10AX090N2F45I1SG vs 10AX090N2F45E2LG Comparación
Comparación detallada lado a lado de 10AX090N2F45I1SG por Intel y 10AX090N2F45E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090N2F45I1SG | 10AX090N2F45E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6.450,00 | $6.095,25 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory | 59,234,304 bits | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| DSP Blocks | 3,456 | [DATA_NEEDED: DSP block count] |
| Maximum User I/Os | 768 | — |
| Transceivers | 24 channels, up to 17.4 Gbps | [DATA_NEEDED: transceiver count and data rate] |
| Transceiver Protocols | PCIe Gen3 x8, 10GbE, CPRI, JESD204B, SATA 3.0 | — |
| Hard Memory Controllers | DDR3/DDR4 with ECC | — |
| Process Technology | TSMC 20nm | 20 nm |
| Core Voltage | 0.9 V (nominal) | 0.9 V |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Encapsulado | 1932-ball FCBGA (F45) | 1932-ball FCBGA (FBGA) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | — |
| Configuration Scheme | JTAG, Active Serial, Passive Serial | — |
| Embedded Memory (bits) | — | 59,234,304 |
| User I/O Pins | — | 768 |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Package Type | — | Flip-Chip BGA, surface mount |
| Operating Temperature Grade | — | Enhanced (E2) |
| Lead-Free / RoHS | — | Yes (per part suffix LG) |
| Configuration Memory | — | SRAM-based, volatile (external flash required) |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Estado del ciclo de vida | — | Active |