XC6SLX9-2FTG256C vs XC6SLX9-N3FT256I Comparison

Detailed side-by-side comparison of XC6SLX9-2FTG256C by AMD and XC6SLX9-N3FT256I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX9-2FTG256C XC6SLX9-N3FT256I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Series Spartan-6 LX —
Device Logic Cells 9,152 LE —
Adaptive Logic Modules (ALMs) 1,430 ALM —
Configurable Logic Blocks (CLBs) 715 CLB —
Embedded Block RAM 576 Kbits —
Distributed RAM 32 Kbits —
DSP / Multiplier Blocks 16 (18 x 18 multipliers) —
Maximum User I/Os 186 —
Speed Grade -2 (commercial) —
Internal Performance Up to 667 MHz —
Process Technology 45 nm low-power CMOS —
Package 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch 256-LBGA
Operating Temperature 0 C to 85 C (commercial) —
Supply Voltage 1.2 V core / 1.2 V-3.3 V I/O (per DS160) —
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant (lead-free FTBGA) —
Configuration Modes SPI, JTAG, BPI, Master Serial —
Device Type — Spartan-6 LX Field Programmable Gate Array (FPGA)
Logic Elements — 9,152
I/O Count — 186
RAM Bits — 589,824
Package Description — 256-FTBGA surface-mount package, 17 mm x 17 mm
Supply Voltage Range — 1.14 V to 1.26 V
Operating Junction Temperature — -40°C to 100°C
Speed Designation — N3
Programmable Logic Type — FPGA
Configuration Memory — [DATA_NEEDED: configuration memory type and capacity]
I/O Standards — [DATA_NEEDED: supported I/O standards]
Operating Temperature Range — [DATA_NEEDED: full operating temperature range]
Lifecycle Status — [DATA_NEEDED: manufacturer lifecycle status]
RoHS — [DATA_NEEDED: RoHS status]
REACH — [DATA_NEEDED: REACH status]
Pin Count — 256 balls
Manufacturer — AMD

Datasheets & Resources

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