XC6SLX75-2FGG484I vs XC6SLX45-2FGG484I Comparison

Detailed side-by-side comparison of XC6SLX75-2FGG484I by AMD and XC6SLX45-2FGG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX75-2FGG484I XC6SLX45-2FGG484I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $82.10 $65.10
Device Family Spartan-6 LX —
Logic Cells 74,637 43,661
Logic Elements / Slices 11,650 slices —
System Gates 3,170,304 —
Block RAM 4,824 Kbits (180 x 18 Kbit) 2,138,112 bits (2,088 Kb/s)
DSP Slices (DSP48A1) 132 58
User I/Os 280 —
Maximum Internal Frequency 667 MHz —
Process Technology 45 nm CMOS 45 nm low-power CMOS
Core Supply Voltage (VCCINT) 1.14 V to 1.26 V —
Auxiliary Supply Voltage (VCCAUX) 3.3 V —
Speed Grade -2 (mid-range) -2
Package 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch 484-ball BGA (FBGA-484)
Operating Temperature (Industrial) -40 °C to +100 °C (junction to +125 °C) —
Mounting Type Surface Mount (BGA) —
MSL Level 3 (168 hours) —
RoHS Status Compliant —
Family — Spartan-6 LX
Logic Slices — 6,822
Flip-Flops — 54,576
Maximum User I/O — 316
Package Dimensions — 23 x 23 mm, 1.0 mm ball pitch
Operating Temperature (I grade) — -40C to +100C (industrial)
Supply Voltage Core — 1.2 V typical
Clock Management Tiles — 6 CMT (4 DCM + 2 PLL)
Maximum I/O Speed — 800 Mbps LVDS
Memory Interface Support — DDR, DDR2, DDR3, LPDDR
Configuration Memory — AES-256 bitstream encryption
RoHS Compliance — Lead-free / RoHS compliant

Datasheets & Resources

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