | Yes (integrated analog per NXP product page) |
| Data Converter | — | [DATA_NEEDED: ADC resolution detail] |