XC6SLX25-2FG484I vs XC6SLX25-3FGG484I Comparison

Detailed side-by-side comparison of XC6SLX25-2FG484I by AMD and XC6SLX25-3FGG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX25-3FGG484I XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD

XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD

XC6SLX25-3FGG484I ✓ Active

Specification Comparison

Parameter XC6SLX25-2FG484I XC6SLX25-3FGG484I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Active
Device Type Spartan-6 LX FPGA —
Logic Cells 24,051 cells 24051
Number of I/O 266 I/O 266
Technology 45 nm CMOS —
Supply Voltage 1.2 V —
Package 484-pin FBGA 484-BBGA (23x23 mm)
Package Type 484-BBGA —
Package Dimensions 15 x 15 mm —
Package Pitch 0.80 mm —
Speed Grade -2 -3 (highest performance)
Operating Temperature 0 C to 85 C —
Internal Frequency 500 MHz 500 MHz
Terminals 484 balls —
Mounting Type Surface Mount Surface Mount
Lead-Free Status Contains Lead —
RoHS Status RoHS Non-Compliant Compliant
Output Configuration Field Programmable Gate Array —
FPGA Family Spartan-6 LX —
Device Revision [DATA_NEEDED: device revision] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Slices [DATA_NEEDED: DSP slice count] —
Family — Spartan-6 LX
Configurable Logic Blocks (CLBs) — 1879
Total RAM Bits — 958464
Operating Supply Voltage — 1.14 V ~ 1.26 V
Operating Temperature Range — -40°C ~ 100°C (TJ)
Process Technology — 45nm CMOS
Lead Free — Yes
Number of LABs/CLBs — 1879

Datasheets & Resources

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