DSPIC33FJ256MC710A-H/PT
DSPIC33FJ256MC710A-H/PT - 16-bit DSC 256KB Flash 20 MIPS | Microchip
The Microchip Technology DSPIC33FJ256MC710A-H/PT is a 16-bit Digital Signal Controller (DSC) from the dsPIC33FJ256MC710A family, delivering 20 MIPS of DSP-enhanced performance with 256KB (256K x 8) of Flash program memory and 30KB of SRAM, housed in a 100-pin TQFP (12x12 mm) surface-mount package.
A Digital Signal Controller combines the peripheral set and programming model of a microcontroller (MCU) with the computational throughput of a Digital Signal Processor (DSP). In the power-management hierarchy, the dsPIC33F family sits between general-purpose MCUs such as the PIC24 and dedicated DSPs, offering single-cycle MAC, hardware division, and DSP engine features alongside familiar MCU peripherals like CAN, I2C, SPI, and UART.
Key features include 20 MIPS core throughput at 3.3V operation, 256KB of self-programmable Flash, and 30KB of on-chip SRAM. Connectivity spans CANbus, I2C, IrDA, LINbus, SPI, and UART/USART, and integrated system peripherals include brown-out detection. The device is qualified to AEC-Q100 for automotive applications, making it suitable for harsh-environment motor control nodes.
The dsPIC33FJ256MC710A is specifically optimized for motor control: the family explicitly supports brushless DC (BLDC) motors, single- and 3-phase induction motors, and switched reluctance motors. The DSP engine accelerates field-oriented control (FOC) loops, while CAN connectivity enables in-vehicle networking. Microchip documents seamless migration paths from dsPIC30F DSCs and PIC24 MCUs in similar packages, protecting software investment.
Typical applications include automotive BLDC and PMSM motor drives, industrial 3-phase inverter control, switched reluctance motor systems, digital power conversion (PFC, LLC), and unified communication-motor-control nodes where CAN, LIN, or UART links must coexist with real-time PWM control.
Design consideration: the H temperature-grade device operates over an extended automotive range in the 100-TQFP; verify your maximum junction temperature against the theta-JA of your PCB copper area, as high ambient motor-drive environments are the primary thermal constraint. Power the 3.3V core and I/O rails from a clean LDO or buck regulator with proper decoupling on all VDD/VDDCORE pins.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, with all specifications verified against live web data as of 2026-09-27.
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