10AS057K2F35I2LG vs 10AS057K2F35E2LG Vergleich
Detaillierter Direktvergleich von 10AS057K2F35I2LG von Intel und 10AS057K2F35E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AS057K2F35I2LG | 10AS057K2F35E2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.545,00 | $3.450,00 |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 | 570,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| Process Technology | 20 nm TSMC | — |
| Gehäuse | 1152-pin FC-FBGA (F35), 35 x 35 mm | 1152-ball FCBGA, 35 mm x 35 mm, 1.0 mm pitch |
| Package Code | F35 / 1152-BGA | — |
| Ball Pitch | 1.0 mm | — |
| Temperature Grade | Industrial (-40C to +100C ambient) | — |
| Speed Grade | -I2 | E2 (commercial/extended) |
| Supply Voltage (Core) | 0.9 V | — |
| Connectivity | SPI, UART/USART, EBI/EMI, USB, GbE, PCIe | — |
| Memory Interface | DDR3, DDR4, LPDDR3 (via HPS/FPGA controllers) | — |
| Montageart | Surface Mount (FC-FBGA) | — |
| RoHS-Status | Compliant | Compliant |
| Process Node | — | TSMC 20 nm |
| HPS Cores | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Frequency | — | 1.5 GHz |
| DSP Blocks | — | [DATA_NEEDED: 18x19 multiplier count] |
| Embedded Memory (M20K) | — | [DATA_NEEDED: M20K block count and total bits] |
| Transceivers | — | Up to 24 channels, up to 17.4 Gbps |
| PCIe Hard IP | — | Gen3 x4 (rootport/endpoint) |
| User I/Os | — | 396 |
| Betriebstemperatur | — | -40C to +100C (extended-industrial screening) |
| Configuration | — | SRAM-based, partial reconfiguration, SEU mitigation, ECC |
| Memory Interfaces | — | DDR3/DDR4 with hard PHY (HPS + FPGA) |
| Lead-Free | — | Yes |