S9S12B128F0MFUE vs MC9S12B64CFUE Vergleich
Detaillierter Direktvergleich von S9S12B128F0MFUE von NXP Semiconductors und MC9S12B64CFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S12B128F0MFUE - 16-bit 128KB Flash Automotive MCU QFP-80 | NXP
S9S12B128F0MFUE NrndNXP Semiconductors
MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP
MC9S12B64CFUE ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | S9S12B128F0MFUE | MC9S12B64CFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,55 | $10,10 |
| Core Processor | HCS12 | — |
| Core Size | 16-bit | — |
| Maximum Clock Speed | 25 MHz | — |
| Program Memory Size | 128 KB (128K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| Number of I/O | 59 | — |
| Data Converters | A/D 8x10b | — |
| Connectivity | CANbus, I2C, SCI, SPI | — |
| Peripherals | POR, PWM, WDT | — |
| Betriebstemperatur | -40C to +125C (Automotive Grade 1) | — |
| Gehäuse | 80-LQFP (14x14 mm) | 80-QFP (14x14 mm) |
| Montageart | Surface Mount | Surface Mount |
| AEC-Q100 Qualification | Qualified | — |
| Series | HCS12 / MC9S12B (S9S12B128, Sturgeon) | — |
| RoHS-Status | Compliant per NXP product page | Compliant |
| Core | — | HCS12 (S12 CISC, 16-bit) |
| Flash Memory | — | 64 KB |
| RAM | — | 2 KB |
| EEPROM | — | 1 KB |
| Maximum CPU Frequency | — | 25 MHz |
| Versorgungsspannung | — | 5 V (typical) |
| Betriebstemperaturbereich | — | 0C to +70C (commercial 'C' grade) |
| ADC | — | 8-channel, 10-bit |
| CAN Module | — | 1x MSCAN 2.0A/B |
| SCI/SPI | — | 2x SCI, 1x SPI |
| Timers | — | 16-bit Timer + 8-bit PWM + PIT |
| I/O Pins | — | [DATA_NEEDED: I/O pin count] |
| Debug Interface | — | Background Debug Mode (BDM) |
| Lead-Free / Terminal Finish | — | Matte Tin (Sn) |
| Peak Reflow Temperature | — | 260C (max 40 s) |