XC6SLX9-L1FT256I vs XC6SLX9-3FT256I 对比

详细并排对比 XC6SLX9-L1FT256I 出自 Xilinx 和 XC6SLX9-3FT256I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。

Xilinx

XC6SLX9-L1FT256I - Spartan-6 LX FPGA, 186 I/O | Xilinx

XC6SLX9-L1FT256I ✓ 量产中

AMD

XC6SLX9-3FT256I ✓ 量产中

参数	XC6SLX9-L1FT256I	XC6SLX9-3FT256I
品牌	Xilinx	AMD
分类	FPGA & CPLD	FPGA & CPLD
生命周期状态	有效	有效
Device Type	Field-Programmable Gate Array (FPGA)	Field Programmable Gate Array
FPGA Family	Spartan-6 LX	Spartan-6 LX
Logic Cells	9,152 cells	9,152 cells
Equivalent Logic Gates	589,824 gates	—
User I/O	186 I/O	—
封装	256-ball LBGA	—
Total Package Balls	256 balls	—
Logic Architecture	6-input LUT	—
Speed Grade	-1L	-3
Temperature Grade	Industrial	Industrial
Core Supply Voltage	[DATA_NEEDED: core supply voltage]	—
I/O Supply Voltage	[DATA_NEEDED: I/O supply voltage]	—
工作温度范围	[DATA_NEEDED: operating temperature range]	—
最大时钟频率	[DATA_NEEDED: maximum clock frequency]	—
Block RAM Capacity	[DATA_NEEDED: block RAM capacity]	—
DSP Slice Count	[DATA_NEEDED: DSP slice count]	—
RoHS 状态	[DATA_NEEDED: RoHS status]	[DATA_NEEDED: RoHS status]
REACH Status	[DATA_NEEDED: REACH status]	[DATA_NEEDED: REACH status]
Configurable Logic Blocks	—	715 CLBs
Internal Frequency	—	667 MHz
I/O Sites	—	186 I/O
Process Technology	—	45 nm CMOS
电源电压	—	1.2 V
工作温度	—	0°C to 85°C
Package Type	—	FTBGA-256
Package Dimensions	—	17 mm x 17 mm
Package Pitch	—	1 mm
Terminal Count	—	256 balls
安装类型	—	Surface Mount
Spartan-6 LX Speed-Grade Position	—	-3 has the highest performance
Package Outline	—	MS-034
Pricing	—	[DATA_NEEDED: verified unit price]