S9S12B128F0MFUE vs MC9S12B64CFUE Comparison
Detailed side-by-side comparison of S9S12B128F0MFUE by NXP Semiconductors and MC9S12B64CFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
S9S12B128F0MFUE - 16-bit 128KB Flash Automotive MCU QFP-80 | NXP
S9S12B128F0MFUE NrndNXP Semiconductors
MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP
MC9S12B64CFUE ⚠ Last Time BuySpecification Comparison
| Parameter | S9S12B128F0MFUE | MC9S12B64CFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.55 | $10.10 |
| Core Processor | HCS12 | — |
| Core Size | 16-bit | — |
| Maximum Clock Speed | 25 MHz | — |
| Program Memory Size | 128 KB (128K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| Number of I/O | 59 | — |
| Data Converters | A/D 8x10b | — |
| Connectivity | CANbus, I2C, SCI, SPI | — |
| Peripherals | POR, PWM, WDT | — |
| Operating Temperature | -40C to +125C (Automotive Grade 1) | — |
| Package | 80-LQFP (14x14 mm) | 80-QFP (14x14 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| AEC-Q100 Qualification | Qualified | — |
| Series | HCS12 / MC9S12B (S9S12B128, Sturgeon) | — |
| RoHS Status | Compliant per NXP product page | Compliant |
| Core | — | HCS12 (S12 CISC, 16-bit) |
| Flash Memory | — | 64 KB |
| RAM | — | 2 KB |
| EEPROM | — | 1 KB |
| Maximum CPU Frequency | — | 25 MHz |
| Supply Voltage | — | 5 V (typical) |
| Operating Temperature Range | — | 0C to +70C (commercial 'C' grade) |
| ADC | — | 8-channel, 10-bit |
| CAN Module | — | 1x MSCAN 2.0A/B |
| SCI/SPI | — | 2x SCI, 1x SPI |
| Timers | — | 16-bit Timer + 8-bit PWM + PIT |
| I/O Pins | — | [DATA_NEEDED: I/O pin count] |
| Debug Interface | — | Background Debug Mode (BDM) |
| Lead-Free / Terminal Finish | — | Matte Tin (Sn) |
| Peak Reflow Temperature | — | 260C (max 40 s) |