XC6SLX45-2FGG676C vs XC6SLX45-3FG676I Comparison

Detailed side-by-side comparison of XC6SLX45-2FGG676C by AMD and XC6SLX45-3FG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX45-2FGG676C XC6SLX45-3FG676I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Device Family Spartan-6 LX —
Logic Cells 43,661 43,661 cells
Block RAM (bits) 2,138,112 —
User I/O Count 358 —
Number of CLBs 3,411 —
Package 676-ball FFG / FBGA, 27 x 27 mm, 1.0 mm pitch 676-BGA, 1 mm pitch
Speed Grade -2 (standard performance) —
Process Technology 45 nm CMOS, low-power copper 45 nm CMOS
Core Voltage (Vccint) 1.2 V nominal (1.14 V to 1.26 V range) —
Auxiliary Voltage (Vccaux) 2.5 V nominal —
I/O Bank Voltage (Vcco) 1.2 V to 3.3 V per bank —
Operating Temperature 0 C to +85 C (commercial, "C" suffix) 0°C to 85°C
Mounting Type Surface Mount (BGA) Surface mount
MSL Level 3 (168 hours) —
Lead Free / REACH Lead free per MO-275 —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Spartan-6 LX
Configurable Logic Blocks — 3,411 CLBs
Block RAM — 2,138,112 RAM bits
Maximum Internal Frequency — 500 MHz
Number of I/O — 358 I/O
Supply Voltage — 1.14 V to 1.26 V
Package Type — FCBGA-676
Package Dimensions — 27 mm x 27 mm
Lead-Free Status — Lead-free
Temperature Grade — Industrial
Programmable Logic Type — FPGA
Configuration Memory — [DATA_NEEDED: configuration memory type]
Number of DSP Blocks — [DATA_NEEDED: DSP block count]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency by I/O and logic configuration]
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]

Datasheets & Resources

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