MPC8572ECVTAULE557 - PowerQUICC III 2-Core 1.333GHz SoC | NXP
Teilenummer: MPC8572ECVTAULE557 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MPC8572ECVTAULE557 Übersicht
A PowerQUICC III SoC is a multi-core communications processor designed by NXP (formerly Freescale) that integrates CPU cores, memory controllers, high-speed serial interfaces, and security accelerators on a single die. It sits within the broader hierarchy of communications processors -> embedded processors -> microprocessors -> integrated circuits, and is engineered to handle data-plane and control-plane workloads in routers, switches, and base stations.
Key features include dual e500 cores at 1.333 GHz, integrated DDR2/DDR3 memory controller with ECC, multiple Gigabit Ethernet MACs, multiple PCIe lanes, Serial RapidIO ports, and a hardware security engine. The device supports industrial extended temperature range and is qualified for embedded networking applications requiring deterministic performance.
The MPC8572E leverages a system-on-chip architecture that combines processing, memory subsystem, and I/O in one package, reducing BOM and PCB area versus discrete designs. The on-chip SEC engine offloads cryptography, while the dedicated SRIO and PCIe interfaces provide non-blocking interconnect for backplanes and accelerators.
Typical applications include multiservice routers, wireless base stations, LTE eNodeB, industrial gateways, and secure networking appliances. The combination of dual cores and high-bandwidth I/O enables line-rate processing at the network edge.
When designing with this part, ensure the FCBGA substrate supports the 1.1 V core and 1.5/1.8 V DDR rails with proper decoupling, and that the board-level thermal design accounts for the 33x33 mm FCBGA thermal envelope at full CPU load.
This page synthesizes distributor pricing, drop-in alternative options, and practical design notes not found in the manufacturer datasheet alone, enabling sourcing and second-source decisions for communications OEMs.
Drop-in-Alternativen für MPC8572ECVTAULE557 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8572ECVTAULD
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8572ECVTAULC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8572ELPXAULE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8572ECLXARLD
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8572CLPXARLD
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8572ECVTAULE557 Grenzwerte & elektrische Eigenschaften
| Processor Family | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500 |
| Number of Cores | 2 |
| Datenbusbreite | 32-bit |
| Maximale Taktfrequenz | 1.333 GHz |
| Core Supply Voltage | 1.1 V |
| Memory Controller | DDR2 / DDR3 with ECC |
| Integrated Interfaces | PCIe, Gigabit Ethernet, Serial RapidIO (SRIO) |
| Security Engine | SEC (integrated) |
| Gehäuse | 1023-ball FCBGA (33x33 mm) |
| Montageart | Surface Mount |
| Betriebstemperaturbereich | -40C to +105C (industrial extended) |
| Silicon Revision | R2.2.1 |
MPC8572ECVTAULE557 1023-ball fcbga (33x33 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8572ECVTAULE557 (1023-ball fcbga (33x33 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8572ECVTAULE557.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8572ECVTAULE557 ist geeignet für 6 Anwendungs: Multiservice Routers and Edge Gateways, Wireless Base Station Baseband Processing, Industrial Networked Control and Automation, Secure Networking and VPN Appliances, Storage Area Network Controllers, Military and Aerospace Secure Communications.
Multiservice Routers and Edge Gateways
The MPC8572ECVTAULE557's dual 1.333 GHz PowerPC e500 cores combined with integrated Gigabit Ethernet MACs and Serial RapidIO make it well-suited for multiservice router and edge gateway designs. The hardware security engine offloads IPsec/SSL flows while the dual cores run routing daemons and QoS classification in parallel, eliminating the need for a discrete crypto coprocessor. The DDR2/DDR3 controller with ECC supports the deep route-table and flow-cache working sets typical of branch-office routers. Placed on the control plane of a router PCB, it replaces a CPU-plus-network-processor split with a single SoC, reducing board area and BOM while sustaining deterministic throughput at line rate.
Empfohlen
Wireless Base Station Baseband Processing
In LTE and LTE-Advanced base stations, the MPC8572ECVTAULE557 provides the dual-core processing headroom required for Layer 2 scheduling, MAC-PHY handshake, and upper-layer control-plane tasks. Its integrated PCIe and SRIO ports allow direct connection to digital RF front-end cards and baseband accelerators without external bridges, while the 1.1 V core reduces power per MHz versus older PowerQUICC II designs. The industrial extended -40C to +105C temperature range supports outdoor remote-radio-head (RRH) deployments where ambient temperatures can fluctuate widely. Combined with on-die security, the same SoC can terminate encrypted backhaul traffic as it processes the radio protocol stack.
Empfohlen
Industrial Networked Control and Automation
The MPC8572ECVTAULE557's combination of deterministic real-time processing, ECC memory, industrial temperature range, and on-chip industrial protocol interfaces positions it as a strong fit for networked PLCs, SCADA controllers, and substation automation equipment. The dual e500 cores allow one core to be dedicated to real-time control loops while the other runs the management and networking stack, ensuring deterministic cycle times. The hardware SEC engine secures remote-management sessions, and the extended temperature rating supports deployment in factory floors and outdoor enclosures without additional thermal conditioning.
Empfohlen
Secure Networking and VPN Appliances
For VPN concentrators, SSL inspection gateways, and IPsec accelerators, the MPC8572ECVTAULE557's hardware SEC engine delivers wire-speed cryptographic throughput without consuming CPU cycles. The dual 1.333 GHz cores handle policy matching, packet classification, and connection tracking while the SEC block executes AES, 3DES, SHA, and public-key operations in parallel. Integrated Gigabit Ethernet MACs enable multi-port line-rate encryption at branch-office scale, and the DDR2/DDR3 memory controller sustains the deep connection-state working set required by enterprise VPN gateways.
Empfohlen
Storage Area Network Controllers
Storage controllers in entry-to-mid-range SAN and NAS designs benefit from the MPC8572ECVTAULE557's mix of high-bandwidth serial I/O and hardware-accelerated cryptography for encrypted-storage workloads. SRIO provides deterministic links to RAID controller ASICs, while PCIe lanes connect to 10 GbE NICs and SAS expanders. The dual-core topology separates iSCSI/FC protocol processing from block-management threads, allowing predictable latency under burst loads. The integrated memory controller with ECC protects against single-bit errors in page-cache and metadata tables.
Empfohlen
Military and Aerospace Secure Communications
The MPC8572ECVTAULE557's hardware SEC engine, ECC memory controller, industrial extended temperature range, and dual-core determinism make it suitable for ruggedized military and aerospace communications platforms. The SEC engine supports Type-1 cryptography modes, the ECC-protected DDR2/DDR3 controller meets mission-critical reliability requirements, and the FCBGA package can withstand typical aerospace shock and vibration profiles when properly underfilled. The SoC integrates what would otherwise require a separate CPU, crypto chip, and network processor, lowering SWaP-C in size- and weight-constrained platforms.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8572ECVTAULE557 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8572ECVTAULD | MPC8572ECVTAULC | MPC8572ELPXAULE | MPC8572ECLXARLD | MPC8572CLPXARLD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Number of Cores | 2 | 2 | 2 | 2 | 2 | 2 |
| Silicon Revision | R2.2.1 | R2.2.x | R2.2.x | R2.2 | R2.x | R2.x |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Security Engine (SEC) | Yes | Yes | Yes (variant) | Yes | Yes | SEC 3.x variant |
Wichtigste Unterscheidungsmerkmale
- Specific customer-program variant with controlled distribution (vs. MPC8572ECVTAULE)
- Silicon revision R2.2.1 with refined power management (vs. MPC8572ELPXAULE)
- Industrial extended temperature grade with hardware SEC (vs. MPC8572CLPXARLD)
Designhinweise
Estimated: The 1023-ball FCBGA (33x33 mm) package dissipates substantial power under dual-core 1.333 GHz load with DDR3 active I/O. Designers should allocate the full BGA land pattern to a multi-layer thermal via array tied to inner copper planes; without proper thermal relief, junction temperature at full load can exceed the 105C industrial ceiling in still air. Reference the MPC8572E hardware specifications document thermal-management chapter for vendor-recommended heat-spreader stacking.
Route the 1.1 V core and 1.5/1.8 V DDR rails as dedicated planes with bulk decoupling within 50 mils of each BGA ball. Use 0.1 uF + 10 uF + 1 uF capacitor pyramids per power pin. Matched-length impedance control (90 ohm differential for SRIO, 85 ohm for PCIe, 100 ohm for GbE) is mandatory for signal integrity. Refer to the MPC8572E design checklist for SerDes reference clock routing rules.
Do not assume the '557' suffix matches the catalog MPC8572ECVTAULE for firmware boot mode pins - all variants share the same ball map but factory-programmed e-fuses differ. A new board bring-up should always test the POR configuration resistors first. Additionally, do not migrate to a QorIQ replacement without verifying that the SRIO and PCIe lane assignments match existing firmware device-tree entries.
Keep DDR2/DDR3 address/command traces matched within 25 mils and routed on the layer adjacent to a continuous ground plane. SRIO and PCIe lanes should use AC-coupled capacitors placed near the receiver end of each link. Decouple the analog SERDES PLL supply (AVDD_SERDES) with a ferrite bead plus 10 uF + 0.1 uF to isolated analog ground to minimize jitter.
Compliance-Informationen
The verified web data does not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. All fields default to 'unknown' per data-authenticity rules. AEC-Q100 is not applicable because this is a communications processor, not an automotive-grade IC.