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Produkte (32725)

XCZU3EG-1UBVA530E - Zynq UltraScale+ SoC FPGA | AMD
XCZU3EG-1UBVA530E

XCZU3EG-1UBVA530E - Zynq UltraScale+ SoC FPGA | AMD

The AMD XCZU3EG-1UBVA530E is a Zynq UltraScale+ MPSoC (Multi-Processor System-on-Chip) that integrates a quad-core ARM Cortex-A53 application processor and a dual-core ARM Cortex-R5 real-time processor with an UltraScale+ programmable logic fabric. This device is housed in a 530-ball FCBGA package (16x9.5 mm) and is designed for high-performance embedded applications requiring both processing and hardware acceleration. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with FPGA programmable logic (PL) on a single die. This architecture allows designers to implement complex algorithms in hardware for high throughput and low latency while running operating systems and control software on the ARM cores. The PS and PL are connected via high-bandwidth AXI interfaces, enabling efficient data movement between software and hardware. Key features of the XCZU3EG-1UBVA530E include 154K+ logic cells, a 500 MHz maximum PL clock frequency, and a 1.2 GHz maximum PS clock frequency. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The UltraScale+ architecture provides advanced power management and security features, making it suitable for a variety of applications. The XCZU3EG-1UBVA530E is part of the Zynq UltraScale+ family, which offers scalability from the ZU2 to ZU19 devices. This specific variant, the EG (embedded graphics) class, includes a Mali-400 GPU for graphics and video processing. The device is manufactured using a 16nm process, providing a balance of performance and power efficiency. Typical applications for the XCZU3EG-1UBVA530E include software-defined radio, machine vision, industrial automation, and aerospace and defense systems. The combination of ARM cores and FPGA fabric makes it ideal for applications that require real-time processing, high-speed data acquisition, and flexible I/O. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO, etc.) must be powered up in the correct order to prevent damage. Use the AMD power management reference design and follow the guidelines in the Zynq UltraScale+ Technical Reference Manual (UG1085) for reliable operation.

USD $100,00 Auf Lager
XCZU3EG-2SFVA625I - Zynq UltraScale+ MPSoC EG | AMD
XCZU3EG-2SFVA625I

XCZU3EG-2SFVA625I - Zynq UltraScale+ MPSoC EG | AMD

The AMD XCZU3EG-2SFVA625I is a Zynq UltraScale+ MPSoC EG family device that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with programmable logic based on the UltraScale+ architecture. This System-on-Chip (SoC) is housed in a 625-ball FCBGA package measuring 21x21 mm and operates with a maximum clock frequency of 1.3 GHz for the application processor, 600 MHz for the real-time processor, and 533 MHz for the programmable logic. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines multi-core ARM processing with FPGA fabric on a single die. This architecture enables designers to implement complex systems that require both high-level software control and hardware-accelerated data processing. The EG variant is optimized for embedded applications that need a balance of processing power, programmable logic capacity, and I/O flexibility, making it suitable for a wide range of industrial, aerospace, and defense applications. Key features of the XCZU3EG-2SFVA625I include 154K+ logic cells, 360 DSP slices, and 7.6 Mb of block RAM, providing substantial programmable logic resources for custom hardware acceleration. The device supports a wide range of high-speed serial transceivers and general-purpose I/O, enabling flexible system integration. The processing system includes a memory management unit, cache coherency, and a rich set of peripherals, including USB 3.0, DisplayPort, SATA, and PCIe, which are essential for modern embedded systems. The device is built on TSMC's 16nm FinFET process technology, which delivers high performance with low power consumption. The UltraScale+ architecture includes advanced clocking resources, high-bandwidth memory interfaces, and integrated blocks for PCIe and Ethernet, reducing the need for external components. The processing system and programmable logic are connected through a high-bandwidth AXI interconnect, enabling efficient data movement between software and hardware domains. Typical applications for the XCZU3EG-2SFVA625I include software-defined radio, industrial motor control, machine vision, and aerospace avionics. The device's combination of real-time processing, application processing, and programmable logic makes it ideal for systems that require both deterministic control and complex signal processing. The device operates over a junction temperature range of -40°C to 100°C, making it suitable for harsh environments. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require a well-designed power distribution network to ensure reliable operation at high clock frequencies. The device also requires a configuration source, such as QSPI flash or SD card, to load the bitstream at power-up.

USD $12,50 Auf Lager
XCZU42DR-1FSVE1156E - Zynq UltraScale+ RFSoC Gen 1 | AMD
XCZU42DR-1FSVE1156E

XCZU42DR-1FSVE1156E - Zynq UltraScale+ RFSoC Gen 1 | AMD

The AMD XCZU42DR-1FSVE1156E is a Zynq UltraScale+ RFSoC Gen 1 device that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and a large FPGA fabric with 489K+ logic cells. This System-on-Chip (SoC) is housed in a 1156-FCBGA (35x35 mm) package and operates with a maximum clock frequency of 500 MHz for the programmable logic and 1.2 GHz for the application processor. A Zynq UltraScale+ RFSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) and, in the RFSoC family, integrated RF data converters. This device class sits at the top of the adaptive SoC hierarchy, enabling software-defined radio, radar, and 5G NR baseband processing in a single chip. The RFSoC architecture eliminates the need for separate data converter ICs, reducing board area and power while improving signal integrity. Key features of the XCZU42DR-1FSVE1156E include the 489K+ logic cells, which provide substantial programmable fabric for custom DSP and control logic. The quad-core Cortex-A53 cluster runs at up to 1.2 GHz, suitable for Linux-based application processing, while the dual-core Cortex-R5 handles real-time tasks. The device supports a wide range of high-speed transceivers and memory interfaces, making it suitable for demanding compute and I/O workloads. Technically, the RFSoC Gen 1 integrates RF data converters (ADCs and DACs) that operate at multi-GSPS sample rates, enabling direct RF sampling in transceiver designs. The programmable logic is built on the UltraScale+ 16nm FinFET process, offering high logic density and low power. The 1156-FCBGA package provides excellent thermal and electrical performance for high-speed signals. Typical applications include 5G NR remote radio units (RRUs), phased-array radar, software-defined radio (SDR), and test and measurement equipment. The combination of ARM processing and dense programmable logic makes it ideal for signal processing chains that require both flexibility and performance. When designing with this device, careful attention must be paid to power supply sequencing, clocking, and thermal management. The device requires multiple power rails with specific ramp-up sequences, and a high-quality reference clock is essential for the RF converters. Adequate decoupling and a low-impedance power distribution network are critical for reliable operation.

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XCZU42DR-2FSVE1156I - RFSoC, 489K Logic Cells | AMD
XCZU42DR-2FSVE1156I

XCZU42DR-2FSVE1156I - RFSoC, 489K Logic Cells | AMD

The AMD XCZU42DR-2FSVE1156I is a Zynq UltraScale+ RFSoC (Radio Frequency System-on-Chip) that integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and a large FPGA fabric with 489K+ logic cells. It operates at processor speeds of 533MHz (Cortex-A53) and 1.333GHz (Cortex-R5), and is housed in a 1156-FCBGA (35x35mm) package. This device is designed for high-performance signal processing and wireless communications. A Zynq UltraScale+ RFSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) and, uniquely, integrated RF data converters (RF-ADC and RF-DAC). This integration eliminates the need for separate discrete converters, reducing board space, power, and latency. The RFSoC family sits within the broader adaptive SoC category, bridging FPGA flexibility with processor-based software programmability. Key features include the 489K logic cells, 533MHz/1.333GHz processor clocks, and the 1156-FCBGA package. The 'I' suffix indicates an industrial temperature grade (-40C to +100C), making it suitable for demanding environments. The '2' speed grade offers a balance of performance and power. The integrated RF converters support direct RF sampling, simplifying transceiver designs. Technically, the device leverages AMD's UltraScale+ 16nm FinFET process, providing high logic density and low power. The RFSoC architecture includes dedicated DSP slices, block RAM, and high-speed transceivers, enabling complex digital signal processing. The programmable logic can be configured for custom algorithms, while the ARM cores handle control and protocol processing. Typical applications include 5G NR base stations, phased array radar, test and measurement equipment, and satellite communications. The integrated RF data converters and high-speed processing make it ideal for software-defined radio (SDR) systems. When designing with this device, careful attention must be paid to power supply sequencing, clocking, and thermal management. The 1156-FCBGA package requires a multi-layer PCB with adequate decoupling and a thermal solution to dissipate heat from the high-performance cores and RF converters.

USD $3.950,00 Auf Lager
XCZU47DR-1FFVE1156E - RFSoC, 930K Logic Cells | AMD
XCZU47DR-1FFVE1156E

XCZU47DR-1FFVE1156E - RFSoC, 930K Logic Cells | AMD

The AMD XCZU47DR-1FFVE1156E is a Zynq® UltraScale+™ RFSoC, a heterogeneous System-on-Chip (SoC) that integrates a Quad-core ARM® Cortex®-A53 MPCore™ application processor and a Dual-core ARM® Cortex™-R5 real-time processor with a substantial FPGA fabric. This device is housed in a 1156-FCBGA (35x35) package and is part of the Zynq UltraScale+ RFSoC family, designed for high-performance signal processing and wireless communications. A Zynq UltraScale+ RFSoC is a class of adaptive SoC that combines a multi-core ARM processing system (PS) with programmable logic (PL) and, in this 'DR' variant, integrated RF data converters. This integration eliminates the need for separate discrete data converters, reducing board space, power, and latency in RF systems. The architecture allows for a single-chip solution that can handle digital signal processing, control, and RF front-end tasks. Key features of the XCZU47DR-1FFVE1156E include 930K+ logic cells, a 500MHz maximum frequency for the FPGA fabric, and a 1.2GHz maximum frequency for the ARM Cortex-A53 processor. The device supports a wide range of I/O standards and includes features such as DMA and WDT. The operating temperature range is 0°C to 100°C (Tj), making it suitable for commercial and industrial environments. The RFSoC architecture integrates high-speed analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) directly into the device, enabling direct RF sampling and synthesis. This reduces the complexity of the analog front-end and improves system performance by eliminating the need for multiple intermediate frequency (IF) stages. The device also includes a comprehensive set of peripherals and interfaces for system integration. Typical applications for the XCZU47DR-1FFVE1156E include 5G wireless base stations, phased array radar, test and measurement equipment, and software-defined radio (SDR) systems. Its high logic density and integrated RF converters make it ideal for applications requiring high bandwidth and low latency. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 1156-FCBGA package requires a robust PCB layout with adequate ground planes and thermal vias to ensure reliable operation at high power levels.

USD $17.500,00 Auf Lager
XCZU47DR-2FFVE1156I - RFSoC, 930K Logic Cells | AMD
XCZU47DR-2FFVE1156I

XCZU47DR-2FFVE1156I - RFSoC, 930K Logic Cells | AMD

The AMD XCZU47DR-2FFVE1156I is a Zynq UltraScale+ RFSoC, a heterogeneous System-on-Chip (SoC) that integrates a Quad-core ARM Cortex-A53 application processor, a Dual-core ARM Cortex-R5 real-time processor, and a large programmable logic (FPGA) fabric with over 930,000 logic cells. This device is housed in a 1156-pin FCBGA package (35x35 mm) and is designed for high-performance signal processing and wireless communications. A Zynq UltraScale+ RFSoC is a class of adaptive SoC that monolithically integrates data converters (ADCs and DACs) alongside the programmable logic and processing system, eliminating the need for separate converter chips in radio systems. This integration reduces board space, power, and latency, making it ideal for applications like 5G base stations, radar, and test equipment. Key features include the ARM Cortex-A53 application processor running at up to 1.333 GHz, the ARM Cortex-R5 real-time processor at up to 533 MHz, and the 930K+ logic cells for custom hardware acceleration. The device also supports high-speed transceivers and DDR4 memory interfaces, enabling high-throughput data movement. The -2 speed grade indicates a high-performance variant, and the I suffix denotes an industrial temperature grade (-40C to +100C). The RFSoC architecture combines the flexibility of FPGA fabric with the performance of dedicated converters, allowing designers to implement complex DSP chains in hardware while maintaining software programmability. The integrated converters support direct RF sampling, reducing analog front-end complexity. The device is supported by AMD's Vivado design suite and Vitis unified software platform. Typical applications include 5G NR base stations, phased array radar, software-defined radio, and medical imaging systems. The high logic cell count and processing power make it suitable for beamforming, channel estimation, and real-time signal analysis. The industrial temperature grade ensures reliable operation in harsh environments. When designing with this device, careful attention must be paid to power supply sequencing and decoupling, as the RFSoC has multiple power rails with specific requirements. The package pinout files from AMD (UG1075) should be consulted for accurate pin assignments.

USD $22.500,00 Auf Lager
XCZU4CG-1FBVB900E - Zynq UltraScale+ MPSoC CG | AMD
XCZU4CG-1FBVB900E

XCZU4CG-1FBVB900E - Zynq UltraScale+ MPSoC CG | AMD

The AMD XCZU4CG-1FBVB900E is a Zynq UltraScale+ MPSoC CG device that integrates a dual-core ARM Cortex-A53 application processor and a dual-core ARM Cortex-R5 real-time processor with an UltraScale+ FPGA fabric. It comes in a 900-ball FCBGA package (31x31 mm) and is designed for high-performance embedded applications requiring both processing and programmable logic. A System-on-Chip (SoC) combines multiple components of a computer or electronic system into a single chip. The Zynq UltraScale+ MPSoC family specifically merges a multi-core ARM processing system (PS) with programmable logic (PL), enabling hardware-software co-design. This architecture allows designers to implement custom accelerators, high-speed I/O, and real-time control in the PL while running operating systems like Linux on the PS. Key features include 192K+ logic cells, 500 MHz PS clock, 1.2 GHz application processor clock, and support for DDR4, LPDDR4, and 32-bit/64-bit memory interfaces. The device also includes UltraScale+ programmable logic with 461K system logic cells, 21.1 Mb block RAM, and 1,152 DSP slices. It supports a wide range of I/O standards including LVCMOS, LVDS, and high-speed transceivers. The architecture combines the ARM Cortex-A53 application processor for high-level operating systems, the Cortex-R5 for real-time deterministic processing, and the FPGA fabric for custom logic. This heterogeneous computing platform enables efficient task partitioning, with the PS handling control and communication while the PL accelerates data-intensive algorithms. The device also features advanced security, power management, and system monitoring capabilities. Typical applications include software-defined radio, industrial automation, medical imaging, aerospace and defense systems, and data center acceleration. The combination of high-performance processing, programmable logic, and rich I/O makes it suitable for edge computing and embedded vision systems. When designing with this device, careful attention must be paid to power supply sequencing, decoupling, and thermal management. The 900-ball FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. AMD provides reference designs and power management solutions to simplify the design process.

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XCZU4EV-1SFVC784E - Zynq UltraScale+ MPSoC EV | AMD
XCZU4EV-1SFVC784E

XCZU4EV-1SFVC784E - Zynq UltraScale+ MPSoC EV | AMD

The AMD XCZU4EV-1SFVC784E is a Zynq® UltraScale+™ MPSoC EV device that integrates a quad-core ARM® Cortex®-A53 MPCore™ application processor, a dual-core ARM® Cortex™-R5 real-time processor, and an ARM Mali™-400 MP2 graphics processing unit into a single System-on-Chip (SoC). This device is housed in a 784-pin FCBGA package (23x23 mm) and is designed for high-performance embedded applications requiring both processing and programmable logic. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) fabric on a single die. This architecture enables designers to implement custom hardware accelerators, high-speed I/O interfaces, and complex signal processing chains in the PL while running operating systems and application software on the PS. The EV variant specifically adds a video codec unit (VCU) for hardware-accelerated video encoding and decoding. The XCZU4EV-1SFVC784E features 192K+ logic cells in the programmable logic fabric, providing substantial capacity for custom logic designs. The processing system operates at speeds up to 1.2 GHz for the Cortex-A53 cores, 600 MHz for the Cortex-R5 cores, and 500 MHz for the Mali-400 GPU. This combination of processing power and programmable logic makes it suitable for a wide range of applications. Key features include support for DDR4 memory interfaces, high-speed transceivers, and a comprehensive set of I/O standards. The device supports multiple boot modes including Quad-SPI flash, SD card, and JTAG. The 784-pin FCBGA package provides excellent thermal and electrical performance for high-speed designs. Typical applications include video processing systems, software-defined radio, industrial automation, medical imaging, and aerospace/defense systems. The device's ability to handle both real-time processing and complex algorithms makes it ideal for edge computing and embedded vision applications. When designing with this device, careful attention must be paid to power supply sequencing, clocking architecture, and thermal management. The device requires multiple power rails with specific voltage levels and sequencing requirements as detailed in the power management documentation.

USD $385,00 Auf Lager
XCZU4EV-2SFVC784I - Zynq UltraScale+ MPSoC EV | AMD
XCZU4EV-2SFVC784I

XCZU4EV-2SFVC784I - Zynq UltraScale+ MPSoC EV | AMD

The AMD XCZU4EV-2SFVC784I is a Zynq UltraScale+ MPSoC EV device that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with programmable logic. This System-on-Chip (SoC) combines the flexibility of an FPGA with the performance of a multi-core processing system, making it suitable for a wide range of embedded applications. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that merges a processing system (PS) with programmable logic (PL) on a single die. The PS contains the ARM cores, memory interfaces, and peripheral controllers, while the PL provides reconfigurable hardware acceleration. This architecture allows designers to implement complex algorithms in hardware for high performance and low latency, while the software-defined PS handles system-level tasks and connectivity. Key features of the XCZU4EV-2SFVC784I include 192K+ logic cells, 533MHz for the Cortex-R5, 600MHz for the Mali-400 MP2, and 1.3GHz for the Cortex-A53. The device is housed in a 784-FCBGA package measuring 23x23 mm, offering 252 user I/O pins. This combination of processing power and programmable logic makes it ideal for applications requiring both high-level operating systems and real-time, low-latency control. The XCZU4EV-2SFVC784I is built on a 16nm process technology, providing a balance of performance and power efficiency. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The integrated memory controllers support DDR4, LPDDR4, and other memory types, enabling high-bandwidth data processing. Typical applications include software-defined radio, video processing, industrial automation, and aerospace and defense systems. The combination of ARM cores and FPGA fabric allows for flexible, high-performance solutions that can be adapted to changing requirements. When designing with this device, careful attention must be paid to power supply sequencing, clocking, and thermal management. The 784-FCBGA package requires a multi-layer PCB with adequate decoupling and thermal vias to ensure reliable operation at high clock speeds.

USD $240,00 Auf Lager
XCZU5CG-1SFVC784E - Zynq UltraScale+ MPSoC, 256K Logic Cells | AMD
XCZU5CG-1SFVC784E

XCZU5CG-1SFVC784E - Zynq UltraScale+ MPSoC, 256K Logic Cells | AMD

The AMD (Xilinx) XCZU5CG-1SFVC784E is a Zynq UltraScale+ MPSoC integrating a programmable logic fabric with a heterogeneous multiprocessing system on a single die, housed in a 784-ball FCBGA package measuring 23x23 mm. The CG (Cost-Grade) variant supplies 256K+ system logic cells with the dual-core ARM Cortex-R5 real-time processor, dual-core ARM Cortex-A53 application processor subsystem with CoreSight debug, and the Mali-400 MP2 GPU. The part operates across 500 MHz fabric / 1.2 GHz PS clock domains and supports a 0.85 V core supply built on a 20 nm process node. A Multi-Processor System-on-Chip (MPSoC) merges hardened ARM cores with programmable FPGA logic, enabling designers to partition deterministic control tasks to the Cortex-R5, high-level application code to the Cortex-A53 running Linux, and custom accelerators into the FPGA fabric. Within the broader taxonomy, the Zynq UltraScale+ MPSoC sits above single-core Cortex-M microcontrollers and below discrete CPU+FPGA board-level designs, providing hardware/software co-design in one silicon device. Architecturally the CG family omits the video codec unit (VCU) and the high-end Programmable Logic density of the EG/EV variants, but retains the same Memory Protection Unit (XMPU) and DDR4 controller infrastructure. Designers benefit from the integrated GTH/GTY transceivers, AXI4 high-performance interconnects, and tight PS-PL coupling without external bridges. Typical applications include industrial machine vision, motor control drives, edge AI inference gateways, software-defined radio front-ends, and automotive driver-assistance ECUs where deterministic response and Linux-class processing coexist on one die. Designers should validate DDR4 routing against the Zynq UltraScale+ PCB guidelines (UG1075) and ensure the heat spreader/FCLGA lid is properly attached with a thermal interface material, since the 784-FCBGA package relies on top-side cooling for sustained workloads.

USD $1.100,00 Auf Lager
XCZU5EV-1SFVC784E - Zynq UltraScale+ MPSoC EV | AMD
XCZU5EV-1SFVC784E

XCZU5EV-1SFVC784E - Zynq UltraScale+ MPSoC EV | AMD

The AMD XCZU5EV-1SFVC784E is a Zynq® UltraScale+™ MPSoC EV device that integrates a quad-core ARM® Cortex®-A53 application processor, a dual-core ARM® Cortex™-R5 real-time processor, and an ARM Mali™-400 MP2 graphics processing unit with programmable logic. This System-on-Chip (SoC) is housed in a 784-pin FCBGA package (23x23 mm) and is designed for high-performance embedded applications requiring both processing and hardware acceleration. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with FPGA programmable logic (PL) on a single die. This architecture allows designers to implement complex algorithms in hardware for performance and power efficiency while maintaining the flexibility of software-defined control. The EV family specifically adds video codec units, making it ideal for multimedia and vision applications. Key features of the XCZU5EV-1SFVC784E include 256K+ logic cells, a 500MHz Cortex-A53 processor, a 600MHz Cortex-R5 processor, and a 1.2GHz Mali-400 MP2 GPU. The device supports high-speed transceivers and a wide range of I/O standards, enabling high-bandwidth data movement. The programmable logic is based on the UltraScale+ architecture, offering advanced clocking, DSP slices, and block RAM resources. Technically, the XCZU5EV-1SFVC784E is fabricated on a 16nm process, providing a balance of performance and power. The PS and PL are connected via a high-bandwidth AXI interconnect, allowing low-latency communication. The device includes security features such as AES and RSA for secure boot, and supports a comprehensive set of peripherals including USB, PCIe, and Ethernet. Typical applications include software-defined radio, machine vision, medical imaging, and aerospace/defense systems. The combination of ARM cores and FPGA fabric makes it suitable for edge computing where low latency and high throughput are critical. The Mali-400 GPU enables graphical user interfaces and video processing. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO) require proper filtering and sequencing to ensure reliable operation. The FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals.

USD $360,00 Auf Lager
XCZU5EV-2SFVC784I - Zynq UltraScale+ MPSoC EV | AMD
XCZU5EV-2SFVC784I

XCZU5EV-2SFVC784I - Zynq UltraScale+ MPSoC EV | AMD

The AMD XCZU5EV-2SFVC784I is a Zynq® UltraScale+™ MPSoC EV device that integrates a quad-core ARM® Cortex®-A53 MPCore™ application processor, a dual-core ARM® Cortex™-R5 real-time processor, and an ARM Mali™-400 MP2 graphics processing unit with programmable logic. This System-on-Chip (SoC) is housed in a 784-pin FCBGA package (23x23 mm) and is designed for high-performance embedded applications requiring both processing and hardware acceleration. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM-based processing system (PS) with FPGA programmable logic (PL) on a single die. This architecture allows designers to implement complex algorithms in hardware for high throughput and low latency, while the PS handles operating systems and control tasks. The EV family specifically adds video codec units, making it ideal for multimedia and vision applications. Key features of the XCZU5EV-2SFVC784I include 256K+ logic cells, a maximum operating frequency of 1.3 GHz for the Cortex-A53 cores, 600 MHz for the Cortex-R5 cores, and 533 MHz for the Mali-400 GPU. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The -2 speed grade indicates a balanced performance-power profile. The device is built on TSMC's 16nm FinFET process technology, offering a good balance of performance and power efficiency. The programmable logic is based on the UltraScale+ architecture, featuring 6-input look-up tables (LUTs), block RAM, and DSP slices. The integrated video codec supports H.264/H.265 encoding and decoding, offloading these tasks from the CPU. Typical applications include video surveillance systems, medical imaging equipment, automotive driver assistance systems, and software-defined radio. The combination of ARM processing, FPGA flexibility, and video codec support makes it a versatile platform for edge computing and vision-based AI. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO, etc.) require proper filtering and sequencing to ensure reliable operation. The FCBGA package requires a multi-layer PCB with controlled impedance traces for high-speed signals.

USD $2.300,00 Auf Lager
XCZU6CG-1FFVC900E - Zynq UltraScale+ MPSoC CG, Dual A53/R5, 900-FCBGA | AMD
XCZU6CG-1FFVC900E

XCZU6CG-1FFVC900E - Zynq UltraScale+ MPSoC CG, Dual A53/R5, 900-FCBGA | AMD

The AMD (formerly Xilinx) XCZU6CG-1FFVC900E is a heterogeneous Zynq UltraScale+ MPSoC CG device integrating a dual-core ARM Cortex-A53 application processor (up to 1.2 GHz) with a dual-core ARM Cortex-R5 real-time processor (up to 500 MHz), CoreSight debug, and approximately 469K+ programmable logic cells, all housed in a 900-ball FCBGA (31x31 mm) package. The CG subfamily is the cost-optimized dual-core variant without the integrated H.264/H.265 video codec, which AMD explicitly targets at industrial motor control and sensor-fusion workloads. The -1 speed grade and E (0C to +100C) extended temperature grade make this part well suited for industrial and edge deployments where power-constrained enclosures and harsh environments are common. A heterogeneous MPSoC (Multiprocessor System-on-Chip) is a class of integrated device that tightly couples deterministic real-time microcontrollers, application-class CPUs, graphics/video engines, and hardware-programmable FPGA fabric on a single die. The Zynq UltraScale+ family sits at the top of AMD's SoC taxonomy: heterogeneous MPSoC > Zynq UltraScale+ > Zynq-7000 > earlier Zynq devices, and competes directly with Microchip PolarFire SoC, NXP Layerscape, and TI Jacinto in the embedded edge AI and industrial control segment. Key features include dual ARM Cortex-A53 cores with NEON/SIMD and ARMv8-A 64-bit support, dual ARM Cortex-R5 cores with lock-step capability, ARM Mali-400MP2 GPU, integrated memory controller supporting DDR4/LPDDR4 with ECC, high-speed transceivers (GTH/GTX), common-use peripherals such as USB 2.0, Gigabit Ethernet, CAN, SPI, I2C, UART, and 256-bit AES/RSA hardware root of trust for secure boot. The 900-FCBGA package exposes approximately 256 user I/O pins grouped into high-range, high-performance, and high-density banks. The programmable logic portion contains roughly 469K system logic cells plus DSP slices, block RAM, and UltraRAM, all accessible through the ARM PS-PL AXI interconnect. Designers can implement custom peripherals, hardware accelerators, and vision pipelines in the PL fabric, while the hardened PS handles real-time and application tasks. The Vivado and Vitis toolchains from AMD provide C/C++, RTL, and high-level synthesis flows. Typical applications include industrial motor drives, robotics, sensor fusion gateways, machine-vision controllers, 5G edge radio units, automotive ADAS prototyping, and medical imaging. The CG subfamily is optimal when video encode/decode is not needed but deterministic real-time control, Linux application processing, and FPGA acceleration are all required. When designing with this device, allocate PCB power-delivery for the multi-rail requirement (typically 0.85 V VCCINT, 1.8 V VCCAUX, 0.9 V DDR4 VTT, plus 3.3 V I/O). Proper decoupling, ground plane stitching under the BGA, and length-matched DDR4 address/command traces are critical; AMD UG583 and UG1075 are the primary hardware-design references. This page synthesizes distributor pricing, validated drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.

USD $4.100,00 Auf Lager
XCZU7CG-L2FFVF1517E - Zynq UltraScale+ MPSoC CG | AMD
XCZU7CG-L2FFVF1517E

XCZU7CG-L2FFVF1517E - Zynq UltraScale+ MPSoC CG | AMD

The AMD XCZU7CG-L2FFVF1517E is a Zynq UltraScale+ MPSoC CG device that integrates a dual-core ARM Cortex-A53 application processor and a dual-core ARM Cortex-R5 real-time processor with an UltraScale+ programmable logic fabric. This System-on-Chip (SoC) is housed in a 1517-ball FCBGA package (40x40 mm) and is designed for high-performance embedded applications requiring both processing and hardware acceleration. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines multi-core ARM processors with FPGA fabric on a single die. The CG variant is the cost-optimized family, offering a balanced mix of processing system (PS) and programmable logic (PL) resources. The device supports a wide range of operating systems including Linux, VxWorks, and bare-metal applications, making it a versatile choice for edge computing, industrial automation, and aerospace systems. Key features of the XCZU7CG-L2FFVF1517E include 504K+ logic cells, 533 MHz maximum frequency for the Cortex-A53 cores, and 1.3 GHz for the Cortex-R5 cores. The device also includes 256 KB of on-chip memory, high-speed transceivers, and a comprehensive set of I/O interfaces. The 'L2' speed grade indicates a high-performance variant, and the 'E' suffix denotes an extended temperature range (-40°C to +100°C). From an architectural perspective, the XCZU7CG integrates a quad-core ARM Cortex-A53 MPCore with CoreSight debug, a dual-core ARM Cortex-R5 with CoreSight, and a Mali-400 MP2 GPU. The programmable logic is based on the UltraScale+ architecture, featuring 6-input LUTs, block RAM, and DSP slices. The device supports PCIe Gen3, USB 3.0, DisplayPort, and Gigabit Ethernet, providing extensive connectivity options. Typical applications include software-defined radio, machine vision, autonomous driving, and data center acceleration. The combination of high-performance processing and reconfigurable logic allows designers to implement complex algorithms with low latency and high throughput. When designing with this device, careful attention must be paid to power supply sequencing, decoupling, and thermal management. The FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. AMD provides comprehensive reference designs and documentation to facilitate development.

USD $990,00 Auf Lager
XCZU7EV-1FFVC1156E - Zynq UltraScale+ MPSoC EV | AMD
XCZU7EV-1FFVC1156E

XCZU7EV-1FFVC1156E - Zynq UltraScale+ MPSoC EV | AMD

The AMD XCZU7EV-1FFVC1156E is a Zynq UltraScale+ MPSoC EV device that integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 graphics processing unit with programmable logic. It is housed in a 1156-ball FCBGA package (35x35 mm) and operates with a core voltage of 0.85V. The device features 504K+ logic cells and supports speeds of 500MHz, 600MHz, and 1.2GHz for the respective processor subsystems. A Zynq UltraScale+ MPSoC is a multiprocessor system-on-chip that combines a hardened processing system (PS) with programmable logic (PL) on a single device. This architecture enables designers to implement complex embedded systems with both software flexibility and hardware acceleration. The EV variant specifically targets video codec applications, providing hardware-accelerated H.264/H.265 encoding and decoding capabilities. Key features of the XCZU7EV-1FFVC1156E include the 504K+ logic cells for extensive programmable logic, the quad-core A53 application processor for high-performance computing, and the Mali-400 MP2 GPU for graphics acceleration. The device also supports a wide range of high-speed serial transceivers and memory interfaces, making it suitable for demanding applications. The device is built on TSMC's 16nm process technology, offering a balance of performance and power efficiency. The programmable logic is based on the UltraScale+ architecture, which provides advanced features such as integrated block RAM, DSP slices, and high-speed transceivers. The processing system includes a comprehensive set of peripherals, including USB, PCIe, and Ethernet controllers. Typical applications for the XCZU7EV-1FFVC1156E include video processing and surveillance systems, 5G wireless infrastructure, industrial automation, and automotive ADAS. The combination of high-performance processing and programmable logic makes it ideal for applications requiring both software flexibility and hardware acceleration. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO, etc.) require proper sequencing to ensure reliable operation. Additionally, the high-speed transceivers require careful PCB layout to maintain signal integrity.

USD $895,00 Auf Lager
XCZU7EV-2FFVC1156I - Zynq UltraScale+ MPSoC EV, 504K Logic Cells | AMD
XCZU7EV-2FFVC1156I

XCZU7EV-2FFVC1156I - Zynq UltraScale+ MPSoC EV, 504K Logic Cells | AMD

The AMD XCZU7EV-2FFVC1156I is a Zynq UltraScale+ MPSoC EV device that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with a programmable FPGA fabric. This System-on-Chip (SoC) is housed in a 1156-ball FCBGA package measuring 35x35 mm and operates with a maximum clock frequency of 1.3 GHz for the Cortex-A53 cores, 600 MHz for the Cortex-R5 cores, and 533 MHz for the FPGA fabric. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with programmable logic (PL) on a single device. This architecture enables designers to implement complex algorithms in hardware for high throughput while maintaining the flexibility of software-based control. The EV variant specifically targets video codec applications, providing hardware-accelerated H.264/H.265 encode and decode capabilities that offload the processing system. Key features of the XCZU7EV-2FFVC1156I include 504K+ logic cells, 34.9 Mb of block RAM, and 1,152 DSP slices in the programmable logic. The device supports a wide range of I/O standards including LVCMOS, LVDS, and high-speed transceivers. The -2 speed grade offers a balanced performance-power trade-off, making it suitable for a variety of embedded applications. The processing system includes a memory management unit, cache coherence, and a rich set of peripherals such as USB 3.0, DisplayPort, SATA, and PCIe. The device also features advanced security with AES and RSA decryption, and supports secure boot. The integration of these capabilities reduces system complexity and bill-of-materials cost. Typical applications include video surveillance systems, medical imaging equipment, software-defined radio, and automotive driver assistance systems. The combination of high-performance processing and programmable logic makes it ideal for edge computing and AI inference workloads. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require a controlled power-up sequence to prevent latch-up or damage. A dedicated power management IC is recommended to ensure reliable operation.

USD $895,00 Auf Lager
XCZU9CG-L2FFVB1156E - Zynq UltraScale+ MPSoC CG, 599K+ Logic Cells | AMD
XCZU9CG-L2FFVB1156E

XCZU9CG-L2FFVB1156E - Zynq UltraScale+ MPSoC CG, 599K+ Logic Cells | AMD

The AMD (formerly Xilinx) XCZU9CG-L2FFVB1156E is a Zynq UltraScale+ MPSoC in the CG (Cost-Optimized) family, integrating a Dual-core ARM Cortex-A53 MPCore application processor with CoreSight, a Dual-core ARM Cortex-R5 real-time processor with CoreSight, and 599K+ UltraScale+ FPGA logic cells in a single 1156-ball FCBGA (35x35 mm) package. The part operates at -2 (extended) speed grade and is offered as an E (engineering sample / standard) temperature grade device, supporting the heterogeneous compute requirements of advanced embedded systems. A Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) is a class of adaptive SoC devices that tightly couples an FPGA fabric with multi-core ARM CPUs, GPU, and real-time controllers on a single die. Within AMD's portfolio, Zynq UltraScale+ devices sit at the top of the MPSoC hierarchy under the Adaptive Compute Acceleration Platform (ACAP) family, preceding Versal devices; the CG sub-family omits the Mali GPU and Video Codec Unit to reduce silicon cost while retaining the A53 + R5 + FPGA triad - a popular middle-ground for compute-intensive embedded designs that do not require on-chip graphics. Key features of the XCZU9CG-L2FFVB1156E include up to 599K logic cells, an extensive DDR4/LPDDR4 memory controller subsystem, integrated Programmable Logic (PL) hardening blocks (DSP48E2, UltraRAM, BRAM), and rich connectivity with high-speed transceivers (GTH), PCIe Gen2/3, SATA, DisplayPort, and USB 3.0 controllers. The device is built on TSMC's 16nm FinFET process and supports MultiBoot, partial reconfiguration, and platform management via PMU + CSU. The 1156-ball FCBGA package offers a 35x35 mm body compatible with the ZU7CG / ZU9EG / ZU15EG stack, enabling footprint-scalable design. The architecture integrates high-speed serial interfaces directly into the PL through GTH transceivers supporting up to 16.3 Gb/s line rates. Security features include ARM TrustZone, secure boot, hardware root of trust, and AES/SHA acceleration engines. The embedded programmers' view exposes four ARM cores through separate SMP/AMP clusters, allowing Linux-and-RTOS concurrent operation with deterministic real-time response. Typical applications include industrial machine vision, 5G baseband preprocessing, ADAS sensor fusion, medical imaging, and military/aerospace signal processing. The CG sub-family cost-down makes the device attractive when the Mali GPU is not needed but ARM Cortex-A53 + FPGA horsepower is still required. Designers also use the ZU9CG in IoT edge gateways, software-defined radio front-ends, and broadcast video processing at 4K/8K resolutions. When designing with the XCZU9CG-L2FFVB1156E, ensure that the selected reference design accommodates the FCBGA-1156 footprint thermal requirements - the package does not expose a thermal pad in the conventional sense but requires 4-8 stacked PCB layers with microvia stitching for signal and ground integrity. Power sequencing of MIO banks and PS/PL voltage rails must follow UG1085 / UG1087 (Zynq UltraScale+ PCB Design Guide); designers usually employ a UCD90120A or equivalent sequencer. The device must be paired with an AMD-supported JTAG programmer (Xilinx Platform Cable USB II or SmartLynq+). This page synthesizes distributor availability, drop-in same-family and same-package alternatives, and practical design notes not consolidated into a single document on the AMD datasheet site.

USD $2.100,00 Auf Lager
XCZU9EG-1FFVB1156E - Zynq UltraScale+ MPSoC EG | AMD
XCZU9EG-1FFVB1156E

XCZU9EG-1FFVB1156E - Zynq UltraScale+ MPSoC EG | AMD

The AMD XCZU9EG-1FFVB1156E is a Zynq UltraScale+ MPSoC EG family system-on-chip (SoC) that integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 graphics processing unit with programmable logic. It is housed in a 1156-ball FCBGA package (35x35 mm) and is designed for high-performance embedded applications requiring both processing and hardware acceleration. A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM-based processing system (PS) with Xilinx programmable logic (PL) on a single device. The EG variant is optimized for embedded and industrial applications, offering a balance of processing power, logic density, and I/O capabilities. This architecture enables designers to implement complex algorithms in hardware while maintaining software flexibility. Key features include 599,550 logic cells, 32.1 Mb of block RAM, and 2,520 DSP slices in the programmable logic. The processing system operates at speeds up to 1.2 GHz for the Cortex-A53, 600 MHz for the Cortex-R5, and 500 MHz for the Mali-400 GPU. The device supports a wide range of high-speed transceivers and I/O standards, making it suitable for diverse interface requirements. The XCZU9EG-1FFVB1156E is fabricated on a 16nm process technology, providing high performance with low power consumption. The device includes comprehensive security features such as AES decryption, RSA authentication, and secure boot. It also supports partial reconfiguration, allowing dynamic updates to the programmable logic without interrupting system operation. Typical applications include software-defined radio, medical imaging, industrial automation, and aerospace and defense systems. The combination of ARM processing and FPGA fabric makes it ideal for edge computing, machine vision, and 5G infrastructure where low latency and high throughput are critical. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require proper filtering and sequencing to ensure reliable operation. Thermal management is also critical due to the high power dissipation of the device under full load.

USD $2.950,00 Auf Lager
XCZU9EG-2FFVB1156I - Zynq UltraScale+ MPSoC EG | AMD
XCZU9EG-2FFVB1156I

XCZU9EG-2FFVB1156I - Zynq UltraScale+ MPSoC EG | AMD

The AMD XCZU9EG-2FFVB1156I is a Zynq UltraScale+ MPSoC EG family device, combining a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, ARM Mali-400 MP2 graphics processing unit, and 599,550 programmable logic cells in a single 1156-pin FCBGA package. This System-on-Chip (SoC) integrates the processing system (PS) and programmable logic (PL) on one die, enabling heterogeneous computing for demanding embedded applications. A Zynq UltraScale+ MPSoC is a class of adaptive SoC that pairs multi-core ARM processing with FPGA fabric. The EG variant targets embedded and industrial applications, offering a balance of processing performance, programmable logic capacity, and I/O flexibility. It sits within the broader hierarchy: Zynq UltraScale+ MPSoC -> adaptive SoC -> System-on-Chip -> semiconductor device. Key features include 599,550 logic cells, 32.1 Mb of block RAM, 1,968 DSP slices, and support for 533 MHz (Cortex-R5), 600 MHz (Mali-400), and 1.3 GHz (Cortex-A53) clock speeds. The device operates at 0.85V core voltage and is fabricated on a 20nm process. The -2 speed grade offers a balance of performance and power efficiency. The architecture integrates the PS with the PL via high-bandwidth AXI interfaces, enabling low-latency data movement between software and hardware accelerators. The Mali-400 MP2 GPU supports 2D/3D graphics, while the video codec unit handles H.264/H.265 encoding and decoding. The device includes comprehensive security features such as RSA authentication, AES decryption, and secure boot. Typical applications include software-defined radio, industrial motor control, medical imaging, aerospace and defense systems, and multi-axis robotics. The combination of real-time processing (Cortex-R5), application processing (Cortex-A53), and programmable logic makes it suitable for complex control and signal processing tasks. When designing with this device, careful attention must be paid to power supply sequencing, decoupling, and thermal management. The 1156-pin FCBGA package requires a multi-layer PCB with controlled impedance for high-speed transceivers and DDR memory interfaces.

USD $11.800,00 Auf Lager
XCZU9EG-2FFVC900E - Zynq UltraScale+ MPSoC EG | AMD
XCZU9EG-2FFVC900E

XCZU9EG-2FFVC900E - Zynq UltraScale+ MPSoC EG | AMD

The AMD XCZU9EG-2FFVC900E is a Zynq UltraScale+ MPSoC EG family device, integrating a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 graphics processing unit with programmable logic. It is housed in a 900-ball FCBGA package (31x31 mm) and is designed for high-performance embedded applications requiring both processing and FPGA flexibility. A System-on-Chip (SoC) FPGA combines a hard processor system (PS) with programmable logic (PL) on a single die, enabling software and hardware co-design. The Zynq UltraScale+ MPSoC family extends this concept with heterogeneous processing, including real-time and graphics cores, making it suitable for advanced driver assistance systems (ADAS), industrial automation, and aerospace applications. Key features include 599K+ logic cells, 533 MHz for the Cortex-A53, 600 MHz for the Cortex-R5, and 1.3 GHz for the Mali-400 MP2. The device supports DDR4, LPDDR4, and 32-bit/64-bit memory interfaces, and includes high-speed transceivers for serial connectivity. The EG variant provides a balanced mix of logic and DSP resources, with 2,520 DSP slices and 32.1 Mb of block RAM. The architecture leverages TSMC 16nm FinFET process technology, offering high performance with low power consumption. The programmable logic is based on the UltraScale+ architecture, featuring enhanced routing, clocking, and I/O capabilities. The device supports partial reconfiguration, enabling dynamic updates to the PL while the PS continues operation. Typical applications include 5G wireless baseband processing, machine vision systems, medical imaging, and defense electronics. The combination of ARM cores and FPGA fabric allows for real-time signal processing, hardware acceleration, and flexible I/O interfacing. When designing with this device, careful attention must be paid to power supply sequencing, decoupling, and thermal management. The 900-ball FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. AMD provides comprehensive design resources, including the Zynq UltraScale+ MPSoC data sheet (DS891) and pinout files.

USD $3.600,00 Auf Lager
XIO2221ZAY - PCIe to 1394b OHCI Bridge | Texas Instruments
XIO2221ZAY

XIO2221ZAY - PCIe to 1394b OHCI Bridge | Texas Instruments

The Texas Instruments XIO2221ZAY is a PCI Express (PCIe) to PCI translation bridge with an integrated 1394b Open Host Controller Interface (OHCI) and a 1-port 1394b PHY. It enables seamless connectivity between PCIe-based host systems and legacy PCI peripherals, while providing IEEE 1394b (FireWire) communication at speeds up to 800 Mbps. The device is housed in a 167-ball NFBGA (ZAY) package measuring 12x12 mm, designed for surface-mount assembly. A PCIe-to-PCI bridge is a digital interface IC that translates PCIe transactions to the legacy PCI bus protocol, allowing modern systems to interface with older expansion cards. The XIO2221 integrates this bridge with a 1394b OHCI controller and PHY, consolidating multiple functions into a single device. This reduces board space, power consumption, and system complexity compared to discrete implementations. Key features include full compliance with the PCI Express to PCI/PCI-X Bridge Specification, Revision 1.0, and support for the standard PCI-to-PCI bridge programming model. The integrated 1394b OHCI controller with 1-port PHY supports data rates of 100, 200, 400, and 800 Mbps. The device operates over a commercial temperature range of 0°C to 70°C and requires a 3.3V core supply. The XIO2221 uses a digital architecture that handles protocol translation and data buffering between the PCIe and PCI domains. It supports advanced error handling, power management, and configurable interrupt routing. The integrated PHY provides electrical signaling for the 1394b bus, including cable power and arbitration. Typical applications include desktop and laptop computers, industrial PCs, test and measurement equipment, and professional audio/video systems that require FireWire connectivity. The bridge enables designers to add 1394b ports to systems that only have PCIe slots, extending the life of legacy FireWire peripherals. When designing with the XIO2221, ensure proper decoupling of the 3.3V supply and follow the layout guidelines in the datasheet for the PCIe differential pairs and 1394b PHY signals. The device requires an external reference clock and EEPROM for configuration.

USD $5,90 Auf Lager
XMC1301Q040F0008ABXUMA1 - 32MHz Cortex-M0 MCU, 8KB Flash | Infineon
XMC1301Q040F0008ABXUMA1

XMC1301Q040F0008ABXUMA1 - 32MHz Cortex-M0 MCU, 8KB Flash | Infineon

The Infineon XMC1301Q040F0008ABXUMA1 is a 32-bit ARM Cortex-M0 industrial microcontroller from the XMC1000 family, clocked at 32 MHz with 8 KB of Flash and 16 KB of SRAM, housed in a PG-VQFN-40-13 package (40-pin VQFN, 5x5 mm) with an exposed pad. It integrates the MATH co-processor (CCU6, two Capture/Compare Units) targeted at digital power conversion and industrial motor control, while retaining the ARM Cortex-M0 instruction set for software portability across the XMC family. An ARM Cortex-M0 microcontroller (MCU) is a 32-bit microprocessor core built around the von Neumann architecture with a Thumb-2 instruction set subset, optimized for minimal silicon area and ultra-low active power consumption. The XMC1000 family sits in Infineon's industrial MCU hierarchy: Cortex-M0 (XMC1000) -> Cortex-M3 (XMC4000) -> Cortex-M4F (XMC4500) -> 32-bit industrial microcontrollers, typically used where 8-bit legacy designs cannot deliver the required computational throughput, deterministic timing, or peripheral integration for power-electronic feedback loops. Key features include the CCU6 peripheral for PWM generation with dead-time insertion and emergency stop, a 12-bit A/D converter with up to 12 channels for current/voltage sensing, MATH coprocessor hardware divide, peripheral clock support up to 64 MHz, and a supply voltage range of 1.8 V to 5.5 V. The 32 MHz CPU frequency combined with the deterministic CCU6 timer cluster makes this device well-suited to the digital control loop bandwidth demanded by 100 kHz-class switch-mode power supplies (SMPS) and low-power field-oriented motor control. The architecture is a single-core Cortex-M0 with on-chip Flash, single-cycle multiplier (32-bit result), an AHB-APB peripheral bridge, and Infineon-specific peripherals including the HRPWM (high-resolution PWM) module and a hardware CRC engine. The MATH coprocessor accelerates 32-bit divide and saturation arithmetic for SMPS compensation networks and Clarke/Park transforms on small BLDC motors. Typical applications include digital power supply PFC and PFC+LLC controllers, low-end BLDC/PMSM sensorless fan pumps, LED lighting drivers, and consumer/industrial sensor conditioning. The wide operating voltage range and on-chip peripherals make it popular in 24V industrial sensor hubs and appliance sub-modules that previously relied on discrete 8-bit microcontrollers. When designing with the XMC1301Q040, ensure the exposed thermal pad is soldered to a ground copper pour of at least 50 mm² to meet the theta_JA specified in the datasheet. The CCU6 dead-time register must be loaded before enabling the PWM outputs to avoid shoot-through on a half-bridge. This page synthesizes distributor pricing from DigiKey/Mouser/LCSC, XAIPART partner dropshipping stock levels, and practical design notes that complement the manufacturer's 78-page datasheet with curated cross-references and lifecycle guidance.

USD $1,16 Auf Lager
XMC1302T038X0200A - 32MHz Cortex-M0 MCU | Infineon
XMC1302T038X0200A

XMC1302T038X0200A - 32MHz Cortex-M0 MCU | Infineon

Infineon Technologies XMC1302T038X0200A is a 32-bit ARM Cortex-M0 industrial microcontroller operating at 32 MHz, with 200 KB of flash memory, 16 KB of SRAM, and a 34-I/O PG-TSSOP-38-9 package. It is designed for embedded control, industrial automation, and connected sensor applications requiring deterministic peripheral operation and compact surface-mount integration. What is an ARM Cortex-M0 microcontroller? A microcontroller is a semiconductor device that combines a processor core, memory, analog interfaces, timers, communication peripherals, and digital I/O in one integrated circuit. The ARM Cortex-M0 is a compact 32-bit processor core intended for cost-sensitive embedded systems. The XMC1302 family belongs to the industrial microcontroller hierarchy: MCU, embedded processor, semiconductor, and electronic component. The verified product data identifies an ARM Cortex-M0 core, 32-bit architecture, 32 MHz operating frequency, 200 KB flash, 16 KB SRAM, and a 34-I/O package. The associated Infineon family page describes the device as an industrial MCU with a TSSOP-38 package. These resources make it suitable for motor and machine control, sensor conditioning, digital I/O expansion, communications interfaces, and compact embedded platforms. The 200 KB flash memory supports firmware storage, while the 16 KB SRAM supports working memory for control logic, data acquisition, and peripheral buffering. The 32 MHz operating speed provides a defined computational basis for real-time control loops. The industrial positioning also indicates that the component is intended for embedded applications rather than general-purpose computing. Typical use cases include PLC peripheral modules, industrial sensor nodes, motor-control supervisory logic, building automation controllers, and industrial communication bridges. The compact PG-TSSOP-38-9 package supports surface-mount assembly but requires careful PCB layout and thermal verification for the final operating environment. The supplied distributor and manufacturer results do not provide verified pricing, pin-level details, temperature limits, or complete electrical timing tables, so those values must be confirmed against the manufacturer datasheet before release to production. This page combines the verified Infineon family specifications with practical sourcing, design, and replacement guidance. The provided data does not establish a pin-compatible substitute, current price, lead time, stock status, or complete pinout; engineers should validate those items directly with Infineon or an authorized distributor.

Angebot Auf Lager
XMC1404-F064X0128 - 48MHz ARM Cortex-M0 MCU 128KB Flash LQFP-64
XMC1404-F064X0128

XMC1404-F064X0128 - 48MHz ARM Cortex-M0 MCU 128KB Flash LQFP-64

The Infineon XMC1404-F064X0128 AA is an industrial-grade 32-bit ARM Cortex-M0 microcontroller from the XMC1000 family, delivering up to 48 MHz core performance with 128 KB of embedded flash memory in a PG-LQFP-64-6 package. The device integrates a Cortex-M0 core optimized for low-cost embedded control, 16 KB SRAM, and a rich peripheral set including CCU4/CCU8 PWM timers, POSIF for motor control, multiple USIC channels for UART/SPI/I2C, and a 12-bit ADC. A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and programmable peripherals. The Cortex-M0 is the smallest ARM core, designed for deterministic real-time control in cost-sensitive applications where 8/16-bit MCUs previously dominated. The XMC1400 sits within the XMC1000 family, an industry-targeted extension of Cortex-M0 with hardware PWM and event-request units tailored for power and motion control. Key differentiating features include the CCU8 high-resolution PWM timer (150 ps resolution), HRPWMs for digital power conversion, a 12-bit 1 Msps ADC with up to 12 channels, and Infineon's ERU (Event Request Unit) for hardware event routing without CPU intervention. The device operates from 1.8 V to 5.5 V supply with 5 V-tolerant I/O on most pins, making it suitable for industrial 24 V bus-derived rails after regulation. The architecture combines Cortex-M0 simplicity with motor-control-specific peripherals, achieving deterministic interrupt latency below 25 ns. Integrated POSIF (Position Interface) supports encoder/multi-channel hall-sensor decoding directly in hardware, offloading CPU overhead in FOC motor loops. The XMC1404 family is also AEC-Q100 qualified variants available for automotive motor and lighting. Typical applications include BLDC/PMSM motor control, power conversion (PFC, LLC, solar micro-inverters), LED lighting drivers, industrial HMI panels, and low-cost sensor conditioning. The wide operating temperature range of -40 C to +125 C supports harsh industrial environments. When designing with this MCU, allocate at least 6 layer PCB stack-up for high-frequency signals, use low-ESR ceramic decoupling near each VDD pin, and leverage Infineon DAVE toolchain for code generation. Avoid routing PWM signals near ADC analog inputs to minimize switching noise coupling. This page synthesizes distributor inventory data, drop-in alternatives from the same XMC1400 family, and practical design notes beyond the manufacturer datasheet content.

USD $2,99 Auf Lager