10AX090R3F40E2SG vs 10AX115R3F40E2SG Comparación
Comparación detallada lado a lado de 10AX090R3F40E2SG por Intel y 10AX115R3F40E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090R3F40E2SG | 10AX115R3F40E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5.400,00 | $4.925,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | — |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Logic Array Blocks (LABs) | 339,620 | — |
| Embedded Memory (Bits) | 59,234,304 | — |
| DSP Blocks | 2,713 (18x19 multipliers) | 1,518 (variable-precision, hard FP) |
| User I/O | 342 | — |
| Process Technology | 20 nm | TSMC 20 nm |
| Core Voltage | 0.85 V | — |
| Auxiliary Voltage | 0.9 V | — |
| Speed Grade | -E2 (extended, mid-tier) | -2 |
| Temperature Grade | Extended (-40C to +100C) | E2 (0C to +100C) |
| Encapsulado | 1517-ball FCBGA, F40 (40x40 mm, 1.0 mm pitch) | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Nivel MSL | 3 (168 hours) | — |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory | — | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | — | 2,738 |
| Maximum User I/O | — | 342 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | — | DDR4/DDR3/QDR IV |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Configuration Memory | — | Embedded (no external flash required for typical use) |