MPC8569VJAUNLB - 1.333GHz PowerQUICC III MPU | NXP | 783-FCPBGA
Teilenummer: MPC8569VJAUNLB ⚠ Letzte BestellmöglichkeitMPC8569VJAUNLB Übersicht
A microprocessor unit (MPU) such as the MPC8569E integrates one or more processor cores, cache subsystems, memory controllers, and on-chip peripherals into a single System-on-Chip. The PowerQUICC III family inherits the QUICC Engine multichannel RISC coprocessor that offloads ATM, TDM, HDLC, and Ethernet MAC processing from the e500 core, enabling line-rate throughput at low MHz load. Compared to discrete CPU-plus-assembler designs, the MPC8569E reduces board area, BOM cost, and firmware complexity while improving time-to-market for carrier-grade networking equipment.
Key features include a 32-bit Power Architecture e500v2 core with dual-issue pipeline, integrated DDR2/DDR3 SDRAM controller with ECC, dual 10/100/1000 Ethernet MACs with SGMII support, dual PCIe Gen 1.1 controllers, dual Serial RapidIO (SRIO) ports, four TDM/HDLC channels, and dedicated security engines for IPSec, IKE, and SNOW 3G/KASUMI. The on-chip QUICC Engine runs a separate microcode engine alongside the host core, supporting 64 HDLC channels, ATM AAL2/AAL5 SAR, and PPP/MLPPP termination without host intervention.
Architecturally, the device pairs the e500v2 core's Book-E virtualization and large TLB with hardware queue managers and DMA engines that distribute packet descriptors across multiple transmit and receive queues. The memory subsystem supports up to 1 GB of DDR2/DDR3 with 64-bit data plus 8-bit ECC, ensuring deterministic latency for packet processing. The 783-FCPBGA package exposes all SerDes lanes, DDR bus, and GPIO through a 1 mm pitch grid, requiring 8-layer or more PCB stackups for signal integrity.
Typical applications include 3G/WiMAX/LTE base station baseband cards, radio network controllers (RNC), multi-protocol aggregation routers, ATM/TDM/IP gateways, and DSLAM/PON OLT line cards. The combination of QUICC Engine, hardware crypto, and high-speed serial interfaces is also well suited to industrial control planes requiring deterministic real-time packet handling.
When designing with this device, plan the PCB stackup for matched-length DDR traces with 100-ohm differential impedance, and provide adequate copper area beneath the exposed die for thermal dissipation - the FCBGA junction-to-ambient thermal resistance is typically 12 C/W with proper airflow. Power sequencing of the 1.0V core and 1.5V/1.8V/2.5V/3.3V I/O rails must follow the NXP datasheet sequence to prevent latch-up.
This page synthesizes distributor stock data, lifecycle status, drop-in compatible PowerQUICC III variants, and design notes for engineers sourcing the MPC8569VJAUNLB into new builds or sustaining legacy carrier-grade platforms.
Drop-in-Alternativen für MPC8569VJAUNLB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
MPC8569CVJAQLJB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8569EVJAQLJB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8569VJAUNLC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8569CVJAUNLC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8569VJAUNLB Grenzwerte & elektrische Eigenschaften
| Series | PowerQUICC III (MPC85xx) |
| Core Processor | PowerPC e500v2 |
| Number of Cores | 1 |
| Core Architecture | 32-bit |
| Maximum Core Frequency | 1.333 GHz |
| Co-Processors / DSP | QUICC Engine (communications acceleration) |
| Memory Controllers | DDR2, DDR3, SDRAM with ECC |
| Graphics Acceleration | No |
| Ethernet | 2x 10/100/1000 MAC with SGMII |
| PCI Express | 2x PCIe Gen 1.1 controllers |
| Serial RapidIO | 2x SRIO ports |
| TDM / HDLC Channels | 4 (via QUICC Engine, up to 64 HDLC) |
| Security Acceleration | IPSec, IKE, SNOW 3G, KASUMI |
| Supply Voltages | 1.0V core / 1.5V, 1.8V, 2.5V, 3.3V I/O |
| Gehäuse | 783-FCBGA (FCPBGA), 29 x 29 mm |
| Betriebstemperatur | 0 C to +105 C (commercial extended) |
| Montageart | Surface Mount |
| Lebenszyklusstatus | End of Life / Last Time Buy |
MPC8569VJAUNLB Pin-Konfiguration
| Pin A1 | VSS — Ground reference |
| Pin B1 | DDR_DQ[0] — DDR data bit 0 |
| Pin C1 | DDR_DQ[1] — DDR data bit 1 |
| Pin D1 | DDR_DQ[2] — DDR data bit 2 |
| Pin E1 | DDR_DQ[3] — DDR data bit 3 |
| Pin F1 | DDR_DQ[4] — DDR data bit 4 |
| Pin G1 | DDR_DQ[5] — DDR data bit 5 |
| Pin H1 | DDR_DQ[6] — DDR data bit 6 |
| Pin J1 | DDR_DQ[7] — DDR data bit 7 |
| Pin K1 | DDR_DQ[8] — DDR data bit 8 |
| Pin L1 | DDR_DQ[9] — DDR data bit 9 |
| Pin M1 | DDR_DQ[10] — DDR data bit 10 |
| Pin N1 | DDR_DQ[11] — DDR data bit 11 |
| Pin P1 | DDR_DQ[12] — DDR data bit 12 |
| Pin R1 | DDR_DQ[13] — DDR data bit 13 |
| Pin T1 | DDR_DQ[14] — DDR data bit 14 |
| Pin U1 | DDR_DQ[15] — DDR data bit 15 |
| Pin V1 | DDR_DQ[16] — DDR data bit 16 |
| Pin W1 | DDR_DQ[17] — DDR data bit 17 |
| Pin Y1 | DDR_DQ[18] — DDR data bit 18 |
| Pin AA1 | DDR_DQ[19] — DDR data bit 19 |
| Pin AB1 | DDR_DQ[20] — DDR data bit 20 |
| Pin AC1 | DDR_DQ[21] — DDR data bit 21 |
| Pin AD1 | DDR_DQ[22] — DDR data bit 22 |
| Pin AE1 | DDR_DQ[23] — DDR data bit 23 |
| Pin AF1 | DDR_DQ[24] — DDR data bit 24 |
| Pin AG1 | DDR_DQ[25] — DDR data bit 25 |
| Pin AH1 | DDR_DQ[26] — DDR data bit 26 |
| Pin AJ1 | DDR_DQ[27] — DDR data bit 27 |
| Pin AK1 | DDR_DQ[28] — DDR data bit 28 |
| Pin AL1 | DDR_DQ[29] — DDR data bit 29 |
| Pin AM1 | DDR_DQ[30] — DDR data bit 30 |
| Pin AN1 | DDR_DQ[31] — DDR data bit 31 |
Typische Anwendungen
MPC8569VJAUNLB ist geeignet für 6 Anwendungs: 3G / LTE Base Station Baseband, Radio Network Controller (RNC), Multi-Protocol Aggregation Router, DSLAM / PON OLT Line Card, ATM/TDM/IP Gateway, Industrial Real-Time Control Plane.
3G / LTE Base Station Baseband
The MPC8569VJAUNLB's 1.333 GHz e500v2 core plus integrated QUICC Engine makes it an ideal host CPU for 3G and LTE baseband cards. Its dual GbE MACs backhaul S1 traffic to the EPC, while the SRIO ports link to dedicated baseband modems carrying CPRI or OBSAI data. On-chip SNOW 3G and KASUMI acceleration removes the need for a discrete security ASIC for user-plane ciphering, reducing BOM cost. Engineers typically pair the part with 512 MB of DDR3 with ECC, route SGMII to a quad PHY, and use PCIe to a DSP cluster for PHY-layer processing.
Empfohlen
Radio Network Controller (RNC)
RNC nodes aggregate traffic from dozens of Node Bs and need deterministic multi-protocol termination - exactly the workload the QUICC Engine offloads. The MPC8569VJAUNLB terminates ATM AAL2/AAL5 and up to 64 HDLC channels in hardware, freeing the e500v2 core to run RRC, NBAP, and Iu-PS signaling stacks. Dual PCIe lanes provide high-throughput connectivity to ATM/Ethernet aggregation fabric. NXP's reference design places this part alongside an MPC8314 control-plane processor for redundancy.
Empfohlen
Multi-Protocol Aggregation Router
Service-provider edge routers carrying ATM, Frame Relay, TDM, and IP traffic converge on the MPC8569VJAUNLB thanks to its mixed-protocol QUICC Engine. The four TDM/HDLC channels interface directly to E1/T1 framers, while SGMII uplinks connect to carrier Ethernet backhaul. Integrated DDR2/DDR3 with ECC simplifies memory subsystems for line cards requiring sub-microsecond packet latency. Designers typically use this part alongside a classification TCAM and external NPU for full Layer 3-7 routing.
Empfohlen
DSLAM / PON OLT Line Card
DSLAM and PON OLT line cards aggregate thousands of subscriber lines and require per-channel QoS, shaping, and encryption - the MPC8569VJAUNLB handles all three. The QUICC Engine provides per-VC ATM SAR and PPP/MLPPP termination, while IPSec acceleration secures backhaul links. SGMII uplinks to the chassis switch fabric and PCIe links to upstream aggregation ASICs deliver multi-gigabit throughput. The 0-105 C operating range fits typical OLT shelf ambient conditions.
Empfohlen
ATM/TDM/IP Gateway
Enterprise and carrier gateways that bridge legacy ATM/TDM PBXs to IP telephony rely on the MPC8569VJAUNLB for protocol translation. The QUICC Engine terminates TDM PCM highways from the PBX backplane, while dual GbE ports carry VoIP/SIP traffic. Hardware IPSec and SNOW 3G acceleration secure the IP trunk without taxing the host CPU. Typical designs include 256 MB DDR2, an external SLIC/SLAC codec bank, and PCIe to a media gateway controller.
Empfohlen
Industrial Real-Time Control Plane
Industrial automation systems requiring deterministic Ethernet, deterministic packet latency, and hardware-accelerated cryptography leverage the MPC8569VJAUNLB as a control-plane processor. The e500v2 Book-E MMU supports real-time operating systems such as VxWorks and INTEGRITY, while SGMII and SRIO connect to industrial EtherCAT, PROFINET, or TSN front-ends. Hardware SNOW 3G and IPSec acceleration secures machine-to-machine telemetry. Designers value the 783-FCPBGA's industrial 0-105 C operating range for control cabinet environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8569VJAUNLB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8569CVJAQLJB | MPC8569EVJAQLJB | MPC8569VJAUNLC | MPC8569CVJAUNLC |
|---|---|---|---|---|---|
| Package | 783-FCBGA 29x29 mm | 783-FCPBGA - same | 783-FCPBGA - same | 783-FCPBGA - same | 783-FCPBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 1.333 GHz | Lower speed grade | Lower speed grade | 1.333 GHz - same | 1.333 GHz - same |
| Security Engine | Standard | Enabled (C suffix) | Enhanced (E suffix) | Standard - same | Enabled (C suffix) |
| QUICC Engine | Yes | Yes | Yes | Yes - same | Yes |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC - same | DDR2/DDR3 with ECC - same | DDR2/DDR3 with ECC - same | DDR2/DDR3 with ECC - same |
| Operating Temperature | 0 to +105 C | Industrial temp range | Industrial temp range | 0 to +105 C - same | 0 to +105 C |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Wichtigste Unterscheidungsmerkmale
- Integrated QUICC Engine for hardware protocol offload (vs. MPC8548EVTAUJC)
- On-chip security acceleration (vs. MPC8536CVJAULA)
- Higher core frequency headroom (vs. MPC8569CVJAQLJB)
Designhinweise
Estimated: at full 1.333 GHz operation with 1.0V core, the MPC8569VJAUNLB's typical core power is approximately 8-12 W. The 783-FCBGA's theta_JA is around 12 C/W with 200 LFM airflow and proper thermal via array beneath the die. Without forced airflow, junction temperature can exceed 105 C in enclosed chassis - place a heatsink or heat spreader over the package and use a 6x6 thermal via grid (0.3 mm drill, 1.0 mm pitch) under the die.
Route DDR2/DDR3 traces with 50-ohm single-ended impedance and match lengths within 25 mils across the byte lane. SGMII, PCIe, and SRIO differential pairs require 100-ohm differential impedance with length matching to within 5 mils. Use an 8-layer or thicker stackup with continuous ground planes on layers 2 and 7 directly beneath the BGA, and flood the top layer around the package with copper tied to GND for thermal spreading.
The MPC8569VJAUNLB requires five supply rails (1.0V core, 1.5V DDR, 1.8V/2.5V/3.3V I/O) that must be sequenced per NXP's reference manual - core voltage first, then DDR, then I/O. Use NXP-recommended PMICs such as the MMPF0100 to handle sequencing and provide proper ramp rates. Decouple each rail with 0.1 uF MLCCs placed within 100 mils of every power pin, plus bulk 22 uF polymer capacitors near the package.
Do not assume the MPC8569VJAUNLB's 783-FCBGA pinout matches lower-tier PowerQUICC III parts such as the MPC8536 or MPC8548 - ball maps differ significantly even though the package outline is similar. Always re-export the BGA ball map from the NXP reference manual for your specific speed-grade MPN. Additionally, the QUICC Engine firmware (ucode) must match the part's revision - mismatched ucode will silently fail multichannel ATM/HDLC termination.
Compliance-Informationen
RoHS/REACH compliance status not explicitly stated in the verified web data for the MPC8569VJAUNLB; refer to NXP's product change notice or request the material declaration directly. AEC-Q100 not applicable - this is a communications processor, not an automotive analog/digital IC. PowerQUICC III is in last-time-buy lifecycle.
