WT:A vs MT53E1G32D2FW-046 WT:B Comparison
Detailed side-by-side comparison of WT:A by Micron Technology and MT53E1G32D2FW-046 WT:B by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Micron Technology
MT53E1G32D2FW-046 WT:B - 32Gb LPDDR4 SDRAM | Micron
MT53E1G32D2FW-046 WT:B ✓ ActiveSpecification Comparison
| Parameter | WT:A | MT53E1G32D2FW-046 WT:B |
|---|---|---|
| Brand | Micron Technology | Micron Technology |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.85 | $98.44 |
| Memory Type | Mobile LPDDR4 SDRAM | Volatile, Mobile LPDDR4 SDRAM (LPDRAM) |
| Density | 48 Gbit (6 GB) | — |
| Organization | 1536M x 32 | 1G x 32 |
| Maximum Data Rate | 2.133 GHz | — |
| Speed Bin Suffix | -046 (2133 MHz) | — |
| Supply Voltage VDD1 | 1.8 V (typ, JEDEC LPDDR4) | — |
| Supply Voltage VDD2 | 1.1 V (typ, JEDEC LPDDR4) | 1.1 V |
| Supply Voltage VDDQ | 1.1 V (typ, JEDEC LPDDR4) | 1.1 V (LPDDR4X) / 1.8 V (LPDDR4) |
| Operating Temperature | [DATA_NEEDED: operating temperature grade] | -25C to +85C |
| Package | 200-ball TFBGA | 200-ball TFBGA (10 mm x 14.5 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Interface | LPDDR4 command/address + 32-bit DQ | — |
| JEDEC Standard | JESD209-4 (LPDDR4) | — |
| RoHS Status | Compliant | Compliant |
| Refresh | Auto-refresh and self-refresh per JEDEC | — |
| Memory Capacity | — | 32 Gbit (4 GB) |
| Interface / Bus Width | — | Parallel, 32-bit |
| Clock Frequency (max) | — | 2.133 GHz (2133 MHz) |
| Data Rate (per pin) | — | 4266 MT/s |
| Clock Access Time (tCK) | — | 3.5 ns |
| Speed Bin | — | -046 |
| Die Configuration | — | Dual-Die Package (DDP) |
| On-Die Features | — | Auto precharge, Data mask, ZQ calibration, Write leveling, Built-in temperature sensor, Asynchronous reset |