10AX090N2F45I1SG vs 10AX090N2F45E2LG Vergleich
Detaillierter Direktvergleich von 10AX090N2F45I1SG von Intel und 10AX090N2F45E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX090N2F45I1SG | 10AX090N2F45E2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.450,00 | $6.095,25 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory | 59,234,304 bits | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| DSP Blocks | 3,456 | [DATA_NEEDED: DSP block count] |
| Maximum User I/Os | 768 | — |
| Transceivers | 24 channels, up to 17.4 Gbps | [DATA_NEEDED: transceiver count and data rate] |
| Transceiver Protocols | PCIe Gen3 x8, 10GbE, CPRI, JESD204B, SATA 3.0 | — |
| Hard Memory Controllers | DDR3/DDR4 with ECC | — |
| Process Technology | TSMC 20nm | 20 nm |
| Core Voltage | 0.9 V (nominal) | 0.9 V |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Gehäuse | 1932-ball FCBGA (F45) | 1932-ball FCBGA (FBGA) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | — |
| Configuration Scheme | JTAG, Active Serial, Passive Serial | — |
| Embedded Memory (bits) | — | 59,234,304 |
| User I/O Pins | — | 768 |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Package Type | — | Flip-Chip BGA, surface mount |
| Operating Temperature Grade | — | Enhanced (E2) |
| Lead-Free / RoHS | — | Yes (per part suffix LG) |
| Configuration Memory | — | SRAM-based, volatile (external flash required) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Lebenszyklusstatus | — | Active |