XC6SLX16-3FT256I vs XC6SLX16-2FTG256C Comparison

Detailed side-by-side comparison of XC6SLX16-3FT256I by AMD and XC6SLX16-2FTG256C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX16-3FT256I XC6SLX16-2FTG256C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active NRND
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Spartan-6 LX (logic-optimized) —
Logic Cells 14,579 cells 14,579
Configurable Logic Blocks (CLBs) 1,139 CLBs 1,139
User I/O Count 186 I/O —
Max Internal Frequency 667 MHz —
Process Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Speed Grade -3 (highest Spartan-6 LX performance grade) -2
Package 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch
Package Body Size 17 x 17 mm, 1.0 mm ball pitch —
Terminal Count 256 terminals —
Operating Temperature 0 C to +85 C (32 F to 185 F) 0 °C to +85 °C (Commercial)
Temperature Grade Marking Industrial —
Lead-Free Status Lead-free package construction —
Mounting Type Surface Mount Surface Mount
Package Code LBGA / FT256 —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Configuration Interface Details [DATA_NEEDED: configuration interface details] —
Family — Spartan-6 LX
Slices — 2,278
Block RAM Bits — 589,824 bits
Block RAM Blocks (18 Kb) — 32
DSP Slices (18×18 multipliers) — 32
Maximum User I/Os — 186
Maximum Single-Ended I/O Banks — 4
Process Node — 45 nm CMOS, 9-metal layer
Supply Voltage (Core) — 1.2 V nominal
Lead-Free / RoHS — Yes (compliant)
Configuration Modes — JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel
Clock Management Tiles (CMTs) — 2 (each with PLL + MMCM)
PCIe Support — Soft IP only (no integrated PCIe hard cores)

Datasheets & Resources

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