XC6SLX16-3FT256I vs XC6SLX16-2FTG256C 对比
详细并排对比 XC6SLX16-3FT256I 出自 AMD 和 XC6SLX16-2FTG256C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX16-3FT256I | XC6SLX16-2FTG256C |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Spartan-6 LX (logic-optimized) | — |
| Logic Cells | 14,579 cells | 14,579 |
| Configurable Logic Blocks (CLBs) | 1,139 CLBs | 1,139 |
| User I/O Count | 186 I/O | — |
| Max Internal Frequency | 667 MHz | — |
| Process Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | -3 (highest Spartan-6 LX performance grade) | -2 |
| 封装 | 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid | 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch |
| Package Body Size | 17 x 17 mm, 1.0 mm ball pitch | — |
| Terminal Count | 256 terminals | — |
| 工作温度 | 0 C to +85 C (32 F to 185 F) | 0 °C to +85 °C (Commercial) |
| Temperature Grade Marking | Industrial | — |
| Lead-Free Status | Lead-free package construction | — |
| 安装类型 | Surface Mount | Surface Mount |
| Package Code | LBGA / FT256 | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| Configuration Interface Details | [DATA_NEEDED: configuration interface details] | — |
| Family | — | Spartan-6 LX |
| Slices | — | 2,278 |
| Block RAM Bits | — | 589,824 bits |
| Block RAM Blocks (18 Kb) | — | 32 |
| DSP Slices (18×18 multipliers) | — | 32 |
| Maximum User I/Os | — | 186 |
| Maximum Single-Ended I/O Banks | — | 4 |
| Process Node | — | 45 nm CMOS, 9-metal layer |
| Supply Voltage (Core) | — | 1.2 V nominal |
| Lead-Free / RoHS | — | Yes (compliant) |
| Configuration Modes | — | JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel |
| Clock Management Tiles (CMTs) | — | 2 (each with PLL + MMCM) |
| PCIe Support | — | Soft IP only (no integrated PCIe hard cores) |