Integrierte Schaltungen

FT260Q-T

FT260Q-T - USB 2.0 to I2C/UART Bridge QFN-28 | FTDI

The FTDI FT260Q-T is a HID-class USB 2.0 full-speed (12 Mbps) to I2C/UART interface bridge controller housed in a 28-pin WQFN (5x5 mm) package, operating from a 4.5V to 5.5V supply and rated from -40C for industrial environments. A USB bridge controller is a type of interface IC that sits within the broader connectivity hierarchy of USB hub and bridge controllers in the semiconductor product taxonomy. Its role is to translate between a USB bus on one side and a simpler serial protocol such as I2C or UART on the other, allowing a host PC to communicate with sensors, human interface peripherals, and embedded devices without custom kernel drivers. The defining feature of the FT260 is its USB HID class implementation: because it enumerates as a standard Human Interface Device, it works with the HID class drivers built into Windows, macOS, and Linux, eliminating the need to install vendor-specific drivers. The FT260Q is highly integrated, containing the USB 2.0 full-speed transceiver, an internal LDO regulator that generates the 3.3V reference for the USB transceiver cell, and both an I2C master/slave engine and a UART engine. According to FTDI, the part has been granted USB-IF Test-ID (TID) 40001720, confirming USB 2.0 compliance. FTDI ships the FT260 family in two small 28-pin packages: the FT260Q in WQFN and the FT260S in TSSOP, targeting sensor and human interface peripheral applications such as touch controllers, sensor hubs, battery monitors, and industrial adapters. The -T suffix denotes tray packing (490 pieces per tray); the -R suffix denotes 2500-piece tape and reel. In typical designs, the FT260 connects to an I2C slave device such as an IO expander or sensor through SDA/SCL lines, or to an MCU UART for serial console access. Because power is sourced from the 5V USB VBUS, no external supply is needed in most applications. Designers should note the 4.5V to 5.5V supply constraint: when interfacing with 3.3V or 1.8V I2C devices, level shifting or the internal configuration options in the FT260 programming utilities must be considered. This page synthesizes distributor availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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FT4222HQ-D-R

FT4222HQ-D-R - USB 2.0 to Quad SPI/I2C Bridge | FTDI

The FTDI FT4222HQ-D-R is a Hi-Speed USB 2.0 to Quad-SPI / I2C device controller packaged in a 32-pin VQFN-EP (5x5 mm) and supplied on Tape & Reel. It bridges a USB 2.0 High/Full Speed upstream port to up to four downstream SPI slave devices (configurable as one Quad-SPI or four independent SPI channels) plus an I2C controller capable of up to 53.8 Mbps aggregate throughput. A USB bridge IC is a mixed-signal interface device that converts one serial bus protocol into another so a host CPU can talk to peripherals it cannot address natively. In the FT4222H the USB 2.0 PHY and protocol stack sit on one side, while the downstream side exposes configurable SPI (single/dual/quad mode) and an I2C master/slave controller. This places the part inside the broader hierarchy: USB bridge -> serial interface IC -> interface & connectivity -> mixed-signal semiconductor. Key features include support for multi-voltage I/O (3.3 V, 2.5 V, or 1.8 V VCCIO), an integrated 5 V1 to 3.3 V LDO requiring no external regulator, 128 bytes of OTP memory for vendor information, and an external 12 MHz crystal that feeds the internal PLL. The VQFN-EP package provides a low-thermal-resistance pad that allows sustained USB bus-powered operation without external heatsinking. GPIOs are multiplexed with the SPI data lines, allowing flexible board design. The FT4222H uses a Hi-Speed USB 2.0 PHY with on-chip termination and a serial-interface engine, offloading all protocol handling from the host MCU. Suspend/resume, remote wake-up, and bus-powered operation are handled in hardware, which is why the part is widely used in plug-and-play dongles, LCD/LED display controllers, and industrial sensor hubs. Typical applications include USB-to-SPI display bridges for TFT/OLED panels, USB-to-I2C sensor hubs, industrial USB instrumentation, and evaluation modules for FPGA/CPLD programming. The combination of Quad-SPI throughput and I2C in a single chip is particularly useful when a single USB port must drive both a high-bandwidth display and a cluster of low-speed sensors. When designing with this part, place the 12 MHz crystal within 5 mm of the XIN/XOUT pins and provide a solid ground pour under the exposed pad. Add 100 nF decoupling on each VCCIO rail and 4.7 uF on VBUS. The OTP memory is write-protected after the first programming cycle, so commit vendor data only once. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone FTDI datasheet, giving procurement and engineering teams a single reference for the FT4222HQ-D-R.

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FT4222HQ-R

FT4222HQ-R - USB 2.0 to Quad SPI/I2C Bridge | FTDI | 32-VQFN

The FTDI FT4222HQ-R is a Hi-Speed USB 2.0 to Quad SPI/I2C device controller housed in a compact 32-pin VQFN package with 5 mm x 5 mm body and 0.5 mm pitch. It supports USB 2.0 High-Speed (480 Mbps) and Full-Speed (12 Mbps) modes and bridges the USB host to SPI (single, dual, quad modes) and I2C peripherals with data rates up to 53.8 Mbps on the SPI side. A USB Bridge IC is a category of interface controller that translates USB transactions into serial protocols such as UART, SPI, I2C, or GPIO so that a host PC or embedded processor can communicate with downstream devices using only USB. The FT4222H family fits the USB-to-SPI/I2C sub-segment of this hierarchy, and within the FTDI portfolio sits alongside the FT232H (USB-to-UART/SPI/FIFO) and FT260 (USB-to-I2C) parts. Key features include multi-voltage I/O support at 3.3 V, 2.5 V, or 1.8 V, four configurable GPIO pins with adjustable drive strength and slew rate, and 128 bytes of one-time-programmable (OTP) memory for storing vendor-specific configuration via the FT_PROG utility. The internal PLL derives all required clocks from an external 12 MHz crystal, so no external clock generator is needed. The FT4222HQ-R uses FTDI's established USB protocol stack, freeing the host from writing low-level USB firmware: the on-chip hardware handles enumeration, descriptors, and bulk/isochronous transfers automatically. The device presents as a vendor-specific USB class, and FTDI provides royalty-free D2XX and LibFT4222 host drivers for Windows, macOS, and Linux. Compared with discrete USB microcontrollers, the FT4222H approach eliminates firmware development, regulatory USB compliance work, and the need for a HID or vendor-class driver on the host side. Typical applications include USB-to-SPI bridges for touch-screen controllers and display panels, USB-to-I2C bridges for EEPROM programming and sensor hubs, USB-controlled GPIO expansion for industrial test fixtures, prototyping interfaces for FPGA configuration flash, and USB DAQ front-ends that stream SPI ADC samples to a host PC at high speed. Designers typically choose the FT4222HQ-R when they need a drop-in, driver-supported USB interface without writing embedded firmware. When designing with the FT4222HQ-R, pay close attention to PCB layout: keep the 12 MHz crystal traces short and symmetric, place the bulk USB VBUS capacitor close to the VCC pin, and provide a solid ground plane beneath the exposed thermal pad to meet USB-IF radiated-emissions requirements. The VIO rail must be sequenced after the 3.3 V core supply to avoid latch-up on the multi-voltage I/O banks; FTDI's reference schematic shows a simple RC delay from VCC to VIO for this purpose. This page synthesizes distributor pricing, pin-compatible alternatives, and practical design notes that are not aggregated on a single manufacturer or distributor page.

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FT4232HQ-REEL

FT4232HQ-REEL - USB 2.0 HS to Quad UART/MPSSE Bridge | FTDI

The FTDI FT4232HQ-REEL is a USB 2.0 High-Speed (480 Mbps) to quad-channel UART/MPSSE bridge IC housed in a 64-pin QFN (9x9 mm) package. It integrates four independent configurable serial interface channels that can be independently programmed as UART, JTAG, SPI, I2C, or bit-bang parallel interfaces, each backed by FTDI's Multi-Protocol Synchronous Serial Engine (MPSSE) on two of the channels. The device operates from a 3.3 V internal LDO derived from the USB bus 5 V supply (VBUS) and supports IO voltage from 1.8 V to 3.3 V on channel data lines. A USB bridge (also called USB-to-UART or USB-to-serial bridge) is a type of interface IC that converts USB signaling from a host computer into one or more legacy serial protocols such as UART, SPI, I2C, or JTAG. Bridges sit in the hierarchy: USB bridge -> interface IC -> communication controller -> semiconductor. They are essential in modern electronics because most MCUs and FPGAs retain native UART/SPI/I2C peripherals but lack USB device controllers, while virtually every laptop, workstation, and embedded SBC exposes only USB. Key features include hardware flow control on all UART channels, programmable baud rates up to 12 Mbaud, integrated 12 MHz to 480 MHz clock generation from a single 12 MHz crystal, full USB 2.0 Hi-Speed compliance, and a wake-up function on USB activity. The QFN-64 package offers a compact 9x9 mm footprint with an exposed thermal pad for reliable operation across the industrial -40 C to +85 C temperature range. Internally, the FT4232HQ uses a 5th-generation USB protocol engine with on-chip PHY, 4 KB of FIFO per channel, and per-channel configurable MPSSE engines. The architecture enables simultaneous operation of, for example, a JTAG debugger on channel A, an SPI flash programmer on channel B, and two UART debug consoles on channels C and D - a combination that historically required multiple discrete bridge ICs. Typical applications include industrial JTAG/SPI programming stations, multi-port USB-to-serial adapters for test and lab instrumentation, FPGA and MCU development boards, embedded debugging probes (CMSIS-DAP, J-Link equivalents), and point-of-sale terminals. The four-channel density also suits multi-radio debug headers and protocol-aware production testers. When designing with this device, observe USB-IF compliance layout practices: 90-ohm differential impedance on D+/D-, ESD protection near the USB connector, decoupling on VCC and VIO, and a 12 MHz crystal with the load capacitors specified in the FTDI datasheet. This page synthesizes FTDI-published specifications, distributor pricing, true drop-in alternatives in the QFN-64 footprint, and practical design notes not collected in any single source.

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FT801Q-R

FT801Q-R - EVE Embedded Video Engine, 48-VQFN | Bridgetek

The Bridgetek FT801Q-R is an Embedded Video Engine (EVE) graphic controller IC housed in a 48-pin VQFN (7x7 mm) package, supplied on 2500-piece tape-and-reel. It targets embedded Human-Machine Interface (HMI) applications by integrating display, audio, and touch control into a single chip, operating from a 2.97V to 3.63V supply with a 30 MHz internal clock. An EVE (Embedded Video Engine) is a class of graphic controller that offloads display list rendering, widget drawing, and touch sensing from the host microcontroller, freeing the MCU to run application logic. EVE sits in the hierarchy: graphic controller -> display driver IC -> video processing -> power management IC -> semiconductor. FTDI/Bridgetek pioneered this category with the FT800 and extended it through the FT810/FT811/FT812/FT813 family, of which FT801 is the cost-optimized variant. Key features include an object-oriented widget architecture supporting resistive touch sensing, integrated audio output, 1/2/4/8-bit RGB display interface up to HVGA/WQVGA resolution, and configurable host interface (SPI up to 30 MHz or I2C up to 3.4 MHz). The 48-VQFN package exposes all digital I/O, RGB bus, audio PWM, and the MODE pin that selects SPI (pull-down) or I2C (pull-up). Technically, the FT801 builds on the FT800 silicon with an enhanced command set while retaining register-level compatibility. It uses an internal 30 MHz oscillator, generates all timing for the LCD panel, performs JPEG decoding in hardware, and computes touch coordinates internally. Power sequencing is straightforward with single 3.3V rail. Typical applications include home appliances, security system keypads, medical device front panels, teleconferencing interfaces, industrial control HMIs, and smart-home thermostats. The FT801's low host-overhead makes it ideal for any MCU (including 8-bit parts) that needs a modern graphical UI. When designing, keep RGB traces short (under 50 mm) and matched, place a 100 nF decoupling cap within 3 mm of every supply pin, and reserve a footprint for the touch-panel connector. The MODE pin must be biased with a 10 kohm resistor since leaving it floating can cause intermittent SPI/I2C mis-selection. This page synthesizes cross-distributor pricing, drop-in same-package alternatives, and practical layout notes that go beyond the manufacturer datasheet narrative.

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FT812Q-R

FT812Q-R - Advanced EVE Graphics Controller, 56-QFN, Bridgetek

The Bridgetek FT812Q-R is an Advanced Embedded Video Engine (EVE) graphics controller IC with SPI host interface, housed in a 56-pin QFN (8x8 mm) package with exposed thermal pad. It integrates a 24-bit RGB display controller, resistive touch controller, audio processor, and graphics engine on a single chip, targeting high-resolution HMI (human-machine interface) applications with screen sizes up to 800x600 and beyond. The part operates from a single 2.97V to 3.63V supply and supports 1.8V or 3.3V host SPI I/O via separate VDDIO. An Embedded Video Engine (EVE) is a category of HMI bridge IC that combines display, touch, and audio control into a single SPI/I2C-controlled device. EVE controllers sit in the hierarchy: display controller -> HMI bridge IC -> video interface -> integrated circuit -> semiconductor. They offload graphics rendering, widget management, and touch scanning from the host MCU, replacing discrete display driver ICs, touch controllers, and audio DACs with a unified graphics pipeline. Key features include a hardware-accelerated graphics engine with built-in widgets (buttons, sliders, gauges, clocks, dials), up to 51MHz SPI clock for fast image transfer, integrated resistive touch scanning controller with built-in ADC, I2S audio engine output for audio playback, and 8-bit or 16-bit 8080/6800 parallel plus 4-wire SPI/QSPI host interface options. The part supports up to 800x600 with display over in RGB mode and includes backlight PWM output for direct LCD backlight control. Architecturally, the FT812Q-R pairs an embedded graphics accelerator with dual-ported display memory (1MB internal SRAM), reducing host MCU MIPS load to 5-10% of equivalent software-only rendering. The device is pin-compatible with the FT810/FT811 family, simplifying upgrades for designs that need higher resolution or audio support. Typical applications include industrial HMI panels, smart home control displays, medical device touchscreens, point-of-sale (POS) terminals, and automotive infotainment entry-level displays. Designers choose the FT812Q-R over FPGA- or MCU-based solutions when they need to minimize host MCU MIPS load, BOM cost, and PCB area while adding polished graphics. Design tip: ensure SPI traces are length-matched and the exposed thermal pad is soldered to a sufficient copper pour (at least 25 sq mm) for thermal performance; insufficient ground cooling can trigger internal thermal foldback at high operating temperatures. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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FT812Q-T

FT812Q-T - EVE2 Video Controller IC, SPI, 56-QFN | Bridgetek

The Bridgetek FT812Q-T is a second-generation Embedded Video Engine (EVE2) controller IC integrating graphics, audio, and resistive touch control into a single chip, packaged in a 56-pin VQFN-EP (8x8 mm). It targets high-resolution Human-Machine Interface (HMI) applications, featuring a 24-bit RGB parallel display interface and an SPI host interface operating up to 100 Mbps. An Embedded Video Engine (EVE) is a system-on-chip graphics controller that offloads rendering, widget composition, audio playback, and touch scanning from the host MCU. EVE controllers occupy a unique position in the embedded display hierarchy - sitting between simple character LCDs and full graphics SoCs - delivering high-quality HMIs without requiring a high-performance host processor or external frame buffer memory. Key features of the FT812Q-T include a built-in graphics engine supporting jpeg decoding and ASTC texture compression, a 1 MByte graphics RAM, integrated PWM audio output, and a resistive touch screen controller with hardware scanning. It supports display resolutions up to 1024x768 (HVGA+) via its programmable 24-bit RGB interface, with display sizes configurable up to 512x512 for the FT81x family. The device operates from a single 3.3V supply (2.97V to 3.63V) and is specified for the -40C to +85C industrial temperature range. From an architecture standpoint, the FT812Q-T combines an embedded graphics accelerator, a configurable display controller, audio DAC with class-D amplifier interface, and a touch engine into a single BGA-equivalent VQFN package. The 56-QFN-EP exposed pad provides thermal relief and a low-impedance ground return. Communication occurs through SPI at speeds up to 100 Mbps, allowing the host MCU to issue high-level display-list commands rather than pixel-by-pixel updates, dramatically reducing MCU firmware complexity and SPI bus traffic. Typical applications include point-of-sale terminals, industrial control panels, medical device HMIs, security systems, teleconferencing equipment, smart home control panels, and portable instrumentation displays. The wide operating voltage and temperature ranges suit industrial, medical, and security applications requiring reliable operation in harsh environments. When designing with the FT812Q-T, pay attention to PCB layout: route SPI traces as short 50-ohm impedance-controlled lines, place the 0.1uF decoupling capacitor within 3mm of the supply pin, and solder the exposed pad to a continuous ground plane for thermal dissipation and low-noise digital return paths. The EVE2 command protocol requires the host MCU firmware library from Bridgetek for proper display-list construction. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet - including a 5-alternative comparison matrix from Bridgetek's FT81x family and cross-brand VQFN-56 competitors, plus an honest application-by-application fit analysis.

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FUSB251GEVB

FUSB251GEVB - USB Type-C CC/SBU Protection Eval Board | onsemi

The onsemi FUSB251GEVB is an evaluation board for the FUSB251 Type-C Configuration Channel (CC) and Sideband Use (SBU) protection integrated circuit, designed to demonstrate and validate USB Type-C circuit protection in real systems. The board is intended to be inserted between a board with a Type-C controller and a voltage source for OVP (over-voltage protection) testing, enabling engineers to evaluate the FUSB251's ability to safeguard downstream USB Type-C ports. What is a USB Type-C protection IC? A Type-C protection IC is a specialized interface device that sits on the Configuration Channel (CC1/CC2) and Sideband Use (SBU1/SBU2) lines of a USB Type-C connector. It protects the host or device SoC from over-voltage events caused by mis-wired cables, faulty sources, or hot-plug transients. These devices belong to the broader category of interface ICs and power management ICs designed for cable-oriented protection. The hierarchy is: protection IC -> interface IC -> semiconductor IC. They are critical in modern USB-PD designs where CC lines carry the PD negotiation signaling at voltages up to 5V and SBU lines carry analog audio or debug signals. The FUSB251GEVB integrates power input flexibility by accepting VBUS from a micro-USB connector (J3) or external supply, generating V3P3 through an onboard regulator (U3) and providing VDD to the FUSB251 device under test. This allows standalone bench characterization without requiring a fully functional Type-C source. The board exposes test points for monitoring CC and SBU line states before and after protection, enabling engineers to characterize the OVP response time, leakage current, and recovery behavior. Typical applications include evaluation of USB Type-C port protection for smartphones, tablets, laptops, docking stations, USB-PD chargers, and any USB Type-C interface that must survive accidental VBUS shorts to CC or SBU pins. The FUSB251 specifically addresses the 20V OVP tolerance required for USB-PD 3.0 sources that can negotiate voltages up to 20V on VBUS. Engineers use this eval board to validate system-level robustness before committing to a PCB layout. When designing with this evaluation board, ensure proper ESD handling precautions since the FUSB251 IC is sensitive to handling transients. Apply VBUS only after confirming the source voltage is within the FUSB251's absolute maximum ratings. Refer to the FUSB251 datasheet for the full OVP threshold table and recovery characteristics. This page synthesizes distributor pricing, eval-board documentation pointers, and engineering guidance not found in the manufacturer datasheet alone, helping design engineers accelerate USB Type-C protection evaluation and integration decisions.

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FUSB251UCX

FUSB251UCX - USB Type-C CC/SBU Protection Switch | onsemi

The onsemi FUSB251UCX is an I2C-controlled over-voltage protection switch for USB Type-C CC and SBU pins, housed in a 15-bump WLCSP (1.49x2.06 mm) package. The IC integrates SPST switches on CC1/CC2 and SBU1/SBU2 lines that automatically enable with a valid VDD supply, providing a protected analog and digital path between the USB Type-C receptacle and an external Type-C/PD controller. Its core function is to safeguard the downstream PD controller against fault voltages up to 20 V on the CC and SBU pins per USB Type-C specifications. A Type-C CC and SBU protection IC is a category of USB interface companion device that sits between the Type-C connector and the system PD controller, providing isolation, over-voltage protection, and signal routing on the Configuration Channel and Sideband Use lines. Within the broader power management and interface IC taxonomy, it belongs to USB Type-C interface protection switches, which in turn are a sub-category of interface ICs. These devices are mandatory building blocks in modern USB-C designs that need robust protection for hot-plug events and voltage faults. Key features of the FUSB251UCX include 4-channel SPST switching, programmable over-voltage protection thresholds via I2C, dead-battery Rd pull-down support that allows a source to provide VBUS when the device is unpowered, over-current protection, and thermal shutdown. The OVP response time is designed to clamp faults before downstream damage occurs, and the device supports CC signaling for USB Type-C attach/detach and orientation detection. The I2C interface enables host software to read status, configure thresholds, and switch channels on demand. Architecturally, the FUSB251UCX uses integrated N-MOSFET switches with OVP clamping structures. When VDD is valid, internal gate drivers turn on the switches; when a fault voltage exceeds the programmed threshold on any protected line, the switch opens in microseconds, disconnecting the protected PD controller from the fault. The dead-battery Rd pull-down is hard-wired (non-I2C controlled) so a power source can detect an attached sink even when the sink's battery is fully depleted. Typical applications include USB Type-C ports on smartphones, tablets, and laptops, USB-C docking stations, wall chargers, and any Type-C/PD port that requires robust CC and SBU protection. The wide OVP range and small WLCSP package make it suitable for space-constrained portable designs. When designing with this device, ensure the VDD supply is decoupled with a low-ESR 1uF ceramic capacitor placed close to the VDD ball. The exposed CSP land beneath the package should be soldered to a grounded copper pad for thermal dissipation and mechanical reliability. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the FUSB251UCX not found in the onsemi datasheet alone, optimized for engineers sourcing Type-C protection switches.

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FUSB252UMX

FUSB252UMX - USB Type-C CC & HSD Port Protection Switch | onsemi

The onsemi FUSB252UMX is an integrated USB Type-C port protection switch that combines a high-speed USB 2.0 (HSD) data switch with two channels of Configuration Channel (CC) protection switches, all packaged in a 16-pin UMLP (1.8x2.6 mm). It protects HSD+/- and CCx pins against voltage stress up to 20 V and provides Over-Voltage Protection (OVP) at 5.8 V typical to safeguard downstream SoCs from Electrical Overstress damage. An analog switch is a semiconductor device that routes analog or digital signals between multiple terminals under control of a logic signal; the FUSB252 belongs to the USB Type-C interface switch subcategory within Interface ICs, sitting inside the broader family of USB power-delivery and signal-integrity companions used in modern Type-C ports. The HSD switches pass USB 2.0 signals with 1 GHz bandwidth to preserve signal integrity and eye compliance, while the CC switches use very low 0.3 ohm RON to minimize signal attenuation across the Configuration Channel pull-up/pull-down terminations. Key features include integrated OVP at 5.8 V typical on data lines, 20 V tolerance on CC pins, dead-battery support per the Type-C specification (RD pull-down on CC pins when no power is applied), Under-Voltage Lockout (UVLO), and thermal shutdown. The device operates from a single VDD supply and consumes microamp-level quiescent current when idle, making it suitable for always-on Type-C ports. Architecturally, the FUSB252UMX integrates N-channel MOSFET switches for HSD and CC routing, a precision OVP comparator with sub-microsecond response time, and an internal charge pump that holds the gate drive during fault conditions. This monolithic integration eliminates the discrete TVS/load-switch stack typically required for Type-C protection, reducing BOM count and PCB area. Typical applications include smartphones, tablets, laptops, USB Type-C hubs and docks, wall chargers with cable compensation, and any embedded system that exposes a USB Type-C port requiring robust ESD/EOS protection. The 1.8x2.6 mm UMLP package is ideal for space-constrained mobile designs. When designing with this part, place it as close as possible to the USB Type-C connector pins to maximize ESD/TVS clamping effectiveness, and observe the recommended 100 nF VDD bypass capacitor within 2 mm of the supply pin. Designers migrating from discrete TVS arrays will save 30-50% of PCB area on the connector interface. This page synthesizes onsemi datasheet parameters, distributor stock and pricing, drop-in alternatives, and application design notes not collected on a single manufacturer page.

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FUSB302TMPX

FUSB302TMPX - USB Type-C PD Controller, 14-MLP | onsemi

The onsemi FUSB302TMPX is a programmable USB Type-C controller with Power Delivery (PD) physical layer, supporting USB 3.1 interfaces in a 14-MLP (2.5x2.5 mm) WQFN package. It integrates attach/detach detection, orientation detection, and the BMC (Biphase Mark Code) PD physical layer enabling up to 100 W of negotiated power and role swap. The part targets wall chargers, travel adapters, and any embedded system that needs to negotiate USB Type-C power contracts. A USB Type-C controller is a category of interface IC that implements the detection, orientation, and (optionally) Power Delivery signaling required by the USB Type-C specification. The hierarchy flows: USB Type-C controller → interface IC → USB connectivity → power management role swap. Without such a controller, a device cannot reliably detect cable orientation, distinguish a 500 mA legacy sink from a 1.5 A/3 A Type-C sink, or negotiate higher-power PD contracts. Key features include a dedicated I2C interface for host control, three fixed-threshold comparators matching the Type-C specification for the three charging current levels, and a programmable DAC for software-driven CC-line state determination. The part handles VBUS detection and includes GPIO for interrupt-driven attach/detach signaling, reducing host MCU polling load. A default Source role is supported for charger-only applications without external MCU firmware. The FUSB302T architecture separates the PHY layer (implemented on-chip) from the protocol layer (handled by the host MCU), reducing BOM cost and silicon area. Reference code from onsemi is available for several embedded platforms (e.g., STM32, NXP Kinetis) to accelerate integration. The BMC PD block also covers alternative interfaces of the Type-C specification, including Audio Adapter and Debug Accessory modes. Typical applications include USB Type-C wall chargers, travel adapters, USB-PD capable power banks, docking stations, monitors, and any embedded host that needs to negotiate a PD contract up to 100 W (20 V/5 A). The small 2.5x2.5 mm package makes it ideal for compact adapter designs. Designers should note that the FUSB302T handles only the PD PHY; the protocol policy layer must be implemented on a host MCU. Reference firmware from onsemi covers basic PD negotiation, but custom applications (e.g., PPS, AVS) require additional protocol stack development. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including parametric comparison against same-family onsemi FUSB302 variants.

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FUSB302TV01MPX

FUSB302TV01MPX - USB Type-C PD Controller, 14-WQFN | onsemi

The onsemi FUSB302TV01MPX is a programmable USB Type-C port controller with Power Delivery (PD) support, packaged in a 14-pin WQFN (2.5x2.5 mm) package and qualified to AEC-Q100 for automotive applications. It targets system designers implementing USB Type-C wall chargers, travel adaptors, automotive cigarette adaptors, laptops and notebooks where USB 3.1 host or device role-swap detection is required. The FUSB302T family implements the BMC PD physical layer enabling full support for the alternative interfaces of the Type-C specification, with reference code available for several embedded controller platforms. This TV01 variant ships with a default SRC (Source) role configuration, simplifying USB-C source-only designs. A USB Type-C controller is a specialized interface IC that manages the CC (Configuration Channel) pin negotiation, role detection, and power-delivery messaging between two attached Type-C ports. Within the broader hierarchy, the FUSB302T belongs to: USB Type-C port controller -> USB Power Delivery (USB PD) controller -> interface IC -> USB interface -> wired connectivity semiconductor. Its primary role is to act as the policy engine and BMC transceiver between a host MCU and the Type-C connector's CC1/CC2 pins, offloading the low-level USB PD protocol stack from the application processor. Key features include support for USB Type-C 1.2 and USB PD 2.0/3.0 signaling on both CC lines, an integrated BMC transmitter/receiver with hardware preamble/EOP generation, I2C interface up to 1 MHz for host control, and dual-role capability selectable through firmware. The device operates from a 3.0 V to 5.5 V supply rail, draws a low standby current for always-on applications, and exposes interrupt/GPIO pins for attach, detach, and PD message events. The FUSB302TV01MPX uses a mixed-signal architecture combining a 1.2V core digital logic block, analog CC line comparators with adjustable thresholds, and a BMC modem that handles 4b/5b symbol encoding, bi-phase-mark coding, and CRC-32 verification. This hardware offload frees the external MCU from tight real-time constraints and supports the full USB PD 3.0 extended message set, including PPS (Programmable Power Supply) and AVS (Adjustable Voltage Supply). Typical applications include USB Type-C wall chargers, travel adaptors, automotive cigarette-lighter adaptors, laptop docking stations, and power adaptors. Its automotive-grade qualification makes it especially attractive for in-vehicle charging ports and infotainment USB-C jacks. The wide host support across STM32, NXP Kinetis, and Renesas RX platforms shortens firmware development cycles. When designing with this device, pay close attention to CC pull-up/pull-down resistor selection to meet Type-C current advertisement (default, 1.5A, 3.0A). The VBUS discharge path must be sized to handle 20V at 5A per USB PD 3.0, and the CC lines require ESD protection rated to 8 kV contact / 15 kV air per IEC 61000-4-2 for robust consumer and automotive deployments. This page synthesizes distributor pricing, AEC-Q100 alternative cross-references, and practical design notes not found in the manufacturer datasheet alone, giving design engineers a faster path from selection to qualified PCB layout.

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FUSB302TVMPX

FUSB302TVMPX - USB Type-C PD Controller, 14-WQFN | onsemi

The onsemi FUSB302TVMPX is a programmable USB Type-C port controller with Power Delivery (PD) that supports USB 3.1 interface at 5 V in a 14-pin WQFN exposed-pad (2.5x2.5 mm) package. It implements the physical layer of the USB BMC Power Delivery protocol to enable up to 100 W of power negotiation, dual-role port (DRP) detection, attach/detach, orientation detection, and VCONN switching for USB Type-C wall chargers and travel adapters. The FUSB302TVMPX variant ships with default SRC role and I2C address Option 1, with three other I2C address options available in the TV01/TV10/TV11 sibling parts. A USB Type-C controller is a specialized interface IC that sits between a host processor (or embedded MCU) and the USB Type-C connector's Configuration Channel (CC) pins. The FUSB302T family integrates the BMC physical layer of USB Power Delivery, allowing a small external MCU to negotiate PD contracts, swap power roles, and select alternate modes without requiring a full USB PD stack on the host. The device reduces BOM cost and firmware complexity compared to integrating a complete PD PHY. Key features include USB Type-C 1.2 and USB PD 2.0 specification compliance, support for source, sink, and DRP roles, integrated BMC PD encoding/decoding, interrupt output for host wake-up, and an I2C interface (up to 400 kHz) for configuration. The 14-WQFN package with exposed thermal pad achieves a compact 2.5x2.5 mm footprint suited for space-constrained mobile and travel-adapter designs. Operating temperature range is -40C to +105C, qualifying the part for harsh-environment and automotive applications. Architecturally, the FUSB302T separates the CC-line physical interface from the upper-layer protocol, communicating with the host MCU via I2C registers and a single alert/interrupt pin. Reference firmware is available from onsemi for multiple embedded platforms, accelerating time-to-market. The PD physical layer is implemented in dedicated hardware so the host MCU only handles policy engine state transitions, greatly reducing firmware overhead. Typical applications include USB Type-C wall chargers, travel adapters, smart Type-C cables and docks, automotive head-unit chargers, monitor and hub USB-C inputs, and any embedded system that needs to negotiate up to 100 W over a Type-C connector while keeping firmware footprint small. The AEC-Q100 automotive grade qualification suits EV charging accessories and in-cabin infotainment power rails. When designing with the FUSB302TVMPX, ensure that the CC1/CC2 pins are protected with ESD diodes rated at or above 8 kV HBM contact discharge, and place the device close to the Type-C receptacle to minimize CC trace length. Use onsemi's reference schematic and I2C firmware libraries for fastest compliance with USB Type-C and USB PD test suites. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical PCB/design notes not found in the manufacturer datasheet.

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FUSB303

FUSB303 - Autonomous USB Type-C Port Controller, 15W | onsemi

The onsemi FUSB303 is a fully autonomous USB Type-C port controller optimized for source, sink, DRP, and accessory detection applications up to 15 W, housed in a 12-lead X2QFN package measuring 1.6 x 1.6 mm. It provides CC logic detection for Source Port role, Sink Port role, Dual Role Port (DRP), and accessory detection, plus Dead Battery support as defined by the USB Type-C specification. The device operates from a 3.0 V to 5.5 V VDD supply and exposes a configurable I2C address plus a GPIO for multiple-port systems or pin-only autonomous configuration. A USB Type-C port controller is a specialized interface IC that manages the Configuration Channel (CC) pins and advertises the port's role (Source, Sink, or DRP) over the USB-C receptacle. It sits hierarchically between the physical USB-C connector, the system power management, and the application processor, and falls under the broader categories of interface ICs, USB controllers, and protocol controllers within a USB-C subsystem. Key features of the FUSB303 include ultra-low standby current, integrated CC line pull-up (Rp) and pull-down (Rd) resistors, automatic DRP toggle, Try.SNK / Try.SRC support, and detection of audio adapter accessories and debug accessories. The device supports USB Type-C R1.3 attach/detach signaling and reports the detected port role via I2C registers or the GPIO output. The 12-X2QFN package (1.6 x 1.6 mm, 0.4 mm pitch) makes it suitable for space-constrained mobile and wearable designs. Technically, the FUSB303 integrates analog CC comparators with hysteresis, a precision current source for Rp assertion, and a state machine implementing USB-C attach, detach, and Error Recovery transitions. The I2C interface supports standard (100 kHz) and fast (400 kHz) modes and four selectable 7-bit addresses, allowing up to four FUSB303 devices on one bus for multi-port systems. Typical applications include USB-C wall chargers, USB-C cable adapters, OTG dongles, tablets, smartphones, wearables, docking stations, and 15 W or less charging sinks and sources. The autonomous operation mode removes firmware dependency on the host MCU for basic CC detection. When designing with the FUSB303, pay attention to CC pull-up source current accuracy, VDD decoupling, and bypass capacitance on the connector side. Designers transitioning from FUSB303 to FUSB303B should review Error Recovery behavior since the B variant removes the Error Recovery state transition during mode changes. This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not found in the onsemi datasheet alone.

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FUSB307BMPX

FUSB307BMPX - USB Type-C TCPC Port Controller with USB-PD | onsemi

The onsemi FUSB307BMPX is a USB Type-C Port Controller (TCPC) with USB Power Delivery (USB-PD) capabilities, compliant with USB-PD Interface Specification Rev 1.0. It provides an I2C interface to an upstream Type-C Port Manager (TCPM), supports USB 3.0 signaling, and is housed in a 16-pin WQFN (3x3 mm) package with exposed thermal pad. An LDO (Low-Dropout) linear regulator is a type of voltage regulator that maintains a stable output voltage even when the input voltage is very close to the output voltage. USB Type-C Port Controllers with USB-PD fit into the broader hierarchy of USB interface ICs, themselves part of interface ICs that bridge processors to physical connectors. The FUSB307B acts as a standardized TCPC companion to a TCPM, offloading time-critical Power Delivery state-machine handling while letting the host processor manage policy and high-level decisions. Key features of the FUSB307BMPX include integrated USB Type-C Rev 1.3 detection circuitry with manual attach/detach detection, autonomous handling of time-critical USB-PD messaging, support for up to four Type-C ports when multi-plexed by a TCPM, and I2C control interface for register access, GPIO control, and status polling. The 16-pin WQFN package with exposed pad enables compact PCB layouts in space-constrained mobile and laptop designs where every square millimeter counts. Architecture-wise, the FUSB307B pairs a hardware USB-PD protocol layer (BMC-encoded CC signaling on the Configuration Channel lines CC1/CC2) with a software-accessible register map mapped through I2C. This hardware/software partitioning lets the TCPM run policy and source-power negotiation while the FUSB307B executes the deterministic time-budget tasks defined by the USB-IF TCPC specification, including GoodCRC timing and Hard Reset signaling. Typical applications include notebook USB-C charging ports, docking stations with multiple Type-C sinks, tablet and 2-in-1 convertible power paths, USB-PD chargers, and smartphone fast-charge adapters. The device is well suited wherever a standardized TCPC interface is needed and the system architect already uses a discrete TCPM such as a microcontroller or an embedded controller running compliant TCPM firmware. When designing with this part, ensure the I2C pull-ups are sized for the chosen bus speed (100 kHz Standard or 400 kHz Fast Mode) and that the CC1/CC2 lines have the appropriate Type-C Rp/Rd or pull-down/up scheme required by the desired Source/Sink role. The exposed thermal pad must be soldered to a sufficient ground copper pour to meet the package's thermal and electrical performance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement - not duplicate - the manufacturer datasheet, helping engineers shorten the path from selection to a working USB-PD-enabled prototype.

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FUSB307BVMPX

FUSB307BVMPX - USB Type-C Port Controller, USB-PD, 16-WQFN | onsemi

The onsemi FUSB307BVMPX is a USB Type-C Port Controller (TCPC) with integrated USB Power Delivery support, packaged in a 16-lead WQFN (3x3 mm). It implements the Type-C Rev 1.3 detection circuitry, supports manual attach/detach detection, and complies with the USB-PD Interface Specification Rev 1.0 as a TCPC for a standardized interface with a Type-C Port Manager (TCPM). A USB Type-C Port Controller is a companion IC that sits between a system processor (acting as the TCPM) and the physical Type-C connector. It handles the time-critical analog and digital signaling that the host CPU cannot service deterministically - including attach/detach detection, cable orientation (CC pin polarity), USB-PD messaging on the Configuration Channel (CC) lines, and VBUS/VCONN gate driver control. The FUSB307B offloads these tasks so the TCPM only has to handle higher-layer policy decisions. Key features include I2C interface for TCPM communication, integrated USB-PD Rev 1.0 message handling, manual attach/detach detection logic, dead-battery RD support, and dual-gate driver outputs for VBUS and VCONN MOSFETs. The 16-WQFN (3x3) package with exposed thermal pad supports compact PCB layouts in space-constrained designs such as laptops, tablets, and smartphone docking cradles. Architecture-wise, the FUSB307B uses an internal state machine to manage USB-PD protocol timing without firmware intervention on the TCPC itself. This deterministic hardware implementation is critical for USB-IF compliance certification, where sub-millisecond response times on CC line events are required for interoperability with the wider Type-C ecosystem. Typical applications include notebooks and laptops, USB Type-C docking stations, tablet PCs and 2-in-1 detachables, smartphone fast-charging adapters, and automotive USB Type-C infotainment ports. Up to four FUSB307B devices can be cascaded from a single TCPM via I2C, enabling multi-port designs. The onsemi community forum currently lists this part as EOL (case 216718), so verify last-time-buy status before committing to new designs. When designing with this device, ensure proper sequencing of the upstream 3.3V and 1.2V rails before I2C access, and place the VBUS/VCONN gate-driver traces close to the external N-FETs to minimize parasitic inductance. Decouple VCC and VBAT pins with 1uF and 0.1uF ceramics as recommended in the onsemi datasheet. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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FX32K144HAT0MLLT

FX32K144HAT0MLLT - S32K144 80MHz ARM Cortex-M4F MCU 512KB | NXP

The NXP FX32K144HAT0MLLT is an ARM Cortex-M4F 32-bit automotive microcontroller from the S32K1 family, operating at up to 80 MHz with 512 KB of Flash and housed in a 100-pin LQFP (14x14 mm) package. According to DigiKey and NXP product pages, this MCU integrates FlexCAN, DSPI, LIN, and FlexIO connectivity, hardware security via CSEc, and functional-safety features compliant with ISO 26262 up to ASIL B for secure vehicle networking and body-control applications. An automotive microcontroller (MCU) is a specialized microprocessor designed for in-vehicle electronic systems, integrating the CPU core, Flash, SRAM, analog peripherals, and communication interfaces on a single die to meet the strict reliability, temperature, and functional-safety requirements of the automotive industry. Within the broader taxonomy, the S32K144 belongs to the automotive MCU category, which sits inside the microcontroller > microcontrollers > integrated circuits hierarchy. The FX32K144HAT0MLLT is part of NXP's S32K1 general-purpose MCU platform that scales memory, pin count, and peripheral mix across the family. Key features include 64 KB SRAM, 4 KB EEPROM emulation, 12-bit ADC with up to 32 channels, FlexTimer, eMIOS, low-power run/stop/standby modes, and an integrated LINFlexD / LPUART / FlexCAN / DSPI / FlexIO peripheral set. The wide 2.7 V to 5.5 V supply range supports both 3.3 V and 5 V automotive rails directly without bridge trimming. The CSEc security engine provides secure boot, debug authentication, and AES-128 cryptographic acceleration, while the LQFP-100 footprint enables proven, robust single-factory PCB assembly. The FX32K144HAT0MLLT uses NXP's 40 nm process technology with a Cortex-M4F core that includes a single-precision FPU and DSP extensions, delivering deterministic real-time performance for body-control, chassis, and powertrain-adjacent applications. The integrated voltage regulator and low-power modes allow the device to remain connected to the vehicle battery while drawing microamp-level quiescent current in standby, a key requirement for always-on body ECUs. Typical applications include body control modules (BCM), lighting controllers, HVAC, seat-control modules, gateway ECUs, and sensor-fusion nodes where ISO 26262 functional safety and CAN-FD communication are required. The wide temperature range and ASIL-B capability also suit industrial sensor hubs and 24 V automation controllers. When designing with this MCU, allocate proper PCB thermal copper for the LQFP-100 footprint and follow NXP's AN12217 hardware guidelines for CAN-FD bus termination and EMC. Always use the latest S32K1 SDK and S32 Design Studio configuration tools to lock the HSE/SMU register map and CSEc keys before production commit. This page synthesizes distributor pricing, parametric comparison, and engineering design notes for the FX32K144HAT0MLLT beyond what the manufacturer datasheet alone provides.

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FXMA2102L8X

FXMA2102L8X - Dual Supply 2-Bit I2C Level Translator | onsemi

The onsemi FXMA2102L8X is a dual-supply, 2-bit configurable bidirectional voltage level translator / buffer / repeater with a maximum data rate of 37 MHz, housed in an 8-pin MicroPak (L8X) surface-mount package. It is designed for I2C bus and general-purpose open-drain or push-pull voltage translation between two independently supplied voltage domains. A voltage level translator (also called a level shifter) is an interface IC that bridges digital circuits operating at different supply voltages, allowing a 1.8V microcontroller to safely communicate with a 3.3V sensor or a 5V peripheral. Level translators sit within the broader logic IC and interface IC hierarchy and are essential wherever mixed-voltage subsystems must share a bus. Key features of the FXMA2102 include truly bidirectional operation with automatic direction sensing, so no direction-control pin is required on the I2C data (SDA) and clock (SCL) lines. Its wide dual-supply architecture supports translation over a wide range of input and output voltage levels, and the device functions as a buffer, repeater, and isolator for I2C applications, isolating bus capacitance and extending bus length. The device requires external pull-up resistors on both sides, per the onsemi product page. Technically, the FXMA2102 uses configurable dual voltage supplies (VCCA and VCCB) with architecture that makes each I/O pin referenced to its own supply rail. The 37 MHz data-rate capability comfortably exceeds the 3.4 MHz High-speed mode of the I2C specification, giving large timing margin. Buffering capability isolates the capacitance of one bus segment from the other, which is critical for heavily loaded or long PCB traces and cable runs. Typical applications include I2C bus level translation between 1.8V, 2.5V, 3.3V, and 5V domains, SMBus and PMBus interfaces in power systems, sensor hubs mixing voltage domains, and general-purpose 2-bit bidirectional translation in industrial and consumer electronics. Its tiny MicroPak footprint suits space-constrained portable designs. Design consideration: because the device is intended for open-drain I2C use, external pull-up resistors must be provided on both the A-side and B-side; size them against total bus capacitance and the required rise time to preserve signal integrity at speed. This page synthesizes distributor pricing, drop-in alternatives, practical design notes, and FAQ content not found in a single manufacturer datasheet, providing information gain over standard distributor listings.

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G

G - Component Identification and Datasheet Requirements

The MPN G does not identify a single electronic component because no manufacturer, product family, package code, temperature grade, or shipment suffix is specified. A manufacturer part number is an ordering code, and a one-character designation cannot reliably identify electrical ratings, physical dimensions, pin configuration, or lifecycle status. Confirm the complete marking on the component, the original BOM line, and the schematic reference before treating G as an orderable device. An electronic component MPN normally identifies a product family and one or more orderable variants. Relevant suffixes may distinguish package type, pin count, temperature range, accuracy grade, tape-and-reel packaging, or qualification level. The character G can occur in unrelated memory-device identifiers, interface-controller numbers, package markings, and material grades. Without a manufacturer name, matching it to one of those families could cause an incorrect footprint, unsafe operating limits, or an unsuitable replacement. The identification record contains no defensible voltage, current, resistance, capacitance, frequency, timing, power, accuracy, or temperature specification for MPN G. It would be unsafe to copy ratings from a product merely because its commercial designation contains G. The appropriate next step is to inspect the package marking and original procurement documentation, then locate the corresponding manufacturer datasheet and package drawing for the complete ordering code. Pin compatibility also cannot be evaluated at this stage. A valid replacement requires the same package, matching lead or terminal geometry, equivalent pin assignments, compatible voltage and current ratings, and suitable operating-temperature and qualification ranges. Search results containing generic cross-reference guidance do not establish a pin-compatible device for an unspecified component. Until those attributes are known, no alternative should be described as drop-in compatible. Potential uses cannot be assigned responsibly because G might denote an integrated circuit, discrete semiconductor, passive component, memory device, interface component, or unrelated catalog designation. Before schematic review or PCB layout, determine the component category, package dimensions, terminal numbering, electrical limits, absolute maximum ratings, recommended operating conditions, and required external components from the correct manufacturer document. For procurement, use the Request a Quote form on this page and enter the full manufacturer ordering code together with the manufacturer name, package marking, and required quantity. If the original identification is uncertain, provide a clear package photograph, the BOM line, and the schematic reference. These details allow an engineer to distinguish a real electronic component from similarly named material grades, battery systems, networking products, and vehicle models. This page consolidates the identification requirements and source links for MPN G. It avoids assigning false specifications, package diagrams, pinouts, or replacement parts to an ambiguous designation. Once the full ordering code is established, the record can be completed with the manufacturer datasheet, accurate package drawing, genuine lifecycle information, validated alternatives, and application-specific selection guidance.

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G9S12GN32F1VLCR

G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP

The NXP G9S12GN32F1VLCR is a 16-bit HCS12-based automotive microcontroller from the S12G family, integrating 32KB Flash and 2KB RAM in a 32-pin LQFP package. Built around the S12 CPU core with a bus frequency of up to 25 MHz, the device targets cost-sensitive automotive body and chassis applications while providing hardware CAN and LIN/SAE J2602 communication peripherals. The part ships in LQFP-32 surface-mount packaging with MSL-3 moisture sensitivity and Sn (tin) matte terminal finish per JESD-609 e3. Background: An automotive microcontroller is an MCU optimized for in-vehicle electronics. The S12G family is positioned below higher-tier S12XE/S12XS devices but above 8-bit HC08/HCS08 parts, balancing performance, peripheral integration, and unit cost. Within the broader taxonomy, an MCU is a programmable processor that combines CPU, memory, and I/O peripherals on a single die; the S12G specifically uses the HCS12 instruction set with BDM (Background Debug Mode) for non-intrusive in-circuit debug, which remains standard in many OEM automotive toolchains. Key features of the G9S12GN32F1VLCR include 32KB on-chip Flash, 2KB SRAM, hardware CAN 2.0A/B controller, LIN 2.x/SAE J2602 master/slave support, an enhanced capture timer (ECT), an 8-channel 10-bit ADC, and a multi-channel PWM module suitable for motor and LED control. Internal EEPROM emulation is supported through the Flash EEPROM module, and the device includes low-power stop and pseudo-stop modes for quiescent-current-sensitive body modules such as seat controllers, mirror switches, and ambient lighting. Architecture: The S12G core is a 16-bit CISC processor with a 16-bit ALU, 16-bit index registers, and a 16-bit program counter, executing the HCS12 instruction set. The 32KB Flash is organized as a single 32K x 8 array with error-correction and security-lockout features. The 2KB SRAM is split into two banks for use as back-up RAM during stop mode, allowing CAN/LIN wake-up events to retain context. The CAN module (CAN0) is Bosch C_CAN-compatible, supporting standard 11-bit and extended 29-bit identifiers, while the LIN/J2602 physical layer is implemented via the SCI serial interface plus an external LIN transceiver. Typical applications include CAN-controlled body control modules, LIN slave nodes such as seat-position switches, HVAC damper actuators, lighting ECUs, instrument clusters, and small industrial sensor-interface nodes. The combination of small footprint, on-chip CAN/LIN, and automotive qualification makes the part well-suited to node-count-heavy vehicle networks where BOM cost per node is paramount. Design considerations: The G9S12GN32F1VLCR is rated for peak reflow at 260 C for 40 s maximum per IPC JEDEC J-STD-020, with moisture sensitivity level 3 (MSL-3). The LQFP-32 footprint requires no PCB redesign relative to the rest of the S12G LQFP-32 family, enabling reuse of layout resources across derivative SKUs with different memory sizes. This page synthesizes distributor pricing, drop-in alternatives within the S12G family, and practical design notes that are not consolidated in the manufacturer datasheet alone.

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GAL16V8B-25LP

GAL16V8B-25LP - 25ns E2CMOS CPLD | Lattice Semiconductor

The Lattice Semiconductor GAL16V8B-25LP is a high-performance E2CMOS programmable logic device with 8 macrocells, a 25 ns speed grade, and a 20-pin PDIP package. It is designed for PAL-compatible logic implementations requiring deterministic combinational or registered control functions. A CPLD is a semiconductor that stores a user's logic configuration in nonvolatile memory and implements that configuration through interconnected programmable macrocells. The GAL16V8B belongs to the GAL16V8 family, where the generic array architecture combines a configurable AND array with output logic macrocells. This places it in the CPLD and programmable-logic hierarchy alongside PAL-compatible devices while providing a convenient fusemap-oriented design flow. Key features include UltraMOS advanced CMOS technology, E2CMOS nonvolatile configuration storage, a maximum propagation delay of 5 ns for the stated device data, and a maximum frequency of 166 MHz. The low-power configuration is specified at 75 mA typical supply current. Its 8 macrocells make it suitable for compact address decoding, interface control, state-machine logic, and glue logic rather than dense FPGA workloads. The GAL16V8B architecture can implement PAL-type arrangements through configurable output logic macrocells, giving designers access to multiple registered and combinational configurations. The exact -25 designation identifies the speed grade, while the LP suffix identifies the 20-pin PDIP package used in through-hole assemblies. Because GAL16V8 devices are programmed rather than mask-programmed, they support design revisions and reusable logic configurations. Typical applications include legacy peripheral interfacing, bus arbitration and decoding, industrial control logic, test-fixture sequencing, and compact state-machine implementations. In each case, the device provides a practical migration path for existing GAL16V8 or compatible PAL designs when an older CPLD requires replacement without changing the board footprint. PCB design should preserve the GAL16V8B pin arrangement, provide normal decoupling close to the supply connection, and include a programming interface if the fuse map changes during production. Before substituting a newer GAL16V8D device, verify AC timing, DC parameters, macrocell behavior, and programming compatibility against the manufacturer datasheet. This page combines the device's core architectural and timing characteristics with package-focused replacement guidance, an explicit parameter comparison, and practical implementation notes. It is intended to help engineers identify whether the GAL16V8B-25LP can be retained on an existing design or replaced on the same 20-pin through-hole footprint.

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GAL22V10D-15LPNI

GAL22V10D-15LPNI - 15ns 10-Macrocell E2CMOS PLD DIP-24 | Lattice

The Lattice Semiconductor GAL22V10D-15LPNI is a high-performance, electrically erasable CMOS Programmable Logic Device (PLD) in the industry-standard 22V10 architecture, packaged in a 24-pin PDIP (300-mil, through-hole DIP). It features 10 Output Logic Macrocells (OLMCs), a 15 ns maximum propagation delay, and an internal timing margin equivalent to roughly 83.3 MHz f_max, making it the highest-performance member of the GAL22V10 family. A PLD (Programmable Logic Device) is a digital integrated circuit whose logic function and interconnects are defined by the user after manufacture. Within the IC taxonomy, PLDs sit between fixed-function logic gates and full FPGAs: a PLD implements combinational and registered logic via a programmable AND/OR array with dedicated output macrocells, whereas an FPGA uses distributed look-up tables, block RAM and soft cores. The "22V10" naming convention means 22 inputs (12 dedicated + 10 feedback) feeding 10 macrocells with variable drive polarity — this generic footprint is supported across multiple vendors, including Lattice, Atmel/Microchip and AMD, giving designers drop-in second sources. Key features of the GAL22V10D-15LPNI include 10 ns / 15 ns propagation delay grades, electrically erasable (E2CMOS) technology allowing 100+ reprogram cycles, in-system programmable architecture, a built-in security bit to lock the pattern, and low CMOS standby current with TTL-compatible I/O. The device is functionally and parametric compatible with standard bipolar and CMOS 22V10 devices, including the classic PAL22V10. The GAL22V10D combines a high-performance CMOS process with Electrically Erasable (E2) floating gate technology. The 10 OLMCs are individually configurable as registered, combinatorial, or I/O with selectable output polarity, and feedback paths allow buried state machines. Unlike UV-erasable EPROM-based 22V10s, the E2CMOS cell can be erased electrically in-circuit, which simplifies prototyping and field upgrades. Typical applications include address decoding and glue logic for microprocessor systems, state-machine and sequencer controllers, bus arbitration logic, peripheral interface adapters, and industrial control replacements of legacy bipolar PALs. Through-hole PDIP packaging suits legacy boards, test fixtures, and aerospace/industrial designs where DIP is preferred over surface mount. When designing, remember the GAL22V10D-15LPNI requires a single 5 V supply (VCC = 4.75 V to 5.25 V) and the JEDEC-standard 22V10 fuse map. Use a Lattice-approved programmer (e.g., ispGAL22V10-compatible) to load the pattern; the security bit, once programmed, prevents readback of the device. This page synthesizes distributor stock data, parametric alternatives, and practical design guidance not aggregated on any single manufacturer or distributor page, giving engineers a single reference for sourcing and second-sourcing the GAL22V10D-15LPNI.

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GD32F105VCT6

GD32F105VCT6 - 108MHz Cortex-M3 MCU 256KB Flash LQFP-100

The GigaDevice GD32F105VCT6 is a 32-bit ARM Cortex-M3 microcontroller running up to 108 MHz with zero-wait-state Flash access, 256 KB on-chip Flash and 64 KB SRAM, housed in a 100-pin LQFP package. It integrates USB 2.0 Full-Speed OTG, two 12-bit ADCs (1 MSPS), two 12-bit DACs, and a rich set of peripherals (USART, SPI, I2C, CAN, timers) for cost-sensitive embedded designs. A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory, working memory, and I/O peripherals on a single silicon die. Within the semiconductor taxonomy, the GD32F105VCT6 sits at the hierarchy Microcontroller -> 32-bit MCU -> ARM Cortex-M3 MCU -> mainstream MCU -> GigaDevice GD32 family. It is designed as a drop-in upgrade path for STM32F103-class designs while adding USB OTG that STM32F103 lacks. Key features include 108 MHz max CPU clock with single-cycle multiply and hardware divide, a 12-bit ADC with up to 16 channels and 1 MSPS conversion rate, two 12-bit DAC channels, three general-purpose 16-bit timers plus one PWM timer, two USARTs plus two UARTs, two SPIs, two I2Cs, one USB FS OTG, one CAN 2.0B, and an operating voltage range of 2.6V to 3.6V. The device also supports external interrupts on all GPIO pins and a 7-channel DMA controller. The GD32F105VCT6 uses a 3-stage pipelined Cortex-M3 core with Thumb-2 instruction set, delivering 1.25 DMIPS/MHz (90 DMIPS at 72 MHz equivalent). Flash controller prefetch and 64-bit-wide Flash access deliver up to 50% higher CoreMark scores than competing Cortex-M3 parts at the same clock, making it well suited to real-time control loops, USB peripherals, and motor-control firmware. Typical applications include USB HID/CDC peripherals, industrial control boards, smart home gateways, motor drive controllers, consumer appliances, and cost-optimized IoT nodes. The LQFP-100 footprint matches the STM32F105/F103 100-pin layout, enabling reuse of existing PCB designs. When designing with this device, ensure the external 8 MHz HSE crystal is selected to drive the 108 MHz PLL; for USB applications a 48 MHz clock-accurate source is required. Decouple VDD/VDDA pins with 100 nF ceramics close to each pin and provide a 4.7 uF bulk capacitor for ADC noise suppression. This page synthesizes distributor pricing from LCSC and Pacific Component Xchange, drop-in alternatives from the STM32F103/F105 family, and practical design notes not consolidated in any single manufacturer document.

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GD32F407ZET6

GD32F407ZET6 - 168MHz Cortex-M4 MCU 512KB Flash | GigaDevice

The GigaDevice GD32F407ZET6 is a 32-bit high-performance microcontroller based on the Arm Cortex-M4 core operating at 168 MHz, with 512 KB on-chip Flash and 192 KB SRAM, housed in a 144-pin LQFP package. A microcontroller unit (MCU) is a single-chip computer that integrates a processor core, memory, and programmable peripherals on one die. Within the power-management and embedded-systems hierarchy, an MCU sits above discrete logic and below application processors, executing real-time control and connectivity tasks. The GD32F407 belongs to GigaDevice's GD32F4xx high-performance MCU series, a family positioned as a cost-effective, supply-secure alternative in the mainstream Cortex-M4 segment. Key features include up to three 12-bit 2.6 MSPS ADCs and two 12-bit DACs for precision analog acquisition, on-chip Ethernet MAC for industrial networking, USB HS/FS OTG for device and host modes, and CAN 2.0B for automotive and industrial fieldbus links. The core achieves Flash zero-wait-state access for maximum execution efficiency, and the peripheral set connects through two APB buses for deterministic I/O timing. Architecturally, the GD32F407xx integrates the Arm Cortex-M4 processor with its DSP and floating-point instruction extensions, enabling single-cycle MAC and hardware FPU for control-loop mathematics. Peripherals are routed through a multi-layer bus matrix that reduces arbitration contention between the core, DMA controllers, and high-bandwidth interfaces such as Ethernet and USB. Typical applications include industrial automation controllers, IoT gateways and connectivity nodes, motor drives, and communication equipment, where the combination of 168 MHz throughput, hardware Ethernet, and rich analog peripherals replaces discrete ADC and communication chips. Design consideration: apply decoupling capacitors at every VDD pin pair, and verify Flash wait-state configuration when operating the core at the full 168 MHz from the internal RC or external crystal clock source. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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Unterkategorien

Produkte (39.000+)

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FT4232HQ-REEL - USB 2.0 HS to Quad UART/MPSSE Bridge | FTDI

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FT812Q-R - Advanced EVE Graphics Controller, 56-QFN, Bridgetek

FT812Q-T - EVE2 Video Controller IC, SPI, 56-QFN | Bridgetek

FUSB251GEVB - USB Type-C CC/SBU Protection Eval Board | onsemi

FUSB251UCX - USB Type-C CC/SBU Protection Switch | onsemi

FUSB252UMX - USB Type-C CC & HSD Port Protection Switch | onsemi

FUSB302TMPX - USB Type-C PD Controller, 14-MLP | onsemi

FUSB302TV01MPX - USB Type-C PD Controller, 14-WQFN | onsemi

FUSB302TVMPX - USB Type-C PD Controller, 14-WQFN | onsemi

FUSB303 - Autonomous USB Type-C Port Controller, 15W | onsemi

FUSB307BMPX - USB Type-C TCPC Port Controller with USB-PD | onsemi

FUSB307BVMPX - USB Type-C Port Controller, USB-PD, 16-WQFN | onsemi

FX32K144HAT0MLLT - S32K144 80MHz ARM Cortex-M4F MCU 512KB | NXP

FXMA2102L8X - Dual Supply 2-Bit I2C Level Translator | onsemi

G - Component Identification and Datasheet Requirements

G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP

GAL16V8B-25LP - 25ns E2CMOS CPLD | Lattice Semiconductor

GAL22V10D-15LPNI - 15ns 10-Macrocell E2CMOS PLD DIP-24 | Lattice

GD32F105VCT6 - 108MHz Cortex-M3 MCU 256KB Flash LQFP-100

GD32F407ZET6 - 168MHz Cortex-M4 MCU 512KB Flash | GigaDevice