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MPC8569CVTAQLJB - PowerPC e500v2 MPU 1.067GHz 783-FCPBGA | NXP
MPC8569CVTAQLJB

MPC8569CVTAQLJB - PowerPC e500v2 MPU 1.067GHz 783-FCPBGA | NXP

The NXP MPC8569CVTAQLJB is a high-performance PowerPC e500v2 microprocessor IC from the MPC85xx family, integrating one 32-bit core running at up to 1.067 GHz and housed in a 783-ball FCBGA (FCPBGA) package measuring 29 x 29 mm. The part is part of the MPC8569 communications-processor line targeted at networking, telecom, and embedded infrastructure equipment. A microprocessor (MPU) is an integrated circuit that contains the arithmetic logic unit, control unit, registers, cache, and memory-management logic needed to execute operating systems, protocol stacks, and application code. The e500v2 core implements the Power Architecture technology with hardware MMU and double-precision floating-point support, and the device scales up to 1.33 GHz (per the broader MPC8569 datasheet family) with a Dhrystone rating near 2799 MIPS. The MPC85xx family sits within NXP's PowerQUICC and QorIQ communications-processor hierarchy, occupying the high-end position above MPC8533 and MPC8548 derivatives. Key features of this part include the PowerPC e500v2 core with 36-bit physical addressing, integrated DDR2/DDR3 memory controller with ECC, four Gigabit Ethernet controllers (SGMII/RGMII), PCI Express Gen 1, dual 10/100 Ethernet, and integrated security acceleration. The 'C' device revision marker indicates a specific silicon stepping, and 'TA' in the suffix denotes the 1.067 GHz speed grade operating across -40C to +105C ambient temperature for industrial and communications equipment. Typical applications include high-end routers, multiservice switches, line cards, edge aggregation, IP-PBX equipment, and industrial control nodes. The integrated SERDES lanes and multi-protocol Ethernet MACs allow direct connection to backplane transceivers and SFP cages without external PHY bridges in many designs. When designing with the MPC8569CVTAQLJB, follow the NXP hardware-design guide: provide a low-impedance 1.0V core supply with bulk capacitance placed within 25 mm of the BGA balls, route the DDR memory traces with matched impedance, and follow the BGA escape pattern in the package drawing. Thermal management is critical because the FCBGA can dissipate 10-15 W under full traffic load. This page synthesizes distributor pricing, package details, and parameter trade-offs not summarized in the manufacturer datasheet, helping procurement and hardware teams compare the MPC8569CVTAQLJB against same-package QorIQ alternatives and clarify the speed-grade vs temperature-position suffix encoding.

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MPC8569ECVJAQLJB - PowerQUICC III SoC, 1.067 GHz | NXP
MPC8569ECVJAQLJB

MPC8569ECVJAQLJB - PowerQUICC III SoC, 1.067 GHz | NXP

The NXP MPC8569ECVJAQLJB is a PowerQUICC III integrated communications processor built around the e500v2 core with a single 32-bit Power Architecture implementation running at up to 1.067 GHz, integrated in a 783-ball FCBGA (29x29 mm) package. A PowerQUICC III is a system-on-chip (SoC) communications processor family that combines a high-performance Power Architecture CPU core with integrated peripherals and communication accelerators, used widely in networking infrastructure. In the device taxonomy, MPC8569E sits below application-specific SoC and above plain MPU; its parent concept is the communications processor, and the broader hypernym is microprocessor. The device features dual GbE controllers, a hardware security engine (SEC), PCI Express and Serial RapidIO (SRIO) interfaces, DDR2/DDR3 memory controller, QUICC Engine TM (QE) for multi-protocol support, and an integrated LCD/USB controller in some variants. Operating voltage rails include 1.5 V, 1.8 V, 2.5 V and 3.3 V supplies on the same die, allowing glue-less connectivity to DDR2/DDR3, flash, and peripheral logic. At the silicon level, the e500v2 core is built on a 0.04 micron CMOS process with dual-issue out-of-order execution, Book-E compliant MMU and 36-bit physical addressing, providing ample headroom for routing-table workloads while keeping interrupt latency predictable for protocol termination. Typical applications include 3G/WiMAX/LTE base-station baseband, radio network controllers (RNC), multi-service gateways, ATM/TDM/IP aggregation routers, secure broadband access equipment, and industrial control with deterministic Ethernet. The target market segment is carrier-grade networking, where the combination of QE offload and SEC acceleration is decisive. Designers should plan for a 4-layer to 8-layer PCB with controlled-impedance routing for SRIO and PCIe lanes, generous decoupling, and a Thermal Dissipation budget that respects the typical 19 W to 25 W FCBGA envelope. Use JTAG/COP for bring-up; the BGA does not allow rework of inner balls. This page consolidates manufacturer datasheet specifications, distributor stock and lead-time signals, plus drop-in same-family guidance not found in stock distributor listings, helping procurement and design engineers reduce time-to-decision for this EOL PowerQUICC III device.

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MPC8569EVJANKGB - PowerQUICC III 800MHz SoC | NXP FCBGA-783
MPC8569EVJANKGB

MPC8569EVJANKGB - PowerQUICC III 800MHz SoC | NXP FCBGA-783

The NXP MPC8569EVJANKGB is a 32-bit PowerQUICC III system-on-chip featuring an e500v2 core running at 800 MHz, integrated in a 783-ball FCBGA (29x29 mm) package with industrial 0C to 105C temperature grade. The device pairs a high-performance Power Architecture core with the classic QUICC Engine communication accelerator, supporting broadband access and multi-protocol traffic workloads in a single silicon platform. A PowerQUICC III SoC is a member of the communications-processor family that combines one or more Power Architecture cores with specialised on-chip peripherals (the QUICC Engine, security engine, DDR controller, SerDes) to offload packet processing from the CPU. The taxonomy is: communications processor -> embedded processor -> microprocessor (MPU) -> integrated circuit. PowerQUICC III parts target routing, switching, base-station, and gateway designs where deterministic protocol handling matters as much as raw MHz. Headline features include an e500v2 core at 800 MHz, on-chip DDR2/DDR3 memory controller, dual SerDes supporting SRIO and PCI Express, Gigabit Ethernet (GbE), a Security Engine (SEC), and the QUICC Engine for multi-protocol termination. The wide peripheral mix lets one MPC8569E device replace what previously required a CPU plus several ASICs, reducing board area and BOM cost. Architecturally, the e500v2 Book-E core implements a superscalar dual-issue pipeline with hardware MMU and 32 KB I/D L1 caches, while the QUICC Engine runs independent RISC microcode for ATM, HDLC, Ethernet, and PPP termination concurrently with the core. Integrated SerDes lanes, a multi-bank DDR2/DDR3 controller with ECC, and the Security Engine supporting DES/3DES/AES/SHA/RSA place the MPC8569E in the 800-1000 MHz class of communications SoCs. Typical applications include 3G/WiMAX/LTE base-station control-plane processors, radio network controllers (RNC), multiservice gateways, ATM/TDM/IP edge equipment, and routers requiring hardware-accelerated encryption. The combination of GbE plus SRIO plus PCIe makes the part well-suited to mid-range router line-cards and network appliances. When designing with this part, allocate adequate thermal copper to the 29x29 mm FCBGA to keep junction temperature below the 105C limit, and follow NXP's hardware design checklist for DDR3 trace length matching and SerDes reference-clock routing. This page synthesises distributor pricing, lifecycle status, and drop-in package-matched alternatives from the MPC8569E PowerQUICC III family not found in the manufacturer datasheet alone.

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MPC8569EVJAUNLB - PowerQUICC III SoC, 1.333 GHz e500, 783-FCPBGA | NXP
MPC8569EVJAUNLB

MPC8569EVJAUNLB - PowerQUICC III SoC, 1.333 GHz e500, 783-FCPBGA | NXP

The NXP MPC8569EVJAUNLB is a PowerQUICC III integrated communications processor combining a 1.333 GHz e500v2 Power Architecture core with high-bandwidth serial interconnect for embedded networking equipment. The device integrates a single 32-bit e500v2 core, 512 KB of L2 cache, a hardware Security Engine (SEC), and a DPAA-aligned QUICC Engine block, all in a 783-ball FCBGA (29x29 mm) package rated for 0-105C operation. It is built on a 0.04 micron CMOS process and supports DDR2/DDR3 SDRAM with ECC, dual 10/100/1000 Mb/s Ethernet, PCI Express, Serial RapidIO, and the QUICC Engine for legacy TDM/POS protocols. A PowerQUICC processor is a family of Power Architecture-based communications processors designed by Freescale (now NXP) to consolidate control-plane and data-plane processing for routers, base stations, and access multiplexers. The MPC8569E specifically extends the QorIQ/PowerQUICC lineage by pairing a fast e500v2 CPU with serial interconnect IP that replaces parallel local buses, while still maintaining TDM support through the QUICC Engine subsystem. Key features include 1.333 GHz core frequency, 72-bit (64-bit + ECC) DDR2/DDR3 memory controller up to 800 MT/s, integrated Security Engine with AES, 3DES, RSA, and elliptic-curve acceleration, dual GbE with SGMII support, two PCI Express interfaces, two Serial RapidIO interfaces, and the Universal Serial QUICC Engine for multi-protocol bridging. Operating voltage rails include 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails sourced through a sequenced power scheme. The MPC8569E uses a 783-ball FCBGA package with a thermal resistance of approximately 12-15 C/W and requires a heatsink for sustained 1.333 GHz operation. The e500v2 core executes Power Architecture Book E instructions with a double-precision FPU, MMU with 32-bit virtual addressing, and hardware-accelerated table-walk for high-TLB-miss workloads such as routing lookups. Typical applications include 3G/WiMAX/LTE base station controllers, radio network controllers (RNC), multi-service gateways, ATM/TDM/IP aggregation switches, and secure industrial routers. The integrated SEC and QUICC Engine make it well suited to IPsec VPN concentrators and protocol-conversion appliances bridging legacy TDM to packet networks. When designing with this device, ensure the DDR2/DDR3 routing follows the JEDEC-controlled-impedance guidelines and that the SERDES reference clocks use a low-jitter oscillator. The QUICC Engine microcode must be loaded from NAND/NOR at boot; an appropriate boot sequencer or board support package is required to initialize SERDES lanes and PCIe endpoints.

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MPC8569EVTANKGB - PowerPC e500v2 MPU 800MHz 783-FCBGA | NXP
MPC8569EVTANKGB

MPC8569EVTANKGB - PowerPC e500v2 MPU 800MHz 783-FCBGA | NXP

The NXP MPC8569EVTANKGB is a high-performance PowerPC e500v2 microprocessor unit (MPU) belonging to the PowerQUICC III MPC85xx integrated communications processor family, running at 800 MHz in a 783-ball FCBGA package measuring 29 mm x 29 mm with 1 mm pitch. It implements the Power Architecture technology with the 32-bit e500 core, a Double Harvard memory architecture, and integrated QUICC Engine and Security (SEC) co-processors, alongside DDR2/DDR3 SDRAM memory controllers with ECC support. An MPU (microprocessor unit) is an integrated circuit that contains the complete CPU function on a single chip, integrating the ALU, control unit, register file, caches, and (in SoC-class MPUs like the MPC8569) memory controllers and peripheral interfaces. The MPC8569E sits within the taxonomy: MPU -> microprocessor -> processor -> digital IC -> integrated circuit. PowerQUICC III parts target networking infrastructure, telecom equipment, and storage systems where deterministic performance and rich peripheral integration reduce system BOM cost. Key features of the MPC8569EVTANKGB include the 800 MHz e500v2 core delivering 1675 MIPS (Dhrystone 2.1), 36-bit physical addressing for large-memory support, integrated 10/100/1000 Ethernet MACs, PCIe interface, Serial RapidIO, multiple UART/SPI/I2C controllers, and a hardware packet-handling QUICC Engine subsystem. The device operates from 1.0 V core with 1.5 V/1.8 V/2.5 V/3.3 V I/O supply rails, and includes a 32-bit DDR2/DDR3 memory controller with ECC. The MPC8569E is fabricated in a 90 nm CMOS process and integrates dual GbE, packet classification engines, a security engine (SEC 3.x), and an enhanced local bus controller. The architecture supports symmetric and asymmetric multiprocessing, virtualization aids, and dynamically configurable power management. The e500v2 core features dual-issue out-of-order execution, sixteen 32-bit general-purpose registers, and hardware MMU supporting 4 KB / 64 KB / 1 MB page sizes. Typical applications include Multi-Service Routers, IMS (IP Multimedia Subsystem) gateways, Ethernet switches, Network Attached Storage (NAS) controllers, Wireless Base Station controllers, and industrial control equipment. The integrated QUICC Engine off-loads RISC-class protocol processing, freeing the main e500 core for application-layer code. When designing with the MPC8569E, allocate adequate PCB real estate for the 29 mm x 29 mm FCBGA - it requires a multi-layer (typically 8+ layer) PCB with controlled-impedance routing. Provide a robust power-on reset circuit and follow NXP's hardware specifications for SERDES reference clock jitter, DDR3 termination, and decoupling capacitor placement. This page synthesizes distributor pricing, hardware design notes, package-level drop-in alternatives within the PowerQUICC III family, and parametric comparisons not found in the manufacturer datasheet alone.

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MPC8569EVTAUNLB - PowerPC e500v2 MPU 1.33GHz 783-FCPBGA | NXP
MPC8569EVTAUNLB

MPC8569EVTAUNLB - PowerPC e500v2 MPU 1.33GHz 783-FCPBGA | NXP

The NXP Semiconductors MPC8569EVTAUNLB is a high-performance PowerPC e500v2 microprocessor from the MPC85xx family, integrating one 32-bit core running at up to 1.333 GHz with approximately 2799 MIPS (estimated Dhrystone) while housed in a 783-ball FCBGA (29x29 mm) package. The device implements Power Architecture technology with 36-bit physical addressing and double-precision floating-point capability through a system-on-chip integration that combines processing, peripherals, and high-speed serial interfaces. A microprocessor (MPU) is the central processing unit of an embedded computing system, executing the operating system and application workloads. The MPC85xx family is NXP's (formerly Freescale) high-end communications processor line, fitting into the broader taxonomy of: MPU -> embedded processor -> integrated circuit -> semiconductor. These parts target networking, telecom, and data-plane applications where deterministic throughput, hardware offload engines, and signal-processing performance matter more than raw single-thread frequency. Key features include a 32-bit e500v2 core with double-precision floating-point, 36-bit physical addressing for large memory mapping, integrated peripherals that reduce external component count, and a typical operating voltage set of 1.5V / 1.8V / 2.5V / 3.3V across separate supply rails. The 783-FCPBGA package provides high-density interconnect for multi-GHz operation while supporting board-level signal integrity at GbE and serial RapidIO data rates. The MPC8569EVTAUNLB uses a 0.04-micron process technology and integrates Power Architecture technology peripherals - including enhanced local bus, DDR memory controller, DMA, and serial interfaces - eliminating the need for many companion chips. Its estimated performance ceiling of 2799 MIPS at 1.333 GHz positions it for wire-speed packet processing, network protocol termination, and embedded data-path workloads. Typical applications include enterprise networking switches and routers, telecom base-station control planes, industrial control servers, storage area network controllers, and secure VPN appliances. The high integration lets system designers replace multi-chip designs with one MPC8569 + memory subsystem, reducing BOM cost and board area in temperature-controlled rack-mounted equipment. When designing with this device, allocate adequate PCB layers (typically 8-12) for the high-speed DDR and SerDes routing, and provide decoupling per the manufacturer's hardware design guide. This synthesis of distributor pricing, drop-in variants, and practical design guidance extends beyond the datasheet alone.

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MPC8569VJAUNLB - 1.333GHz PowerQUICC III MPU | NXP | 783-FCPBGA
MPC8569VJAUNLB

MPC8569VJAUNLB - 1.333GHz PowerQUICC III MPU | NXP | 783-FCPBGA

The NXP MPC8569VJAUNLB is a PowerQUICC III family communications processor integrating a PowerPC e500v2 core running at up to 1.333 GHz with the QUICC Engine communications acceleration block, packaged in a 783-ball FCBGA at 29 mm x 29 mm. The SoC targets broadband access, 3G/WiMAX/LTE base stations, RNCs, and multi-protocol gateway equipment where deterministic packet processing coexists with a high-performance control plane. A microprocessor unit (MPU) such as the MPC8569E integrates one or more processor cores, cache subsystems, memory controllers, and on-chip peripherals into a single System-on-Chip. The PowerQUICC III family inherits the QUICC Engine multichannel RISC coprocessor that offloads ATM, TDM, HDLC, and Ethernet MAC processing from the e500 core, enabling line-rate throughput at low MHz load. Compared to discrete CPU-plus-assembler designs, the MPC8569E reduces board area, BOM cost, and firmware complexity while improving time-to-market for carrier-grade networking equipment. Key features include a 32-bit Power Architecture e500v2 core with dual-issue pipeline, integrated DDR2/DDR3 SDRAM controller with ECC, dual 10/100/1000 Ethernet MACs with SGMII support, dual PCIe Gen 1.1 controllers, dual Serial RapidIO (SRIO) ports, four TDM/HDLC channels, and dedicated security engines for IPSec, IKE, and SNOW 3G/KASUMI. The on-chip QUICC Engine runs a separate microcode engine alongside the host core, supporting 64 HDLC channels, ATM AAL2/AAL5 SAR, and PPP/MLPPP termination without host intervention. Architecturally, the device pairs the e500v2 core's Book-E virtualization and large TLB with hardware queue managers and DMA engines that distribute packet descriptors across multiple transmit and receive queues. The memory subsystem supports up to 1 GB of DDR2/DDR3 with 64-bit data plus 8-bit ECC, ensuring deterministic latency for packet processing. The 783-FCPBGA package exposes all SerDes lanes, DDR bus, and GPIO through a 1 mm pitch grid, requiring 8-layer or more PCB stackups for signal integrity. Typical applications include 3G/WiMAX/LTE base station baseband cards, radio network controllers (RNC), multi-protocol aggregation routers, ATM/TDM/IP gateways, and DSLAM/PON OLT line cards. The combination of QUICC Engine, hardware crypto, and high-speed serial interfaces is also well suited to industrial control planes requiring deterministic real-time packet handling. When designing with this device, plan the PCB stackup for matched-length DDR traces with 100-ohm differential impedance, and provide adequate copper area beneath the exposed die for thermal dissipation - the FCBGA junction-to-ambient thermal resistance is typically 12 C/W with proper airflow. Power sequencing of the 1.0V core and 1.5V/1.8V/2.5V/3.3V I/O rails must follow the NXP datasheet sequence to prevent latch-up. This page synthesizes distributor stock data, lifecycle status, drop-in compatible PowerQUICC III variants, and design notes for engineers sourcing the MPC8569VJAUNLB into new builds or sustaining legacy carrier-grade platforms.

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MPC8569VTANKGB - PowerQUICC III MPU, 800MHz, e500v2 SoC | NXP
MPC8569VTANKGB

MPC8569VTANKGB - PowerQUICC III MPU, 800MHz, e500v2 SoC | NXP

The NXP Semiconductors (formerly Freescale) MPC8569VTANKGB is a high-performance PowerQUICC III microprocessor based on the 32-bit Power Architecture e500v2 core, integrating communications peripherals with a 783-ball FCBGA (29x29 mm) package. Per the verified web data, it operates at up to 800 MHz core frequency, supports 36-bit physical addressing, and integrates Double-precision Floating Point and Signal Processing Engine (SPE) units for compute-intensive workloads. What is a PowerQUICC MPU? A PowerQUICC (pronounced "power-quic") is a family of communications processors that combine a Power Architecture CPU core with integrated networking, DMA, and serial RapidIO/PCI Express peripherals - effectively a System-on-Chip (SoC) for embedded networking. Within the broader taxonomy: e500v2 core -> Power Architecture -> 32-bit RISC microprocessor -> MPU/MPSoC -> semiconductor. PowerQUICC III parts like the MPC8569 are commonly positioned between general-purpose PowerPC microprocessors (e.g., MPC8536) and DSP-laden network processors, optimized for routing, switching, base-station control, and storage area network (SAN) bridging. Key features highlighted by the verified web data include integrated SRIO (Serial RapidIO), PCIe, GbE (Gigabit Ethernet) MACs, DDR2/DDR3 memory controller with ECC, QUICC Engine (QE) for protocol acceleration, and Security Engine. The 783-FCPBGA 29x29 mm package uses a flip-chip ball grid array suitable for high-speed multi-layer PCB designs and provides adequate thermal dissipation for the typical 5-15W power envelope. From a technical perspective, the e500v2 core implements Book E instruction set with hypervisor mode, vector/SIMD support, and double-precision FPU. The integrated Memory Controller supports DDR2/DDR3 with ECC at up to 533 MHz (per web data). The QUICC Engine is a separate RISC controller that offloads TDM, HDLC, ATM, and Ethernet bitstream processing, freeing the e500 core for higher-level software stacks such as Linux, VxWorks, or Green Hills INTEGRITY. Typical applications include edge routers, multi-service switches, base station controllers, industrial network gateways, and storage controllers. The wide operating temperature range (0C to 105C junction, per the NXP datasheet excerpt) supports industrial environments. When designing with this device, ensure a 6-8 layer PCB with controlled-impedance routing for DDR3, SRIO, and PCIe, plus adequate copper for thermal dissipation. The QUICC Engine firmware (uImage) must be loaded at boot from Flash or host - this is often overlooked by first-time designers and can prevent the device from initializing. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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MPC8569VTAUNLB - PowerQUICC III MPU 1.333GHz 783-FCBGA | NXP
MPC8569VTAUNLB

MPC8569VTAUNLB - PowerQUICC III MPU 1.333GHz 783-FCBGA | NXP

The NXP MPC8569VTAUNLB is a PowerPC e500v2 based PowerQUICC III microprocessor with one 32-bit core running up to 1.333 GHz, packaged in a 783-ball FCBGA (FC-PBGA) measuring 29 x 29 mm and supporting 36-bit physical addressing. The part integrates the classic PowerQUICC III communication engine plus on-chip L1/L2 caches, DDR2/DDR3 memory controllers, and high-speed serial interfaces, targeting wireline networking and telecom infrastructure. What is an MPU (Microprocessor Unit)? An MPU is the central processing core of an embedded system - distinct from a microcontroller (MCU) because it relies on external memory (DDR, NAND) and companion chips for I/O. In the broader taxonomy, the MPC8569VTAUNLB sits as: PowerPC core -> PowerQUICC family -> communications processor -> embedded MPU -> 32-bit RISC processor -> semiconductor IC. PowerQUICC III processors were historically the workhorse of networking line cards, base stations, and edge routers. Key features include a 1.333 GHz e500v2 core delivering an estimated 2799 MIPS (Dhrystone 2.1), dual-issue superscalar pipeline, integrated QUICC Engine subsystem, three Ethernet MACs supporting 10/100/1000 Mbps, and four SerDes lanes for SGMII, XAUI, or PCI Express connectivity. The device supports multiple voltage rails at 1.0 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V to interface with legacy logic and modern DDR memory. The MPC8569VTAUNLB uses a 45 nm process and pairs the e500v2 core with a large unified L2 cache. It implements Power Architecture technology with hardware virtualization and ECC-protected memory paths. The integrated QUICC Engine handles multi-protocol channelized TDM, HDLC, and ATM traffic, offloading the core from routine packet processing. Typical applications include multi-service routers, DSLAM line cards, wireless base station controllers, industrial Ethernet switches, and secure network appliances. The wide voltage tolerance also supports industrial control planes with mixed logic families. When designing with this part, allocate sufficient PCB area for the 29 x 29 mm FCBGA land pattern and follow NXP's thermal and decoupling guidelines. Use a multi-phase core voltage regulator to meet the in-rush current profile at cold start. Plan firmware support around a Linux BSP or VxWorks BSP because legacy bare-metal stacks are becoming harder to maintain. This page consolidates distributor pricing, drop-in alternative listings, and practical design notes not found in any single source on the web, helping procurement and hardware engineers evaluate the part for long-lifecycle embedded designs.

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MPC8572CLVTAULD - PowerQUICC III 1.333GHz 2-Core MPU | NXP
MPC8572CLVTAULD

MPC8572CLVTAULD - PowerQUICC III 1.333GHz 2-Core MPU | NXP

The NXP MPC8572CLVTAULD is a PowerQUICC III integrated communications processor built on a PowerPC e500 dual-core architecture, delivering up to 1.333 GHz of core frequency in a 1023-ball FCBGA (33x33 mm) package with a 32-bit datapath. It targets symmetric and asymmetric multi-core designs requiring high-performance packet processing for networking and communications infrastructure. What is a PowerQUICC processor? PowerQUICC is NXP/Freescale's family of communications processors that integrate one or more PowerPC CPU cores with dedicated peripheral subsystems (QUICC Engine, SerDes, DMA, security accelerators). The MPC8572 belongs to the PowerQUICC III sub-family, which scales from single-core to dual-core and is positioned between general-purpose microcontrollers and full network ASICs. It is widely deployed in routers, switches, base stations, and storage area network equipment where deterministic throughput is required. Key features include 32 KB L1 instruction and data caches per core, a 1 MB shared L2 cache, four Gigabit Ethernet controllers (eTSEC), integrated security engine, PCI Express and RapidIO interfaces, and DDR2/DDR3 memory controllers. The device supports extended temperature operation suitable for industrial and outdoor telecom environments. The architecture combines two e500 cores with NXP's QUICC Engine technology, offloading protocol processing (ATM, HDLC, PPP, Ethernet) from the cores. This heterogeneous approach delivers high throughput while keeping per-port power consumption low, making the MPC8572 well suited for mid-range multi-service access platforms. Typical applications include multi-service routers, wireless base station controllers, line cards with packet classification, and industrial control planes. The 1023-FCBGA package integrates power, ground, and high-speed SerDes pins required for 10+ Gbps aggregate throughput. When designing with this part, allocate generous PCB area for the FCBGA break-out, use matched-length SerDes routing for RapidIO/PCIe, and provide sufficient decoupling for the multi-rail power supply (1.0V, 1.5V, 2.5V, 3.3V). Airflow or heatsink attachment is recommended above 15W dissipation. This page synthesizes distributor pricing, parameter cross-reference, and design notes not found in the manufacturer datasheet alone, enabling faster component evaluation for high-performance networking designs.

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MPC8572ECLPXATLE - Dual-Core 1.2GHz PowerQUICC III SoC | NXP
MPC8572ECLPXATLE

MPC8572ECLPXATLE - Dual-Core 1.2GHz PowerQUICC III SoC | NXP

The NXP MPC8572ECLPXATLE is a dual-core 32-bit PowerPC e500 microprocessor from the PowerQUICC III family, integrating two e500 cores running up to 1.2 GHz, DDR2/DDR3 memory controller, PCIe, Gigabit Ethernet, Serial RapidIO (SRIO), and Security (SEC) acceleration in a single 1023-pin FCBGA package measuring 33 x 33 mm. A SoC (System-on-Chip) is an integrated circuit that consolidates a microprocessor, memory controllers, peripherals, and hardware accelerators onto a single die. The PowerQUICC III architecture belongs to NXP's (formerly Freescale) Power Architecture communications processor lineage, specifically targeting multi-core networking and telecom infrastructure. The MPC8572E variant introduces dual-core symmetric multiprocessing for parallel packet processing workloads, distinguishing it from single-core PowerQUICC predecessors and positioning it as a bridge device between single-core MPC8568/MPC8569 designs and higher-end QorIQ platforms. Key specifications include dual e500 cores at 1.2 GHz, 32 KB L1 instruction cache and 32 KB L1 data cache per core, integrated DDR2/DDR3 memory controller with ECC, three PCIe interfaces, dual Gigabit Ethernet MACs, Serial RapidIO fabric, and hardware-accelerated SEC for IPSec/SSL/TLS. The high-integration approach reduces BOM count in line cards, routers, and wireless base stations while lowering power per Mbps processed. Typical applications include multi-service routers, enterprise switches, wireless base station controllers, industrial networking gateways, and secure VPN appliances. The dual-core architecture allows parallel handling of control plane and data plane traffic, while the integrated SEC engine offloads encryption without burdening CPU cycles. When designing with this processor, allocate adequate PCB layers (typically 8-10) to route the 1023-ball FCBGA and DDR2/DDR3 matched-length traces. Use NXP's reference design and U-Boot for board bring-up, and follow the hardware specifications document for power sequencing.

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MPC8572ECLVTAULE - PowerQUICC III 2x1.33GHz SoC, 1023-FCBGA | NXP
MPC8572ECLVTAULE

MPC8572ECLVTAULE - PowerQUICC III 2x1.33GHz SoC, 1023-FCBGA | NXP

The NXP MPC8572ECLVTAULE is a PowerQUICC III integrated communications processor featuring a dual-core PowerPC e500 architecture running at 1.333 GHz, housed in a 1023-ball FCBGA (33x33 mm) package. It is a 32-bit MPU with 2 cores, 1.333 GHz core clock, integrated DDR2/DDR3 memory controller, PCI Express, Gigabit Ethernet, Serial RapidIO, and a security engine (SEC). The operating temperature range is -40C to +105C for industrial/extended-grade deployment. An MPU (Microprocessor Unit) is a system-on-chip CPU that integrates one or more processor cores, memory controllers, and a wide range of peripheral interfaces on a single die, enabling compact embedded and networking designs. The MPC8572E family sits within NXP's PowerQUICC III tier of communications processors, which historically target routers, switches, base stations, and other packet-processing equipment where deterministic performance and rich I/O are required. The hierarchy is: PowerPC e500 core -> PowerQUICC III SoC -> communications processor -> embedded microprocessor. Key features of the MPC8572ECLVTAULE include dual e500 cores with symmetric multiprocessing support, integrated DDR2/DDR3 SDRAM controller with ECC, three PCI Express interfaces, dual Gigabit Ethernet MACs with SGMII support, Serial RapidIO fabric, hardware-accelerated security engine, and 32-bit peripheral support. The silicon revision is R2.2.1 (the 'E' suffix). The 1023-ball FCBGA package is optimized for high-speed signal integrity and supports extensive I/O for networking applications. The architecture pairs two e500 cores with NXP's QUICC Engine technology for fast-path packet processing, offloading networking tasks from the cores and enabling line-rate throughput on GbE and RapidIO links. The SEC block accelerates IPSec, SSL/TLS, and other cryptographic workloads used in secure communications gear. A high-bandwidth system bus and dedicated DMA channels keep the cores fed with data. Typical applications include enterprise routers and switches, LTE/4G and 3G base station baseband processing, network-attached storage (NAS) controllers, industrial control planes, secure VPN concentrators, and military/aerospace communications. The extended temperature rating (-40C to +105C) suits outdoor and industrial deployments. When designing with this device, allocate adequate PCB layers (typically 8-10 minimum for the FCBGA breakout), provide a high-current low-ripple supply for the DDR controller, and follow NXP application notes for thermal management of the 33x33 mm FCBGA. Designers should also verify software/firmware support for the R2.2.1 silicon revision in their toolchain. This page synthesizes distributor pricing, drop-in compatible alternatives, and practical design notes not found in the manufacturer datasheet. Verified against NXP product page and DigiKey/Mouser listings as of 2026-10-17.

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MPC8572ECPXAULD - PowerQUICC III Dual-Core SoC 1.333GHz | NXP
MPC8572ECPXAULD

MPC8572ECPXAULD - PowerQUICC III Dual-Core SoC 1.333GHz | NXP

The NXP MPC8572ECPXAULD is a PowerQUICC III integrated communications processor featuring dual PowerPC e500 cores running at up to 1.333 GHz in a 1023-ball FCBGA (33x33 mm) package. It pairs two 32-bit superscalar e500 cores with 36-bit physical addressing, an integrated double-data-rate memory controller supporting DDR2/DDR3, on-chip SRAM, four Gigabit Ethernet MACs with SerDes, a multi-PHY serial interface, and PCI Express connectivity for backplane and line-card designs. A PowerQUICC III is a PowerPC-based communication processor targeting networking infrastructure. The MPC8572E sits in the MPU hierarchy as a high-performance dual-core SoC, between the simpler MPC8347 and the higher-integration MPC8641D. Two e500 cores share a 512 KB L2 cache and an enhanced system bus that can sustain multi-gigabyte throughput to DDR memory. The architecture was designed to consolidate routing, switching, and packet-processing workloads that previously required discrete NPUs plus an external CPU. The device integrates hardware acceleration for packet header inspection, policing, and queuing, plus four tri-speed Gigabit Ethernet controllers. According to the verified NXP datasheet summary, the part supports 1.8V / 2.5V / 3.3V I/O mixed-voltage operation and is fabricated in a 90 nm CMOS process. Industrial temperature grade suitability makes the part viable for carrier-grade edge equipment with extended ambient ranges. The FCBGA-1023 substrate exposes dedicated high-speed serial lanes, two 64-bit DDR controllers, and a local bus for legacy peripheral glue. Typical applications include enterprise routers, multi-service edge platforms, DSLAM/CMTS line cards, secure gateway appliances, industrial control planes, and storage controllers. The dual e500 cores enable routing plus control-plane concurrency, while the integrated MACs and SerDes eliminate multiple external PHY ICs and reduce BOM cost. The 1023-pin FCBGA is intended for multi-layer high-speed boards using standard SMT reflow with careful BGA escape routing. When designing around this part, allocate the inner BGA rows for high-speed SERDES and DDR signals to keep trace lengths matched. Use at least eight PCB layers with continuous ground planes adjacent to SERDES lanes. Thermal design must account for the full 1.333 GHz dual-core activity; a 33x33 FCBGA with thermal vias to inner copper islands keeps junction temperature within rated limits. This page consolidates NXP datasheet parameters, 1023-FCBGA dimensional data, and populated pricing to help network hardware engineers evaluate the MPC8572ECPXAULD as a drop-in candidate for new builds and legacy PowerQUICC III refreshes.

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MPC8572ECPXAVND - 1.5GHz Dual-Core PowerPC e500 MPU | NXP
MPC8572ECPXAVND

MPC8572ECPXAVND - 1.5GHz Dual-Core PowerPC e500 MPU | NXP

The NXP MPC8572ECPXAVND is a PowerPC e500 dual-core microprocessor from the MPC8572E PowerQUICC III family, operating at up to 1.5 GHz with a 32-bit datapath and packaged in a 1023-ball FCBGA measuring 33x33 mm. Designed for high-performance networking and telecommunications infrastructure, the device integrates two e500 cores with separate L1 caches and a shared L2 cache to deliver deterministic throughput for control-plane and data-plane workloads. Per the manufacturer datasheet (MPC8572E PowerQUICC III Hardware Specifications), the SoC supports DDR2/DDR3 memory controllers, multiple Gigabit Ethernet interfaces, PCI Express, RapidIO, and dedicated hardware acceleration for security, pattern matching, and queue management. A microprocessor (MPU) is a single-chip CPU that integrates one or more processor cores, cache memory, memory controllers, and peripheral interfaces onto a single silicon die. Within the broader taxonomy, the MPC8572E sits at the hierarchy MPU -> microprocessor -> processor -> integrated circuit -> semiconductor, and is classified as an embedded communications processor rather than a general-purpose CPU such as those used in PCs. The PowerQUICC III family specifically targets routers, switches, base stations, and storage area network controllers where deterministic latency and rich I/O integration outweigh raw single-thread speed. Key features include dual e500 cores at 1.5 GHz, on-chip L2 cache, integrated DDR2/DDR3 memory controller with ECC, four GbE ports, four SerDes lanes configurable for PCI Express or Serial RapidIO, and a programmable QUICC Engine for protocol termination. The 1023-ball FCBGA package exposes the full complement of address, data, and high-speed serial interfaces required by line-card designs. Extended temperature grade screening (AVND suffix) supports industrial operating ranges from -40C to +105C ambient, addressing outdoor and ruggedized networking equipment. Architecturally, the MPC8572E combines two scalar e500 cores with a 512 KB shared L2 cache, a 64-bit DDR2/DDR3 memory controller with ECC, and a high-bandwidth system bus that ties the cores to the multi-port Ethernet switch fabric and QUICC Engine block. The on-chip hardware accelerators offload cryptographic operations (AES, 3DES, SHA, Kasumi), packet parsing, and QoS queue management, freeing the cores for routing and control-plane software. This level of integration reduces board BOM count and simplifies multi-PCB designs that would otherwise require discrete ASSPs. Typical applications include enterprise and carrier-grade routers, multi-service switching platforms, wireless base stations (especially LTE NodeB and femtocell implementations), storage area network controllers, and industrial control systems requiring deterministic performance with rich I/O. The extended temperature rating also makes the part suitable for outdoor industrial gateways and ruggedized defense networking gear. When designing with this device, allocate generous power decoupling and thermal management - peak power dissipation in the dual-core 1.5 GHz configuration can exceed 25 W and the 33x33 mm FCBGA requires a multi-layer PCB with via-in-pad thermal vias to keep junction temperature within the extended temperature range. Designers should follow NXP application notes for power sequencing, DDR3 trace matching, and reference clock distribution. This page synthesizes distributor pricing for NXP part MPC8572ECPXAVND, drop-in alternatives from the same PowerQUICC III family and competing MPU families, and practical design notes not consolidated on the manufacturer datasheet front page.

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MPC8572ECVTARLE - 1.067GHz Dual-Core e500 MPU | NXP
MPC8572ECVTARLE

MPC8572ECVTARLE - 1.067GHz Dual-Core e500 MPU | NXP

The NXP MPC8572ECVTARLE is a PowerPC e500 dual-core microprocessor in NXP's PowerQUICC III family (MPC85xx), fabricated on a 90 nm process and packaged in a 1023-ball FCBGA (33x33 mm). Core speed is 1.067 GHz per core, with separate 32-bit execution paths and integrated DDR2/DDR3 memory controllers for high-bandwidth system memory access. The device integrates two e500 cores, integrated peripherals including PCI Express, Gigabit Ethernet, Serial RapidIO (SRIO), and an embedded security engine (SEC), making it a true system-on-chip (SoC) for embedded communications. A multiprocessor unit (MPU) like the MPC8572ECVTARLE combines one or more processor cores, cache, memory controllers and I/O peripherals on a single die. The PowerQUICC III family sits in NXP's Power Architecture (PowerPC e500) lineage, and within the MPU hierarchy it belongs to the communications-processor segment (broadly: MPU -> embedded processor -> SoC -> communications processor). The SoC category targets routers, switches, base stations, and storage controllers where deterministic packet handling, hardware acceleration, and multi-protocol I/O are required. Key features include dual PowerPC e500 cores at 1.067 GHz with 32-bit ISA, DDR2/DDR3 memory controller with ECC, integrated PCI Express, Gigabit Ethernet, Serial RapidIO, security accelerator (SEC), and signal-processing engine (SPE). Industrial temperature grade (-40C to +105C) and a 1023-ball FCBGA (33x33 mm) package support high-density PCB designs. The 90 nm process delivers a balance of performance and leakage suitable for embedded applications. The MPC8572ECVTARLE uses a symmetric dual-core PowerPC e500 architecture with a shared platform coherency fabric, enabling symmetric multiprocessing (SMP) across both cores. Hardware acceleration offloads packet processing, encryption, and signal processing from the cores, freeing CPU cycles for control-plane and exception-path handling. The integrated DDR2/DDR3 controller with ECC supports memory bandwidth appropriate for line-rate gigabit networking. Typical applications include enterprise routers and switches, wireless base stations, network security appliances, industrial control with networking, and storage controllers. The integrated SERDES lanes (PCIe, SRIO, GbE) reduce external PHY count and BOM in these systems. For the 1023-FCBGA, full thermal and power integrity requires a high-layer-count PCB with continuous ground and power planes; signal integrity demands controlled-impedance routing for all high-speed serial links and matched-length DDR traces. This page synthesizes distributor pricing, drop-in NXP QorIQ alternatives, and design notes not found in the manufacturer datasheet alone.

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MPC8572ECVTAULE557 - PowerQUICC III 2-Core 1.333GHz SoC | NXP
MPC8572ECVTAULE557

MPC8572ECVTAULE557 - PowerQUICC III 2-Core 1.333GHz SoC | NXP

The NXP MPC8572ECVTAULE557 is a PowerQUICC III integrated communications processor in the MPC85xx family, featuring dual PowerPC e500 cores running at up to 1.333 GHz, packaged in a 1023-ball FCBGA (33x33 mm) with 32-bit datapath architecture. This Power Architecture SoC integrates DDR2/DDR3 memory controllers, PCIe, Gigabit Ethernet, Serial RapidIO (SRIO), and an integrated security engine (SEC) targeting wired and wireless infrastructure equipment. A PowerQUICC III SoC is a multi-core communications processor designed by NXP (formerly Freescale) that integrates CPU cores, memory controllers, high-speed serial interfaces, and security accelerators on a single die. It sits within the broader hierarchy of communications processors -> embedded processors -> microprocessors -> integrated circuits, and is engineered to handle data-plane and control-plane workloads in routers, switches, and base stations. Key features include dual e500 cores at 1.333 GHz, integrated DDR2/DDR3 memory controller with ECC, multiple Gigabit Ethernet MACs, multiple PCIe lanes, Serial RapidIO ports, and a hardware security engine. The device supports industrial extended temperature range and is qualified for embedded networking applications requiring deterministic performance. The MPC8572E leverages a system-on-chip architecture that combines processing, memory subsystem, and I/O in one package, reducing BOM and PCB area versus discrete designs. The on-chip SEC engine offloads cryptography, while the dedicated SRIO and PCIe interfaces provide non-blocking interconnect for backplanes and accelerators. Typical applications include multiservice routers, wireless base stations, LTE eNodeB, industrial gateways, and secure networking appliances. The combination of dual cores and high-bandwidth I/O enables line-rate processing at the network edge. When designing with this part, ensure the FCBGA substrate supports the 1.1 V core and 1.5/1.8 V DDR rails with proper decoupling, and that the board-level thermal design accounts for the 33x33 mm FCBGA thermal envelope at full CPU load. This page synthesizes distributor pricing, drop-in alternative options, and practical design notes not found in the manufacturer datasheet alone, enabling sourcing and second-source decisions for communications OEMs.

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MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP
MPC8572ECVTAVNE

MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP

The NXP (formerly Freescale) MPC8572ECVTAVNE is a dual-core PowerPC e500 microprocessor from the MPC85xx PowerQUICC III family, operating at up to 1.5 GHz with a 32-bit RISC core architecture fabricated in a 0.09 um CMOS process. Housed in a 1023-ball FCBGA (33x33 mm) package, it integrates two e500 cores, high-bandwidth memory interfaces, multiple Gigabit Ethernet controllers, PCI Express, RapidIO, and security acceleration, targeting networking and telecom infrastructure. Core voltage is 1.1 V with I/O rails at 1.8 V/2.5 V/3.3 V. What is a PowerQUICC III communications processor? A PowerQUICC III is a high-integration system-on-chip (SoC) that combines one or more PowerPC processor cores with specialized communications peripherals (Ethernet MACs, PCI Express, security engines). It sits in the broader taxonomy of embedded microprocessors -> MPU -> application processor -> SoC -> networking SoC, and is widely deployed in routers, switches, base stations, and storage platforms where deterministic packet processing is required. Key features of the MPC8572E include dual e500 cores with MMU and double-precision FPU support, integrated DDR2/DDR3 memory controller with ECC, four 10/100/1000 Mbit Ethernet MACs, two PCI Express interfaces, dual Serial RapidIO endpoints, and an integrated security engine (SEC 4.0) for IPSec, SSL/TLS, and Kasumi/Snow 3G cipher acceleration. The device also exposes a Local Bus Controller, four I2C, four UART, and GPIO for legacy peripheral integration. Architecturally the device pairs a hierarchical bus structure with the CoreNet platform coherency fabric, allowing the two cores and I/O engines to share memory and peripherals coherently while maintaining deterministic traffic shaping. The 1023-ball FCBGA delivers the high pin density required for the parallel memory and multiplexed I/O buses, and demands a multilayer PCB with controlled-impedance routing and a thermal solution rated for the device's typical power envelope. Typical applications include enterprise routers, multi-service switches, LTE base-station baseband cards, IP-PBX platforms, network-attached storage controllers, and industrial gateways. The integrated security engine makes it well suited for VPN concentrators and SSL offload appliances, while the dual-core architecture supports control-plane plus data-plane partitioning. A primary design consideration is thermal management: at 1.5 GHz with both cores active the device dissipates significant power, requiring thermal vias under the package and a heatsink in most production designs. Power sequencing of the 1.1 V core rail and the 1.8/2.5/3.3 V I/O rails must follow the datasheet order to avoid latch-up. This page synthesizes distributor pricing, drop-in MPC8572 family alternatives, and practical board-design considerations not assembled in the NXP datasheet alone.

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MPC8572ELPXAVND - PowerPC e500 MPU 1.5GHz Dual-Core | NXP
MPC8572ELPXAVND

MPC8572ELPXAVND - PowerPC e500 MPU 1.5GHz Dual-Core | NXP

The NXP (formerly Freescale) MPC8572ELPXAVND is a PowerPC e500-based dual-core microprocessor from the PowerQUICC III family, operating at up to 1.5 GHz core frequency and housed in a 1023-ball FCBGA (33x33 mm) package. Built on a 32-bit RISC architecture with two e500 cores, it integrates 32 KB of instruction cache and 32 KB of data cache per core, a 1 MB L2 cache, and dual DDR2/DDR3 memory controllers, alongside the high-bandwidth Enhanced Local Bus and PCI Express interfaces required for networking line cards. A microprocessor (MPU) is an integrated circuit that contains one or more processor cores, on-chip caches, memory controllers, and a portfolio of I/O peripherals capable of running a full operating system such as Linux or VxWorks. The MPC8572E belongs to the PowerQUICC III hierarchy (MPU -> communications processor -> networking SoC), a lineage designed by Freescale and now NXP for routing, switching, and wireless base-station infrastructure where deterministic packet processing, deep protocol offload, and multi-gigabit I/O are mandatory. Key features of the MPC8572ELPXAVND include the 1.5 GHz dual e500 cores with SMP support, hardware cryptography acceleration, four Gigabit Ethernet MACs plus a 10-Gigabit XAUI interface, integrated DDR2/DDR3 SDRAM controller with ECC, eight SerDes lanes supporting PCI Express and SGMII, and an Enhanced Local Bus Controller (eLBC) for NAND/NOR flash and legacy peripherals. The integrated SEC 4.0 engine accelerates AES, 3DES, SHA, RSA, and elliptic-curve algorithms at line rate. Architecturally, the device combines two independent e500 cores with a coherent shared L2 and a high-bandwidth system bus, allowing full symmetric multiprocessing under Linux. The on-chip RapidIO interconnect, multiple DMA channels, and dedicated queue managers make it well-suited to data-plane accelerators, QoS scheduling, and protocol termination tasks that historically overwhelmed software-only implementations. Typical applications include enterprise and carrier-grade routers, multi-service switches, wireless base-station controllers, network-attached storage (NAS) controllers, and industrial control planes that require multiple Ethernet interfaces plus deterministic real-time behavior. The combination of x86-class I/O bandwidth and PowerPC predictability keeps it relevant in long-lifecycle telecom platforms. When designing with the MPC8572ELPXAVND, allocate a multi-layer PCB with a minimum 6-layer stack-up and follow the NXP hardware specifications document for ball-map escape, core-voltage decoupling, and DDR2/DDR3 fly-by routing; thermal management at 1.5 GHz requires the FCBGA heat-spreader lid to be coupled to a heatsink. This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives from the PowerQUICC III and QorIQ families, and practical board-design notes beyond the manufacturer hardware specifications document.

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MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP
MPC8572ELVTAVND

MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP

The NXP MPC8572ELVTAVND is a PowerPC e500 microprocessor from the PowerQUICC III MPC85xx family, integrating two 32-bit e500 cores at up to 1.5 GHz in a 1023-ball FCBGA (33x33) package. The device is fabricated in a 90 nm CMOS process and operates from 1.8 V, 2.5 V, and 3.3 V supply rails. It combines dual high-performance e500 cores with extensive on-chip peripherals including dual GbE controllers, dual DDR2 memory controllers, integrated security engine, and PCI Express and Serial RapidIO interfaces. A microprocessor (MPU) is an integrated processor that contains the central processing unit, memory management, and peripheral interfaces on a single die. Within the semiconductor taxonomy, an MPU is a sub-class of digital IC, and the PowerQUICC III family specifically targets embedded communications infrastructure where deterministic packet processing and high-speed I/O integration reduce system BOM. The MPC8572E extends this lineage with hardware cryptography and an enhanced double-precision floating-point unit, positioning it for secure networking workloads. Key features of the MPC8572ELVTAVND include dual e500 cores with double-precision FPU, integrated DDR2 memory controllers with ECC, four GbE MACs (SGMII/RGMII), PCI Express x8, Serial RapidIO, two triple-speed Ethernets, hardware-accelerated security (AES, DES, Kasumi), and 32 KB I-cache and 32 KB D-cache per core. The 1023-FCBGA (33x33 mm) package exposes 1023 solder balls and is rated for industrial junction temperatures. The architectural innovation lies in its hierarchical bus fabric (CoreNet platform) that allows coherent cores to share L2 cache (1 MB) and high-bandwidth I/O without contention. The hardware security engine offloads cryptographic workloads at line rate, enabling VPN, IPsec, and SSL inspection without CPU utilization penalty. Typical applications include multi-service routers, LTE/UMTS base stations, secure gateways, network attached storage controllers, industrial control planes, and defense/aerospace packet processors. The MPC8572E is widely used where MIPS-class deterministic performance, real-time I/O, and embedded security must coexist on one die. When designing with this device, allocate a four-layer PCB minimum with continuous reference planes for the high-speed DDR2 interface. Thermal design is critical since the 33x33 mm BGA can dissipate 10-20 W under full dual-core load. Boundary scan via IEEE 1149.1 JTAG is mandatory for production test. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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MPC8572EPXATLD - PowerPC e500 Dual-Core 1.2GHz MPU | NXP
MPC8572EPXATLD

MPC8572EPXATLD - PowerPC e500 Dual-Core 1.2GHz MPU | NXP

The NXP MPC8572EPXATLD is a PowerPC e500 dual-core integrated communications processor from the PowerQUICC III family, featuring two 32-bit e500 cores running at up to 1.2 GHz, housed in a 1023-ball FCBGA (33x33 mm) package. The device integrates two enhanced triple-speed Ethernet controllers (eTSEC), a DDR2/DDR3 SDRAM memory controller, a DUART, and multiple peripheral interfaces optimized for symmetric and asymmetric multiprocessor designs. An integrated communications processor (CP) is a system-on-chip (SoC) that combines a high-performance CPU subsystem with networking, memory, and peripheral controllers on a single die. Within the broader taxonomy, the MPC8572E is a member of the multiprocessor IC class, sitting under the hierarchy microprocessor -> MPU -> embedded processor -> integrated communications processor -> PowerQUICC III. These parts evolved from the original PowerQUICC architecture and target telecom, networking, and storage applications where packet processing, deterministic latency, and rich I/O are required. Key features of the MPC8572EPXATLD include dual e500 cores with 36-bit physical addressing, hardware MMU and FPU support, an integrated security engine (SEC), four DMA channels, and a 64-bit DDR2/DDR3 memory controller with ECC. The 1023-ball FCBGA package dissipates thermal load via a top-side heat-spreader footprint, supporting industrial and extended-temperature operating points. Architecturally, the MPC8572E pairs two PowerPC e500 cores with a high-bandwidth internal CoreNet fabric, allowing coherent SMP operation. The hardware-managed L2 cache, RapidIO messaging unit, and packet-processing accelerators reduce host CPU load in routing and switching line cards. The integrated SEC engine handles DES, 3DES, AES, and public-key acceleration, removing the need for an external crypto coprocessor in many designs. Typical applications for the MPC8572EPXATLD include router/switch line cards, wireless base-station controllers, edge routers, and storage area network (SAN) controllers. It is also deployed in defense and aerospace command/control platforms where PowerQUICC III's deterministic interrupt response is valued. When designing with this device, allocate adequate PCB layers (typically 8+), enforce length-matched DDR2/DDR3 routing, and follow NXP's Hardware Specifications document for power-rail sequencing and decoupling. Designers transitioning from single-core PowerQUICC III parts should review the dual-core coherency model carefully. This page synthesizes distributor pricing, application context, and drop-in alternatives for the MPC8572EPXATLD not consolidated in the manufacturer datasheet, helping engineers evaluate sourcing and design trade-offs in one place.

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MPC8572EPXAULE - PowerQUICC III Dual-Core SoC, 1.33 GHz, FCPBGA-1023 | NXP
MPC8572EPXAULE

MPC8572EPXAULE - PowerQUICC III Dual-Core SoC, 1.33 GHz, FCPBGA-1023 | NXP

The NXP MPC8572EPXAULE is a PowerQUICC III family dual-core communications SoC integrating two PowerPC e500 cores running up to 1.333 GHz, 1 MB of shared L2 cache, DDR2/DDR3 memory controller, PCI Express, Gigabit Ethernet, Serial RapidIO, and a security engine in a 1023-ball FCBGA (FCPBGA-1023, 33x33 mm) package. It is designed to deliver high-throughput symmetric and asymmetric multi-core processing for wired and embedded networking equipment. A communications SoC (System-on-Chip) is a highly integrated processor that combines general-purpose CPU cores, memory controllers, and specialized I/O peripherals on a single die, eliminating the need for a companion northbridge or I/O hub. The PowerQUICC III family sits within NXP's broader communications processor taxonomy: SoC -> multicore MPU -> PowerQUICC family -> PowerPC architecture -> RISC processor, and it is widely deployed in routers, switches, and line-card aggregation designs where deterministic I/O and deep protocol offload are required. Key features include dual e500 cores with 36-bit physical addressing, integrated DDR2/DDR3 SDRAM controller with ECC, four Gigabit Ethernet MACs, two PCI Express interfaces, two Serial RapidIO endpoints, and a hardware-accelerated security engine (SEC) for IPSec, SSL/TLS, and bulk encryption. The device targets a 0 to +105 °C operating range, addressing thermally constrained telco and industrial environments. Architecturally, the MPC8572EPXAULE uses a coherent shared-bus topology with a global queue manager, allowing deterministic task distribution between the two cores. CoreNet coherency fabric integrates the memory controller and switch fabric, simplifying board design while sustaining multi-Gbps aggregate throughput across Ethernet and RapidIO lanes. Typical applications include multi-service routers, edge and aggregation switches, wireless baseband controllers, network-attached storage controllers, and industrial control platforms requiring secure, deterministic multi-core performance. The integrated SEC engine also suits VPN gateways and encrypted SAN front-ends. When designing with this part, allocate adequate power and thermal headroom: at 1.333 GHz the part can dissipate tens of watts, requiring multiple PCB layers, a heatsink, and airflow. Ensure the boot ROM and CPLD/FPGA glue logic correctly drive the Local Bus, JTAG, and reset configuration pins according to the reference manual. This page synthesizes distributor pricing, package-level drop-in analysis, and practical design notes drawn from NXP reference designs - context not duplicated on the manufacturer datasheet or typical distributor listings.

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MPC8572EPXAVND - PowerPC e500 1.5GHz Dual-Core MPU | NXP
MPC8572EPXAVND

MPC8572EPXAVND - PowerPC e500 1.5GHz Dual-Core MPU | NXP

The NXP MPC8572EPXAVND is a PowerQUICC III integrated communications processor featuring a dual-core PowerPC e500 microprocessor running at up to 1.5 GHz, packaged in a 1023-ball FCBGA (33x33 mm). It targets wired and embedded networking applications where deterministic packet processing, integrated security, and multi-gigabit I/O are required. A microprocessor (MPU) is a single-chip CPU central processing unit integrating control unit, ALU, registers, and often caches and peripherals on one die. The PowerQUICC III family sits in NXP's communications-processor hierarchy: PowerPC e500 core -> MPC85xx architecture -> PowerQUICC family -> communications processors -> embedded MPUs. The e500 core is a 32-bit Book-E implementation tuned for low-latency deterministic control and networking workloads rather than general-purpose compute. Key features include dual 32-bit PowerPC e500 cores, integrated SPE (Signal Processing Engine) and SEC (Security Engine) co-processors, three Enhanced Three-Speed Ethernet (eTSEC) controllers supporting 10/100/1000 Mbps, a DDR2/DDR3 SDRAM memory controller, four PCI Express interfaces, two serial RapidIO interfaces, a DUART, and flexible I/O multiplexing. The 1023-FCBGA package exposes the full pin complement required for these high-bandwidth peripherals. The architecture uses a coherent SMP fabric between the two e500 cores, allowing symmetric multi-processing for control-plane tasks. The SEC engine accelerates DES, 3DES, AES, SHA-1/2, and Kasumi, while the SPE offloads DSP-style operations on packet payloads. The DDR2/DDR3 controller with ECC supports registered DIMMs at speeds up to 800 MHz data rate, giving the platform enough memory bandwidth for stateful firewall and routing tables. Typical applications include enterprise routers, multi-service switches, line cards, IP-PBX systems, and secure VPN gateways. The dual cores plus security accelerators make it well suited to combined control-plane + data-plane + encryption workloads on a single SoC. When designing in the MPC8572EPXAVND, allocate adequate PCB layers (typically 8+ with dedicated power planes) for the 1.5 GHz core and DDR memory. Place decoupling capacitors within 5 mm of every power pin and route the DDR differential clocks with controlled impedance. Verify thermal design against the worst-case industrial junction temperature. This page consolidates distributor pricing, same-family drop-in variants, and engineering design notes beyond the manufacturer marketing summary to accelerate your evaluation.

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MPC8572EVTARLD - PowerQUICC III MPU, 1.067 GHz, 1023-FCBGA | NXP
MPC8572EVTARLD

MPC8572EVTARLD - PowerQUICC III MPU, 1.067 GHz, 1023-FCBGA | NXP

The NXP MPC8572EVTARLD is a dual-core PowerPC e500 microprocessor from the PowerQUICC III family, clocked at 1.067 GHz and housed in a 1023-ball FCBGA (33x33 mm) package. It integrates two 32-bit e500 cores with 32 KB L1 instruction cache and 32 KB L1 data cache per core, plus a 1 MB shared L2 cache, making it suitable for high-throughput communications processing. An MPU (Microprocessor Unit) is a system-on-chip processor that integrates one or more CPU cores with memory controllers, I/O peripherals, and on-chip accelerators. The MPC8572E is a communications MPU, a hypernym for processors that combine general-purpose compute with hardware offload for networking workloads such as TDM, Ethernet, HDLC, and ATM. It sits within the broader taxonomy: PowerPC e500 core -> PowerQUICC III family -> communications MPU -> microprocessor -> semiconductor device. It uses a Power Architecture instruction set and is built on a 90 nm CMOS process. Key features include dual e500 cores at 1.067 GHz, DDR2 memory controller with ECC, three 10/100/1000 Ethernet MACs supporting SGMII and RGMII, four TDM interfaces, two PCI Express interfaces, and a Serial RapidIO interface. The 1023-FCBGA package exposes all peripherals while keeping board footprint manageable for line cards, base stations, and enterprise routers. This IC belongs to NXP's PowerQUICC III family targeting wired and wireless infrastructure. The architecture pairs general-purpose processing with packet and signalling accelerators, allowing simultaneous handling of control-plane and data-plane traffic on a single device. The dual-core topology plus coherent L2 supports symmetric multiprocessing for routing and bridging applications. The 0.09 µm process and 1.067 GHz clock enable deterministic throughput for QoS-sensitive traffic. Typical applications include multiservice routers, DSLAM line cards, wireless base station controllers, industrial control planes, and enterprise switching platforms. The combination of DDR2/PCIe/RapidIO and TDM/Ethernet MACs makes the device a versatile platform for legacy and next-generation communications equipment. Designers should validate thermal dissipation at full load because the 1023-FCBGA drives significant heat through the top-side heat spreader; package thermal resistance data should be reviewed against the end system cooling budget before board layout finalization. This page synthesizes authoritative NXP datasheet extracts, distributor pricing snapshots, and drop-in same-family NXP alternatives to give engineers a faster path to sourcing and second-source qualification than the manufacturer datasheet alone.

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MPC8572EVTAULB - PowerPC e500 MPU, 1.333GHz, 1023-FCBGA | NXP
MPC8572EVTAULB

MPC8572EVTAULB - PowerPC e500 MPU, 1.333GHz, 1023-FCBGA | NXP

The NXP Semiconductors (formerly Freescale Semiconductor) MPC8572EVTAULB is a high-performance PowerPC e500-based microprocessor from the MPC8572E device family, integrating 2 cores running at up to 1.333GHz with 32-bit datapath and housed in a 1023-ball FCBGA (33x33 mm) package. Built on a 45nm CMOS process, the device implements dual e500 cores supporting virtualization, hardware memory management, and out-of-order execution for compute-intensive workloads in networking, storage, industrial control, and defense platforms. A microprocessor (MPU) is an integrated circuit that contains one or more central processing units, caches, memory controllers and peripheral I/O in a single silicon die; in embedded systems the MPU is the system master, executing OS kernels, network stacks and protocol processing workloads. The MPC85xx family targets communications infrastructure equipment, where deterministic throughput, packet-processing offload engines, and long product lifecycles are central requirements. Key features include dual PowerPC e500 cores with per-core L1 caches, a shared L2 cache, integrated DDR2/DDR3 memory controller, multiple Gigabit Ethernet controllers, PCI Express interfaces, Serial RapidIO, and an enhanced local bus for glueless ASIC/FPGA interconnect. The part is suited to LTE/4G baseband processing, router/switch control planes, industrial routers, and ruggedized military systems. Designed as a system-on-chip solution, the MPC8572E integrates Power Architecture compute, advanced interrupt handling via MPIC, and a security engine for cryptographic acceleration. Compared to discrete CPU + bridge designs, the SoC approach reduces board complexity and BOM for telecom OEMs. Typical applications include network routers, Layer 2-4 managed switches, base station controllers, networked industrial automation gateways, and long-lifecycle defense/aerospace compute modules. Production deployments often pair the SoC with DDR3 ECC memory and external PHYs. When designing with this device, ensure the FCBGA substrate utilizes a high-Tg PCB with matched-length DDR3 routing; ball attach and rework require profiles compatible with large-array packages. Thermal management should target the maximum junction temperature under worst-case traffic load. This page synthesizes distributor pricing, drop-in alternatives, application block diagrams, and design notes not consolidated in the manufacturer datasheet, accelerating part selection, schematic bring-up, and procurement decisions for power-engineers working on Power Architecture platforms.

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