XC6SLX9-L1FT256I vs XC6SLX9-3FT256I Comparison

Detailed side-by-side comparison of XC6SLX9-L1FT256I by Xilinx and XC6SLX9-3FT256I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Xilinx
XC6SLX9-L1FT256I XC6SLX9-L1FT256I - Spartan-6 LX FPGA, 186 I/O | Xilinx

XC6SLX9-L1FT256I - Spartan-6 LX FPGA, 186 I/O | Xilinx

XC6SLX9-L1FT256I ✓ Active

Specification Comparison

Parameter XC6SLX9-L1FT256I XC6SLX9-3FT256I
Brand Xilinx AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Field-Programmable Gate Array (FPGA) Field Programmable Gate Array
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 9,152 cells 9,152 cells
Equivalent Logic Gates 589,824 gates —
User I/O 186 I/O —
Package 256-ball LBGA —
Total Package Balls 256 balls —
Logic Architecture 6-input LUT —
Speed Grade -1L -3
Temperature Grade Industrial Industrial
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Maximum Clock Frequency [DATA_NEEDED: maximum clock frequency] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
Configurable Logic Blocks — 715 CLBs
Internal Frequency — 667 MHz
I/O Sites — 186 I/O
Process Technology — 45 nm CMOS
Supply Voltage — 1.2 V
Operating Temperature — 0°C to 85°C
Package Type — FTBGA-256
Package Dimensions — 17 mm x 17 mm
Package Pitch — 1 mm
Terminal Count — 256 balls
Mounting Type — Surface Mount
Spartan-6 LX Speed-Grade Position — -3 has the highest performance
Package Outline — MS-034
Pricing — [DATA_NEEDED: verified unit price]

Datasheets & Resources

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