10AX090R3F40E2SG vs 10AX115R3F40E2SG Vergleich
Detaillierter Direktvergleich von 10AX090R3F40E2SG von Intel und 10AX115R3F40E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX090R3F40E2SG | 10AX115R3F40E2SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.400,00 | $4.925,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | — |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Logic Array Blocks (LABs) | 339,620 | — |
| Embedded Memory (Bits) | 59,234,304 | — |
| DSP Blocks | 2,713 (18x19 multipliers) | 1,518 (variable-precision, hard FP) |
| User I/O | 342 | — |
| Process Technology | 20 nm | TSMC 20 nm |
| Core Voltage | 0.85 V | — |
| Auxiliary Voltage | 0.9 V | — |
| Speed Grade | -E2 (extended, mid-tier) | -2 |
| Temperature Grade | Extended (-40C to +100C) | E2 (0C to +100C) |
| Gehäuse | 1517-ball FCBGA, F40 (40x40 mm, 1.0 mm pitch) | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Montageart | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| MSL-Level | 3 (168 hours) | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory | — | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | — | 2,738 |
| Maximum User I/O | — | 342 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | — | DDR4/DDR3/QDR IV |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Configuration Memory | — | Embedded (no external flash required for typical use) |