W25Q64JVSSIG vs N25Q064A13ESEA0F Comparison

Detailed side-by-side comparison of W25Q64JVSSIG by Winbond and N25Q064A13ESEA0F by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
N25Q064A13ESEA0F N25Q064A13ESEA0F - 64Mb SPI NOR Flash 108MHz | Micron

N25Q064A13ESEA0F - 64Mb SPI NOR Flash 108MHz | Micron

N25Q064A13ESEA0F ✓ Active

Specification Comparison

Parameter W25Q64JVSSIG N25Q064A13ESEA0F
Brand Winbond Micron Technology
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.22 $0.00
Memory Capacity 64 M-bit (8 MB) —
Memory Type NOR Flash (SPI) NOR Flash - Serial SPI
Organization 8M x 8 64M x1 / 32M x2 / 16M x4
Interface SPI, Dual SPI, Quad SPI, QPI SPI (1-bit / 2-bit / 4-bit)
Maximum Clock Frequency 133 MHz —
Supply Voltage 3 V to 3.6 V 3 V (2.7 V to 3.6 V class)
Page Size 256 bytes —
Sector Size 4 KB —
Block Size 32 KB / 64 KB —
Operating Temperature -40C to +85C (industrial) [DATA_NEEDED: Operating Temperature]
Package 8-pin SOP (SOIC-8, 208-mil) 8-SO Wide (SOP-8 W)
Mounting Type Surface Mount Surface Mount
Unique ID 64-bit —
Security Features Individual block lock-down, hardware/software write protection —
Standards Support JEDEC SFDP —
Deep Power-Down Mode Yes (microamp standby current) —
RoHS Status Compliant [DATA_NEEDED: RoHS Status]
Memory Size — 64 Mbit (8 MB)
Max Clock Frequency — 108 MHz
Access Time — 7 ns
XIP Mode — Supported (execute-in-place)
Program / Erase Suspend — Supported
Hardware / Software Reset — Supported
Packaging — Tape & Reel (TR variant)
Lifecycle Status — Active

Datasheets & Resources

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