10AX090R2F40E2SG vs 10AX090R3F40E2SG Vergleich
Detaillierter Direktvergleich von 10AX090R2F40E2SG von Intel und 10AX090R3F40E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX090R2F40E2SG | 10AX090R3F40E2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.750,00 | $5.400,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | 900,000 |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | -E2 (extended, mid-tier) |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | Extended (-40C to +100C) |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | — |
| DSP Blocks | Variable-precision, hardened floating-point capable | 2,713 (18x19 multipliers) |
| Process Node | TSMC 20nm | — |
| Montageart | Surface Mount (FCBGA ball grid) | Surface Mount (BGA) |
| MSL-Level | 3 (168 Hours) | 3 (168 hours) |
| Packaging | Tray | — |
| Adaptive Logic Modules (ALMs) | — | 339,620 |
| Logic Array Blocks (LABs) | — | 339,620 |
| Embedded Memory (Bits) | — | 59,234,304 |
| User I/O | — | 342 |
| Process Technology | — | 20 nm |
| Core Voltage | — | 0.85 V |
| Auxiliary Voltage | — | 0.9 V |
| Gehäuse | — | 1517-ball FCBGA, F40 (40x40 mm, 1.0 mm pitch) |
| RoHS-Status | — | Compliant |