XCZU4CG-1FBVB900E - Zynq UltraScale+ MPSoC CG | AMD
Teilenummer: XCZU4CG-1FBVB900E ✓ Aktiv| Menge | Stückpreis | Gesamt |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
XCZU4CG-1FBVB900E Übersicht
A System-on-Chip (SoC) combines multiple components of a computer or electronic system into a single chip. The Zynq UltraScale+ MPSoC family specifically merges a multi-core ARM processing system (PS) with programmable logic (PL), enabling hardware-software co-design. This architecture allows designers to implement custom accelerators, high-speed I/O, and real-time control in the PL while running operating systems like Linux on the PS.
Key features include 192K+ logic cells, 500 MHz PS clock, 1.2 GHz application processor clock, and support for DDR4, LPDDR4, and 32-bit/64-bit memory interfaces. The device also includes UltraScale+ programmable logic with 461K system logic cells, 21.1 Mb block RAM, and 1,152 DSP slices. It supports a wide range of I/O standards including LVCMOS, LVDS, and high-speed transceivers.
The architecture combines the ARM Cortex-A53 application processor for high-level operating systems, the Cortex-R5 for real-time deterministic processing, and the FPGA fabric for custom logic. This heterogeneous computing platform enables efficient task partitioning, with the PS handling control and communication while the PL accelerates data-intensive algorithms. The device also features advanced security, power management, and system monitoring capabilities.
Typical applications include software-defined radio, industrial automation, medical imaging, aerospace and defense systems, and data center acceleration. The combination of high-performance processing, programmable logic, and rich I/O makes it suitable for edge computing and embedded vision systems.
When designing with this device, careful attention must be paid to power supply sequencing, decoupling, and thermal management. The 900-ball FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. AMD provides reference designs and power management solutions to simplify the design process.
Drop-in-Alternativen für XCZU4CG-1FBVB900E – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
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XCZU4CG-1FBVB900I
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XCZU4EV-1FBVB900E
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCZU4EG-1FBVB900E
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XCZU4CG-2FBVB900E
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XCZU4CG-1FBVB900I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XCZU4CG-1FBVB900E Grenzwerte & elektrische Eigenschaften
| Processor Core | Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Processor Frequency | 1.2 GHz (A53), 500 MHz (R5) |
| FPGA Logic Cells | 192K+ |
| System Logic Cells | 461K |
| Block RAM | 21.1 Mb |
| DSP Slices | 1,152 |
| Gehäuse | 900-FCBGA (31x31 mm) |
| Memory Interface | DDR4, LPDDR4, 32-bit/64-bit |
| I/O Standards | LVCMOS, LVDS, high-speed transceivers |
| Montageart | Surface Mount |
| Lebenszyklusstatus | Active |
| Speed Grade | -1 |
XCZU4CG-1FBVB900E 900-fcbga (31x31 mm) Pinbelegungsleitfaden
Pinbelegung für XCZU4CG-1FBVB900E (900-fcbga (31x31 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XCZU4CG-1FBVB900E.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XCZU4CG-1FBVB900E ist geeignet für 6 Anwendungs: Software-Defined Radio, Industrial Automation, Medical Imaging, Aerospace and Defense, Data Center Acceleration, Edge Computing.
Software-Defined Radio
The XCZU4CG-1FBVB900E is ideal for software-defined radio (SDR) systems due to its combination of ARM processors for control and FPGA fabric for high-speed signal processing. The 192K+ logic cells and 1,152 DSP slices enable efficient implementation of digital down/up converters, filters, and modulation algorithms. The dual-core A53 can run Linux for network stack and user interface, while the R5 handles real-time control. The FPGA fabric can be reconfigured to support multiple waveforms, making it a flexible platform for military and commercial SDR applications. The high-speed transceivers support data rates up to 12.5 Gbps, enabling wideband signal capture and generation. The device's power efficiency is critical for portable and battery-operated SDR units.
Empfohlen
Industrial Automation
The XCZU4CG-1FBVB900E is well-suited for industrial automation and control systems. The dual-core Cortex-A53 can run real-time operating systems or Linux for HMI and network communication, while the Cortex-R5 provides deterministic control for PLC and motion control. The FPGA fabric can implement custom industrial protocols like EtherCAT, PROFINET, or Modbus TCP with low latency. The device supports a wide range of I/O standards, making it easy to interface with sensors, actuators, and fieldbuses. Its high reliability and extended temperature options make it suitable for harsh industrial environments. The programmable logic allows for hardware acceleration of control loops, reducing response times to microseconds. This MPSoC enables a single-chip solution for complex automation tasks, reducing BOM cost and board space.
Empfohlen
Medical Imaging
The XCZU4CG-1FBVB900E is used in medical imaging systems such as ultrasound, CT, and MRI. The FPGA fabric can perform real-time image processing, including filtering, enhancement, and reconstruction, while the ARM processors handle system control and communication. The high DSP slice count (1,152) accelerates algorithms like FFT and beamforming. The device supports high-speed interfaces like PCIe and DisplayPort for data transfer to host systems. Its low power consumption is beneficial for portable medical devices. The security features of the Zynq UltraScale+ family help protect patient data. The combination of processing and logic allows for a compact, high-performance imaging platform that can be updated with new algorithms via FPGA reconfiguration.
Empfohlen
Aerospace and Defense
The XCZU4CG-1FBVB900E is designed for aerospace and defense applications requiring high reliability and performance. The device's security features, including AES and RSA encryption, protect sensitive data. The FPGA fabric can implement custom encryption, signal processing, and sensor fusion algorithms. The dual-core A53 and R5 processors provide a balance of high-level processing and real-time control. The device supports radiation-tolerant options for space applications. Its wide operating temperature range and rugged packaging make it suitable for avionics and military systems. The programmable logic allows for rapid prototyping and in-field updates, which is critical for defense systems. The high-speed transceivers enable communication with radar, sonar, and other sensors.
Empfohlen
Data Center Acceleration
The XCZU4CG-1FBVB900E can be used in data center applications for workload acceleration, such as network processing, storage, and AI inference. The FPGA fabric can implement custom accelerators for packet processing, compression, and machine learning models. The ARM processors handle control plane tasks and run Linux for management. The device supports PCIe Gen3 for high-speed host connectivity. Its high logic density and DSP resources enable efficient implementation of deep learning inference engines. The low latency of FPGA-based processing is beneficial for financial trading and real-time analytics. The device's power efficiency helps reduce data center operating costs. With the ability to reconfigure the FPGA, the same hardware can be repurposed for different workloads, providing flexibility in cloud environments.
Empfohlen
Edge Computing
The XCZU4CG-1FBVB900E is ideal for edge computing applications where local processing is required to reduce latency and bandwidth. The combination of ARM processors and FPGA fabric allows for efficient execution of AI models, computer vision, and sensor fusion. The device supports various I/O interfaces to connect to cameras, microphones, and other sensors. Its low power consumption is suitable for battery-powered edge devices. The FPGA can be reconfigured to adapt to changing algorithms, making it future-proof. The security features protect data at the edge. The device's small form factor and high integration reduce system cost and complexity. Edge computing applications include smart cameras, industrial IoT gateways, and autonomous vehicles.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XCZU4CG-1FBVB900E – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XCZU4CG-1FBVB900I | XCZU4EV-1FBVB900E | XCZU4EG-1FBVB900E |
|---|---|---|---|---|
| Package | 900-FCBGA (31x31) | 900-FCBGA (31x31) | 900-FCBGA (31x31) | 900-FCBGA (31x31) |
| Brand | AMD | AMD | AMD | AMD |
| Processor Core | Dual ARM Cortex-A53, Dual ARM Cortex-R5 | Dual ARM Cortex-A53, Dual ARM Cortex-R5 | Dual ARM Cortex-A53, Dual ARM Cortex-R5 | Dual ARM Cortex-A53, Dual ARM Cortex-R5 |
| FPGA Logic Cells | 192K+ | 192K+ | 192K+ | 192K+ |
| Block RAM | 21.1 Mb | 21.1 Mb | 21.1 Mb | 21.1 Mb |
| DSP Slices | 1,152 | 1,152 | 1,152 | 1,152 |
| Speed Grade | -1 | -1 | -1 | -1 |
| Temperature Grade | E (extended) | I (industrial) | E (extended) | E (extended) |
Wichtigste Unterscheidungsmerkmale
- Cost-optimized CG variant (vs. XCZU4EV-1FBVB900E)
- Extended temperature grade (vs. XCZU4CG-1FBVB900I)
- Balanced processing and logic (vs. XCZU4EG-1FBVB900E)
Designhinweise
The XCZU4CG-1FBVB900E requires multiple power rails with specific sequencing. Refer to the Zynq UltraScale+ MPSoC Power Management documentation for recommended power-up sequences. Use PMICs like the TPS65023 or TPS65218 to manage the rails. Ensure adequate decoupling capacitors on all power pins to minimize noise.
The 900-FCBGA package can dissipate significant power. Use a heatsink or active cooling for high-performance applications. The thermal resistance (theta_JA) depends on PCB design and airflow. AMD provides thermal models in the datasheet. Ensure the junction temperature stays within the specified range to avoid reliability issues.
For high-speed signals, use controlled impedance traces and minimize crosstalk. Follow AMD's PCB design guidelines for the Zynq UltraScale+ family. Place decoupling capacitors close to the power pins. Use a multi-layer PCB with dedicated power and ground planes. For DDR4 interfaces, follow the layout recommendations in UG583.
Compliance-Informationen
Compliance information not provided in the verified data. Please refer to AMD's product documentation for RoHS and REACH status.
