XC6SLX100-2FG484C vs XC6SLX100-3FGG484C Comparison

Detailed side-by-side comparison of XC6SLX100-2FG484C by AMD and XC6SLX100-3FGG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX100-2FG484C XC6SLX100-3FGG484C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX Field-Programmable Gate Array —
Logic Cells 101,261 cells 101,261
User I/O 326 I/O 326
Package 484-BBGA 484-ball FBG (FGG484), 19 x 19 mm, 0.80 mm pitch, Pb-free
Total Pins 484 pins —
Speed Grade -2 -3 (highest performance)
Temperature Grade Commercial —
Internal Frequency 667 MHz —
Process Technology 45 nm CMOS —
Device Family Spartan-6 LX —
Programming Technology Field-programmable gate array —
Mounting Type Surface Mount Surface Mount (BGA)
Supply Voltage [DATA_NEEDED: XC6SLX100-2FG484C supply voltage] —
Block RAM [DATA_NEEDED: XC6SLX100-2FG484C block RAM capacity] 4,824 Kbits (4824 Kb = ~4824 Kbits total Block RAM)
DSP Slices [DATA_NEEDED: XC6SLX100-2FG484C DSP slice count] —
Operating Temperature [DATA_NEEDED: XC6SLX100-2FG484C operating temperature range] 0 C to +85 C (C grade, commercial)
Package Dimensions 19 mm x 19 mm, 0.80 mm pitch —
RoHS Status [DATA_NEEDED: XC6SLX100-2FG484C RoHS status] Compliant
REACH Status [DATA_NEEDED: XC6SLX100-2FG484C REACH status] —
Family — Spartan-6 LX
System Gates — 4,939,776
DSP48A1 Slices — 180
Process Node — 45 nm CMOS
Core Voltage (VCCINT) — 1.2 V (nominal)
Internal/Max Frequency — 667 MHz (memory controller; logic Fmax speed-grade dependent)
Lead-Free Status — Lead Free

Datasheets & Resources

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