10AX090N3F40E2LG vs 10AX090N3F40I2SG Vergleich
Detaillierter Direktvergleich von 10AX090N3F40E2LG von Intel und 10AX090N3F40I2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX090N3F40E2LG | 10AX090N3F40I2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.280,00 | $2.250,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 59,234,304 bits | — |
| DSP Blocks | 1,518 | [DATA_NEEDED: DSP block count] |
| User I/O Pins | 600 | — |
| Transceivers | Up to 24 full-duplex channels | [DATA_NEEDED: transceiver count and max data rate] |
| Transceiver Data Rate | Up to 14.4 Gbps | — |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDR IV, RLDRAM 3) | — |
| Maximum DDR4 Rate | 2666 Mbps | — |
| PCIe Hard IP | PCIe Gen3 x8 (root port or endpoint) | — |
| Gehäuse | 1517-ball FCBGA, 40 mm | 1517-BBGA, FCBGA (F40) |
| Process Technology | TSMC 20nm | 20 nm |
| Betriebstemperatur | -40C to +100C (extended industrial) | — |
| Core Voltage | 0.9 V typical | 0.9 V |
| Configuration Encryption | AES-256 bitstream encryption | — |
| Partial Reconfiguration | Supported | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LE) | — | 900,000 |
| Embedded Memory (bits) | — | 59,234,304 |
| Number of LABs/CLBs | — | 339,620 |
| Number of User I/Os | — | 600 |
| Speed Grade | — | N3 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Montageart | — | Surface Mount |
| MSL-Level | — | 3 (168 Hours) |
| Moisture Sensitivity | — | MSL3 |
| Packaging | — | Tray |