XC6SLX16-2FT256C vs XC6SLX16-2FTG256C Comparison

Detailed side-by-side comparison of XC6SLX16-2FT256C by AMD and XC6SLX16-2FTG256C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX16-2FT256C XC6SLX16-2FT256C - 14,579-Cell Spartan-6 FPGA | AMD

XC6SLX16-2FT256C - 14,579-Cell Spartan-6 FPGA | AMD

XC6SLX16-2FT256C ✓ Active

Specification Comparison

Parameter XC6SLX16-2FT256C XC6SLX16-2FTG256C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active NRND
Device Type FPGA —
FPGA Family Spartan-6 LX —
Configurable Logic Cells 14,579 cells —
Configurable Logic Blocks 1,139 CLBs —
Internal Frequency 667 MHz —
I/O Count 186 I/O —
Process Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Speed Grade -2 -2
Temperature Grade C, commercial —
Operating Temperature 0°C to 85°C 0 °C to +85 °C (Commercial)
Package 256-LBGA 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch
Terminal Count 256 terminals —
Mounting Type Surface Mount Surface Mount
Package Shape Square —
Terminal Form Ball —
Lead-Free Status Lead free —
RoHS Status [DATA_NEEDED: RoHS compliance status] —
REACH Status [DATA_NEEDED: REACH compliance status] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Resources [DATA_NEEDED: DSP resource count] —
Family — Spartan-6 LX
Logic Cells — 14,579
Configurable Logic Blocks (CLBs) — 1,139
Slices — 2,278
Block RAM Bits — 589,824 bits
Block RAM Blocks (18 Kb) — 32
DSP Slices (18×18 multipliers) — 32
Maximum User I/Os — 186
Maximum Single-Ended I/O Banks — 4
Process Node — 45 nm CMOS, 9-metal layer
Supply Voltage (Core) — 1.2 V nominal
Lead-Free / RoHS — Yes (compliant)
Configuration Modes — JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel
Clock Management Tiles (CMTs) — 2 (each with PLL + MMCM)
PCIe Support — Soft IP only (no integrated PCIe hard cores)

Datasheets & Resources

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