XC6SLX9-2FTG256C vs XC6SLX9-N3FT256C Comparison
Detailed side-by-side comparison of XC6SLX9-2FTG256C by AMD and XC6SLX9-N3FT256C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX9-2FTG256C | XC6SLX9-N3FT256C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Unknown |
| Series | Spartan-6 LX | — |
| Device Logic Cells | 9,152 LE | — |
| Adaptive Logic Modules (ALMs) | 1,430 ALM | — |
| Configurable Logic Blocks (CLBs) | 715 CLB | — |
| Embedded Block RAM | 576 Kbits | — |
| Distributed RAM | 32 Kbits | — |
| DSP / Multiplier Blocks | 16 (18 x 18 multipliers) | — |
| Maximum User I/Os | 186 | — |
| Speed Grade | -2 (commercial) | N3 |
| Internal Performance | Up to 667 MHz | — |
| Process Technology | 45 nm low-power CMOS | — |
| Package | 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch | 256-FTBGA, 17 x 17 mm class |
| Operating Temperature | 0 C to 85 C (commercial) | — |
| Supply Voltage | 1.2 V core / 1.2 V-3.3 V I/O (per DS160) | — |
| Mounting Type | Surface Mount (BGA) | Surface mount |
| RoHS Status | Compliant (lead-free FTBGA) | unknown |
| Configuration Modes | SPI, JTAG, BPI, Master Serial | — |
| Device Type | — | Spartan-6 LX FPGA |
| Programmable Logic Cells | — | 9,152 cells |
| RAM Bits | — | 589,824 bits |
| I/O Count | — | 186 I/O |
| Technology | — | 45 nm |
| Nominal Supply Voltage | — | 1.2 V |
| Package Type | — | LBGA |
| Number of Terminals | — | 256 balls |
| Junction Temperature Range | — | 0°C to 85°C |
| Supply Voltage Range | — | 1.14 V to 1.26 V |
| Manufacturer Product Family | — | Spartan-6 LX |
| Device Category | — | Field-programmable gate array |
| Pin Count | — | 256 pins/balls |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |